CN106460160B - W-Ti溅射靶 - Google Patents

W-Ti溅射靶 Download PDF

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Publication number
CN106460160B
CN106460160B CN201580021546.8A CN201580021546A CN106460160B CN 106460160 B CN106460160 B CN 106460160B CN 201580021546 A CN201580021546 A CN 201580021546A CN 106460160 B CN106460160 B CN 106460160B
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CN
China
Prior art keywords
concentration
powder
mass
sputtering targets
max
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580021546.8A
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English (en)
Chinese (zh)
Other versions
CN106460160A (zh
Inventor
野中庄平
斋藤淳
大友健志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of CN106460160A publication Critical patent/CN106460160A/zh
Application granted granted Critical
Publication of CN106460160B publication Critical patent/CN106460160B/zh
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/14Both compacting and sintering simultaneously
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C27/00Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04Alloys based on tungsten or molybdenum
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
CN201580021546.8A 2014-10-08 2015-09-30 W-Ti溅射靶 Active CN106460160B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-207343 2014-10-08
JP2014207343A JP5999161B2 (ja) 2014-10-08 2014-10-08 W−Tiスパッタリングターゲット
PCT/JP2015/077729 WO2016056441A1 (fr) 2014-10-08 2015-09-30 Cible de pulvérisation en w-ti

Publications (2)

Publication Number Publication Date
CN106460160A CN106460160A (zh) 2017-02-22
CN106460160B true CN106460160B (zh) 2018-08-17

Family

ID=55653056

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580021546.8A Active CN106460160B (zh) 2014-10-08 2015-09-30 W-Ti溅射靶

Country Status (5)

Country Link
JP (1) JP5999161B2 (fr)
KR (1) KR20160133571A (fr)
CN (1) CN106460160B (fr)
TW (1) TWI572722B (fr)
WO (1) WO2016056441A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6743867B2 (ja) * 2018-11-06 2020-08-19 三菱マテリアル株式会社 W−Tiスパッタリングターゲット
CN111155061A (zh) * 2018-11-07 2020-05-15 宁波江丰电子材料股份有限公司 WTi合金靶材的制备方法
CN112111713B (zh) * 2020-09-11 2022-09-30 宁波江丰电子材料股份有限公司 一种WTi合金溅射靶材的制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2606946B2 (ja) * 1990-03-13 1997-05-07 日立金属株式会社 Ti‐Wターゲット材およびその製造方法
JPH05295531A (ja) * 1992-04-21 1993-11-09 Toshiba Corp Ti−W系スパッタリングターゲットおよびその製造方法
JP4747368B2 (ja) * 2007-03-05 2011-08-17 三菱マテリアル株式会社 W−Ti拡散防止膜を形成するためのスパッタリング用W−Tiターゲット
JP5156591B2 (ja) * 2008-11-17 2013-03-06 出光興産株式会社 有機エレクトロルミネッセンス素子
JP2011058078A (ja) * 2009-09-14 2011-03-24 Toshiba Corp スパッタリングターゲットとそれを用いたTa−W合金膜および液晶表示装置
US20140360871A1 (en) * 2012-05-22 2014-12-11 Jx Nippon Mining & Metals Corporation Fe-Pt-Ag-C-Based Sputtering Target Having C Grains Dispersed Therein, and Method for Producing Same
WO2014148588A1 (fr) * 2013-03-22 2014-09-25 Jx日鉱日石金属株式会社 Cible de pulvérisation à corps de tungstène fritté et son procédé de fabrication

Also Published As

Publication number Publication date
JP2016074962A (ja) 2016-05-12
JP5999161B2 (ja) 2016-09-28
KR20160133571A (ko) 2016-11-22
TWI572722B (zh) 2017-03-01
TW201619405A (zh) 2016-06-01
CN106460160A (zh) 2017-02-22
WO2016056441A1 (fr) 2016-04-14

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