CN106463373B - 保护膜形成用复合片 - Google Patents

保护膜形成用复合片 Download PDF

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Publication number
CN106463373B
CN106463373B CN201580025643.4A CN201580025643A CN106463373B CN 106463373 B CN106463373 B CN 106463373B CN 201580025643 A CN201580025643 A CN 201580025643A CN 106463373 B CN106463373 B CN 106463373B
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China
Prior art keywords
protective film
forming
sheet
base material
composite sheet
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CN201580025643.4A
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English (en)
Chinese (zh)
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CN106463373A (zh
Inventor
佐伯尚哉
山本大辅
米山裕之
稻男洋一
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Lindeko Corp
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Lindeko Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
CN201580025643.4A 2014-05-23 2015-05-18 保护膜形成用复合片 Active CN106463373B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-106757 2014-05-23
JP2014106757 2014-05-23
PCT/JP2015/064202 WO2015178346A1 (fr) 2014-05-23 2015-05-18 Feuille composite pour formation de film de protection

Publications (2)

Publication Number Publication Date
CN106463373A CN106463373A (zh) 2017-02-22
CN106463373B true CN106463373B (zh) 2020-01-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580025643.4A Active CN106463373B (zh) 2014-05-23 2015-05-18 保护膜形成用复合片

Country Status (7)

Country Link
JP (1) JP6319433B2 (fr)
KR (1) KR102378063B1 (fr)
CN (1) CN106463373B (fr)
PH (1) PH12016502286A1 (fr)
SG (1) SG11201609543VA (fr)
TW (2) TWI675900B (fr)
WO (1) WO2015178346A1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6319433B2 (ja) * 2014-05-23 2018-05-09 リンテック株式会社 保護膜形成用複合シート
JP6893498B2 (ja) * 2016-02-22 2021-06-23 リンテック株式会社 保護膜形成用シート、保護膜形成用シートの製造方法及び半導体装置の製造方法
CN108541338A (zh) * 2016-03-02 2018-09-14 古河电气工业株式会社 晶片加工用带
WO2017149926A1 (fr) * 2016-03-04 2017-09-08 リンテック株式会社 Feuille de traitement de semi-conducteur
CN108966671B (zh) * 2016-03-24 2023-09-26 琳得科株式会社 支撑片及保护膜形成用复合片
TWI721158B (zh) * 2016-04-28 2021-03-11 日商琳得科股份有限公司 保護膜形成用膜及保護膜形成用複合片
TWI722170B (zh) * 2016-04-28 2021-03-21 日商琳得科股份有限公司 保護膜形成用膜以及保護膜形成用複合片
TWI778960B (zh) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 保護膜形成用膜、保護膜形成用複合片、以及附有保護膜的半導體晶片之製造方法
JP6935807B2 (ja) * 2017-02-02 2021-09-15 昭和電工マテリアルズ株式会社 電子部品の製造方法、仮保護用樹脂組成物及び仮保護用樹脂フィルム
CN109789666B (zh) * 2017-03-30 2024-06-04 琳得科株式会社 保护膜形成用复合片
JP6298226B1 (ja) * 2017-03-30 2018-03-20 リンテック株式会社 保護膜形成用複合シート
JP2019079961A (ja) * 2017-10-25 2019-05-23 リンテック株式会社 半導体加工用シート
JP7325403B2 (ja) * 2018-04-18 2023-08-14 リンテック株式会社 ワーク加工用シート
CN114830300A (zh) 2019-12-23 2022-07-29 昭和电工材料株式会社 切割晶粒接合一体型膜及其品质管理方法以及半导体装置的制造方法
JP2022157810A (ja) 2021-03-31 2022-10-14 リンテック株式会社 支持シート、樹脂膜形成用複合シート、キット、及び、樹脂膜付きチップの製造方法
JP2023144842A (ja) 2022-03-28 2023-10-11 リンテック株式会社 樹脂膜形成用複合シート、キット、及び、樹脂膜付きワーク加工物の製造方法
JP2024142714A (ja) 2023-03-30 2024-10-11 リンテック株式会社 樹脂膜形成用複合シート、キット、及び、樹脂膜付きワーク加工物の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102241951A (zh) * 2010-05-12 2011-11-16 日东电工株式会社 表面保护膜
JP2012015236A (ja) * 2010-06-30 2012-01-19 Furukawa Electric Co Ltd:The ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法
CN102373019A (zh) * 2010-07-29 2012-03-14 日东电工株式会社 半导体背面用切割带集成膜及用于生产半导体器件的方法
WO2012172959A1 (fr) * 2011-06-14 2012-12-20 電気化学工業株式会社 Feuille adhésive et procédé pour la fabrication d'un composant électronique
CN102933672A (zh) * 2010-03-01 2013-02-13 3M创新有限公司 用于保护粗糙表面的半透明膜
CN103797567A (zh) * 2011-09-30 2014-05-14 琳得科株式会社 具有保护膜形成层的切割膜片和芯片的制造方法

