CN106488695B - 电子部件安装装置及电子部件安装方法 - Google Patents

电子部件安装装置及电子部件安装方法 Download PDF

Info

Publication number
CN106488695B
CN106488695B CN201610792154.8A CN201610792154A CN106488695B CN 106488695 B CN106488695 B CN 106488695B CN 201610792154 A CN201610792154 A CN 201610792154A CN 106488695 B CN106488695 B CN 106488695B
Authority
CN
China
Prior art keywords
electronic component
mounting head
mounting
substrate
supporting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610792154.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN106488695A (zh
Inventor
桥本骏己
真田侑典
樱井茉莉子
野尻信明
藤田高史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Publication of CN106488695A publication Critical patent/CN106488695A/zh
Application granted granted Critical
Publication of CN106488695B publication Critical patent/CN106488695B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/043Feeding one by one by other means than belts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0478Simultaneously mounting of different components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201610792154.8A 2015-09-02 2016-08-31 电子部件安装装置及电子部件安装方法 Active CN106488695B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-173315 2015-09-02
JP2015173315A JP6722419B2 (ja) 2015-09-02 2015-09-02 電子部品実装装置及び電子部品実装方法

Publications (2)

Publication Number Publication Date
CN106488695A CN106488695A (zh) 2017-03-08
CN106488695B true CN106488695B (zh) 2021-04-20

Family

ID=58273562

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610792154.8A Active CN106488695B (zh) 2015-09-02 2016-08-31 电子部件安装装置及电子部件安装方法

Country Status (2)

Country Link
JP (1) JP6722419B2 (ja)
CN (1) CN106488695B (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3790020B2 (ja) * 1997-08-11 2006-06-28 ヤマハ発動機株式会社 表面実装機
JP4357643B2 (ja) * 1999-07-05 2009-11-04 ヤマハ発動機株式会社 表面実装機
JP3948315B2 (ja) * 2002-03-01 2007-07-25 松下電器産業株式会社 電子部品実装方法
JP4546935B2 (ja) * 2005-02-14 2010-09-22 パナソニック株式会社 部品実装方法、部品実装機およびプログラム
JP2009170524A (ja) * 2008-01-11 2009-07-30 Yamaha Motor Co Ltd 部品の実装方法および表面実装機
WO2013031057A1 (ja) * 2011-08-29 2013-03-07 パナソニック株式会社 部品実装装置、ノズル及び部品実装位置補正方法
JP6154130B2 (ja) * 2012-12-25 2017-06-28 Juki株式会社 電子部品装着装置及び電子部品装着方法

Also Published As

Publication number Publication date
JP2017050431A (ja) 2017-03-09
JP6722419B2 (ja) 2020-07-15
CN106488695A (zh) 2017-03-08

Similar Documents

Publication Publication Date Title
JP5103238B2 (ja) 電子部品装着装置
JP4809799B2 (ja) 実装機、その実装方法および実装機における基板撮像手段の移動方法
JPWO2017017718A1 (ja) 部品実装機および部品実装システム
WO2019171481A1 (ja) 部品実装システム
JP2014038946A (ja) 実装装置、部材の配置方法及び基板の製造方法
KR20160018698A (ko) 부품 실장 장치
JP6646916B2 (ja) 基板用の画像処理装置および画像処理方法
CN106488695B (zh) 电子部件安装装置及电子部件安装方法
JP5013816B2 (ja) 表面実装装置
JP5064758B2 (ja) データ作成装置および表面実装機
CN106888568B (zh) 电子部件安装装置
JP4331565B2 (ja) 電子部品実装装置
JP4907493B2 (ja) 実装条件決定方法および実装条件決定装置
WO2017013807A1 (ja) 部品実装機
JP2002094297A (ja) 電子部品実装方法及び電子部品実装装置
JP2022162809A (ja) リード矯正治具及び部品実装装置
JP4421987B2 (ja) 部品実装方法および部品実装装置
JP6655322B2 (ja) 電子部品供給装置及び電子部品実装装置
JP4884032B2 (ja) ノズル種類認識制御方法及び部品搭載装置
JP2017162883A (ja) 電子部品実装装置及び電子部品実装方法
WO2019202678A1 (ja) 部品認識装置、部品実装機および部品認識方法
JP2023168155A (ja) 部品装着装置及び部品装着方法
JP2006228793A (ja) 電子部品装着装置及び電子部品装着方法
JP6415864B2 (ja) 電子部品実装装置、及び電子部品実装方法
KR102230598B1 (ko) 부품 실장 장치

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant