CN106373928B - 一种中空式集成电路封装 - Google Patents
一种中空式集成电路封装 Download PDFInfo
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- CN106373928B CN106373928B CN201610865201.7A CN201610865201A CN106373928B CN 106373928 B CN106373928 B CN 106373928B CN 201610865201 A CN201610865201 A CN 201610865201A CN 106373928 B CN106373928 B CN 106373928B
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CN106373928B true CN106373928B (zh) | 2018-11-23 |
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CN108807231B (zh) * | 2018-06-13 | 2021-02-26 | 常州信息职业技术学院 | 一种散热型集成电路的封装装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011214532A (ja) * | 2010-03-31 | 2011-10-27 | Honda Motor Co Ltd | 副室付き内燃機関 |
CN104244627A (zh) * | 2014-09-23 | 2014-12-24 | 中国北方车辆研究所 | 一种板卡封装机构 |
CN204118051U (zh) * | 2014-12-10 | 2015-01-21 | 何帅 | 一种用于传感器封装键合的夹具 |
CN205336722U (zh) * | 2016-01-15 | 2016-06-22 | 昆明新雷电子科技有限公司 | 一种可使电源模块增加热容的装置 |
CN105932003A (zh) * | 2016-06-20 | 2016-09-07 | 东莞市联洲知识产权运营管理有限公司 | 一种便封装的集成电路 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011214532A (ja) * | 2010-03-31 | 2011-10-27 | Honda Motor Co Ltd | 副室付き内燃機関 |
CN104244627A (zh) * | 2014-09-23 | 2014-12-24 | 中国北方车辆研究所 | 一种板卡封装机构 |
CN204118051U (zh) * | 2014-12-10 | 2015-01-21 | 何帅 | 一种用于传感器封装键合的夹具 |
CN205336722U (zh) * | 2016-01-15 | 2016-06-22 | 昆明新雷电子科技有限公司 | 一种可使电源模块增加热容的装置 |
CN105932003A (zh) * | 2016-06-20 | 2016-09-07 | 东莞市联洲知识产权运营管理有限公司 | 一种便封装的集成电路 |
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Effective date of registration: 20181010 Address after: 402660 Chongqing Tongnan Industrial Park Phase 1, standard building 6, 1, 2 storey, 3 storey, 1/4 floor, building No. 5. Applicant after: CHONGQING ANYIDA ELECTRONICS Co.,Ltd. Address before: 523000 productivity building 406, high tech Industrial Development Zone, Songshan Lake, Dongguan, Guangdong Applicant before: Dongguan Lianzhou Intellectual Property Operation Management Co.,Ltd. |
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Address after: 402660 No.1 and No.2 buildings of phase III standard workshop of Zitong Street Industrial Park, Tongnan District, Chongqing Patentee after: Chongqing Guanyang Technology Co.,Ltd. Address before: 402660 Chongqing Tongnan Industrial Park Phase 1, standard building 6, 1, 2 storey, 3 storey, 1/4 floor, building No. 5. Patentee before: CHONGQING ANYIDA ELECTRONICS Co.,Ltd. |
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