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JPS58149048A (ja) * 1982-03-02 1983-09-05 Sony Corp 昇華性染料の転写によるカラーハードコピー印画紙の形成方法
ATE362653T1 (de) 2002-03-12 2007-06-15 Hamamatsu Photonics Kk Methode zur trennung von substraten
JP4128058B2 (ja) * 2002-09-24 2008-07-30 三井化学株式会社 粘着フィルム及びその使用方法
JP5165829B2 (ja) * 2004-02-26 2013-03-21 日東電工株式会社 ロール状ウエハ加工用粘着シート
JP4642436B2 (ja) * 2004-11-12 2011-03-02 リンテック株式会社 マーキング方法および保護膜形成兼ダイシング用シート
JP2007109808A (ja) * 2005-10-12 2007-04-26 Furukawa Electric Co Ltd:The 半導体ウエハダイシング−ダイボンド用粘接着テープ
JP4762671B2 (ja) 2005-10-26 2011-08-31 古河電気工業株式会社 ダイシングテープ、および半導体ウェハダイシング方法
JP2011040449A (ja) * 2009-08-07 2011-02-24 Du Pont Mitsui Polychem Co Ltd ダイシングテープ用基材、ダイシングテープ、半導体装置の製造方法
JP5603757B2 (ja) * 2009-12-04 2014-10-08 リンテック株式会社 レーザーダイシング用粘着シート及び半導体装置の製造方法
JP2011151362A (ja) 2009-12-24 2011-08-04 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム
KR20120112846A (ko) * 2010-02-02 2012-10-11 미쓰이 가가쿠 토세로 가부시키가이샤 표면 보호 필름
JP5583725B2 (ja) * 2012-09-20 2014-09-03 リンテック株式会社 レーザーダイシングシート−剥離シート積層体、レーザーダイシングシートおよびチップ体の製造方法
JP6319433B2 (ja) * 2014-05-23 2018-05-09 リンテック株式会社 保護膜形成用複合シート

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102933672A (zh) * 2010-03-01 2013-02-13 3M创新有限公司 用于保护粗糙表面的半透明膜
CN102241951A (zh) * 2010-05-12 2011-11-16 日东电工株式会社 表面保护膜
JP2012015236A (ja) * 2010-06-30 2012-01-19 Furukawa Electric Co Ltd:The ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法
CN102373019A (zh) * 2010-07-29 2012-03-14 日东电工株式会社 半导体背面用切割带集成膜及用于生产半导体器件的方法
WO2012172959A1 (fr) * 2011-06-14 2012-12-20 電気化学工業株式会社 Feuille adhésive et procédé pour la fabrication d'un composant électronique
CN103797567A (zh) * 2011-09-30 2014-05-14 琳得科株式会社 具有保护膜形成层的切割膜片和芯片的制造方法

Also Published As

Publication number Publication date
PH12016502286A1 (en) 2017-02-13
TW201940624A (zh) 2019-10-16
KR20170008749A (ko) 2017-01-24
CN106463373A (zh) 2017-02-22
TW201602303A (zh) 2016-01-16
SG11201609543VA (en) 2016-12-29
TWI675900B (zh) 2019-11-01
TWI741336B (zh) 2021-10-01
WO2015178346A1 (fr) 2015-11-26
KR102378063B1 (ko) 2022-03-23
JPWO2015178346A1 (ja) 2017-04-20
JP6319433B2 (ja) 2018-05-09

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