CN106413251B - 电路板及其制造方法、应用该电路板的电子装置 - Google Patents
电路板及其制造方法、应用该电路板的电子装置 Download PDFInfo
- Publication number
- CN106413251B CN106413251B CN201510462416.XA CN201510462416A CN106413251B CN 106413251 B CN106413251 B CN 106413251B CN 201510462416 A CN201510462416 A CN 201510462416A CN 106413251 B CN106413251 B CN 106413251B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- golden finger
- copper
- grid
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
电路板 | 200 |
金手指 | 100 |
基材 | 10 |
第一表面 | 11 |
第二表面 | 12 |
空白区 | 121 |
金手指端 | 13 |
电路端 | 14 |
第一铜层 | 20 |
第二铜层 | 30 |
金属网格 | 40 |
网格线 | 401 |
第一网格区 | 41 |
第二网格区 | 42 |
第三网格区 | 43 |
第一覆盖膜 | 50 |
第一胶合层 | 51 |
第一覆盖层 | 52 |
导电线路 | 60 |
第二覆盖膜 | 70 |
第二胶合层 | 71 |
第二覆盖层 | 72 |
覆铜板 | 300 |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510462416.XA CN106413251B (zh) | 2015-07-31 | 2015-07-31 | 电路板及其制造方法、应用该电路板的电子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510462416.XA CN106413251B (zh) | 2015-07-31 | 2015-07-31 | 电路板及其制造方法、应用该电路板的电子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106413251A CN106413251A (zh) | 2017-02-15 |
CN106413251B true CN106413251B (zh) | 2019-01-25 |
Family
ID=58007869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510462416.XA Active CN106413251B (zh) | 2015-07-31 | 2015-07-31 | 电路板及其制造方法、应用该电路板的电子装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106413251B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102131342A (zh) * | 2011-03-01 | 2011-07-20 | 昆山龙腾光电有限公司 | 印刷电路板及液晶显示装置 |
CN202335068U (zh) * | 2011-11-11 | 2012-07-11 | 厦门爱谱生电子科技有限公司 | 一种带有镂空手指的双面柔性电路板 |
CN103635036A (zh) * | 2012-08-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | 柔性多层电路板及其制作方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3993211B2 (ja) * | 2005-11-18 | 2007-10-17 | シャープ株式会社 | 多層プリント配線板およびその製造方法 |
-
2015
- 2015-07-31 CN CN201510462416.XA patent/CN106413251B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102131342A (zh) * | 2011-03-01 | 2011-07-20 | 昆山龙腾光电有限公司 | 印刷电路板及液晶显示装置 |
CN202335068U (zh) * | 2011-11-11 | 2012-07-11 | 厦门爱谱生电子科技有限公司 | 一种带有镂空手指的双面柔性电路板 |
CN103635036A (zh) * | 2012-08-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | 柔性多层电路板及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106413251A (zh) | 2017-02-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170302 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518105 Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
|
GR01 | Patent grant | ||
GR01 | Patent grant |