CN106488695B - 电子部件安装装置及电子部件安装方法 - Google Patents
电子部件安装装置及电子部件安装方法 Download PDFInfo
- Publication number
- CN106488695B CN106488695B CN201610792154.8A CN201610792154A CN106488695B CN 106488695 B CN106488695 B CN 106488695B CN 201610792154 A CN201610792154 A CN 201610792154A CN 106488695 B CN106488695 B CN 106488695B
- Authority
- CN
- China
- Prior art keywords
- electronic component
- mounting head
- mounting
- substrate
- supporting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-173315 | 2015-09-02 | ||
JP2015173315A JP6722419B2 (ja) | 2015-09-02 | 2015-09-02 | 電子部品実装装置及び電子部品実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106488695A CN106488695A (zh) | 2017-03-08 |
CN106488695B true CN106488695B (zh) | 2021-04-20 |
Family
ID=58273562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610792154.8A Active CN106488695B (zh) | 2015-09-02 | 2016-08-31 | 电子部件安装装置及电子部件安装方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6722419B2 (ja) |
CN (1) | CN106488695B (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3790020B2 (ja) * | 1997-08-11 | 2006-06-28 | ヤマハ発動機株式会社 | 表面実装機 |
JP4357643B2 (ja) * | 1999-07-05 | 2009-11-04 | ヤマハ発動機株式会社 | 表面実装機 |
JP3948315B2 (ja) * | 2002-03-01 | 2007-07-25 | 松下電器産業株式会社 | 電子部品実装方法 |
JP4546935B2 (ja) * | 2005-02-14 | 2010-09-22 | パナソニック株式会社 | 部品実装方法、部品実装機およびプログラム |
JP2009170524A (ja) * | 2008-01-11 | 2009-07-30 | Yamaha Motor Co Ltd | 部品の実装方法および表面実装機 |
WO2013031057A1 (ja) * | 2011-08-29 | 2013-03-07 | パナソニック株式会社 | 部品実装装置、ノズル及び部品実装位置補正方法 |
JP6154130B2 (ja) * | 2012-12-25 | 2017-06-28 | Juki株式会社 | 電子部品装着装置及び電子部品装着方法 |
-
2015
- 2015-09-02 JP JP2015173315A patent/JP6722419B2/ja active Active
-
2016
- 2016-08-31 CN CN201610792154.8A patent/CN106488695B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017050431A (ja) | 2017-03-09 |
JP6722419B2 (ja) | 2020-07-15 |
CN106488695A (zh) | 2017-03-08 |
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PB01 | Publication | ||
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GR01 | Patent grant | ||
GR01 | Patent grant |