CN105932003A - 一种便封装的集成电路 - Google Patents
一种便封装的集成电路 Download PDFInfo
- Publication number
- CN105932003A CN105932003A CN201610455263.0A CN201610455263A CN105932003A CN 105932003 A CN105932003 A CN 105932003A CN 201610455263 A CN201610455263 A CN 201610455263A CN 105932003 A CN105932003 A CN 105932003A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610455263.0A CN105932003B (zh) | 2016-06-20 | 2016-06-20 | 一种方便封装的集成电路 |
Applications Claiming Priority (1)
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CN201610455263.0A CN105932003B (zh) | 2016-06-20 | 2016-06-20 | 一种方便封装的集成电路 |
Publications (2)
Publication Number | Publication Date |
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CN105932003A true CN105932003A (zh) | 2016-09-07 |
CN105932003B CN105932003B (zh) | 2018-04-24 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610455263.0A Active CN105932003B (zh) | 2016-06-20 | 2016-06-20 | 一种方便封装的集成电路 |
Country Status (1)
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CN (1) | CN105932003B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106373928A (zh) * | 2016-09-25 | 2017-02-01 | 东莞市联洲知识产权运营管理有限公司 | 一种中空式集成电路封装 |
CN107572474A (zh) * | 2017-08-22 | 2018-01-12 | 华中科技大学 | 一种封装间距可高精度控制的mems封装结构及封装方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0410458A (ja) * | 1990-04-26 | 1992-01-14 | Hitachi Ltd | 半導体集積回路装置の製造方法および製造装置 |
EP0651440A1 (en) * | 1993-10-29 | 1995-05-03 | STMicroelectronics S.r.l. | High reliable power package for an electronic semiconductor circuit |
CN101320938A (zh) * | 2008-07-15 | 2008-12-10 | 南京银茂微电子制造有限公司 | 一种多用途功率模块 |
CN201549746U (zh) * | 2009-10-27 | 2010-08-11 | 黄朝琮 | 一种芯片安装装置 |
CN202043255U (zh) * | 2011-04-06 | 2011-11-16 | 深圳创维数字技术股份有限公司 | 一种机顶盒 |
CN202713891U (zh) * | 2012-07-26 | 2013-01-30 | 成都锐奕信息技术有限公司 | 带屏蔽框和开有减胶槽的卡片式无线定位终端壳体结构 |
CN204517632U (zh) * | 2015-03-19 | 2015-07-29 | 华南理工大学 | 一种多组电极平铺式电流体动力微泵 |
-
2016
- 2016-06-20 CN CN201610455263.0A patent/CN105932003B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0410458A (ja) * | 1990-04-26 | 1992-01-14 | Hitachi Ltd | 半導体集積回路装置の製造方法および製造装置 |
EP0651440A1 (en) * | 1993-10-29 | 1995-05-03 | STMicroelectronics S.r.l. | High reliable power package for an electronic semiconductor circuit |
CN101320938A (zh) * | 2008-07-15 | 2008-12-10 | 南京银茂微电子制造有限公司 | 一种多用途功率模块 |
CN201549746U (zh) * | 2009-10-27 | 2010-08-11 | 黄朝琮 | 一种芯片安装装置 |
CN202043255U (zh) * | 2011-04-06 | 2011-11-16 | 深圳创维数字技术股份有限公司 | 一种机顶盒 |
CN202713891U (zh) * | 2012-07-26 | 2013-01-30 | 成都锐奕信息技术有限公司 | 带屏蔽框和开有减胶槽的卡片式无线定位终端壳体结构 |
CN204517632U (zh) * | 2015-03-19 | 2015-07-29 | 华南理工大学 | 一种多组电极平铺式电流体动力微泵 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106373928A (zh) * | 2016-09-25 | 2017-02-01 | 东莞市联洲知识产权运营管理有限公司 | 一种中空式集成电路封装 |
CN106373928B (zh) * | 2016-09-25 | 2018-11-23 | 重庆安亿达电子有限公司 | 一种中空式集成电路封装 |
CN107572474A (zh) * | 2017-08-22 | 2018-01-12 | 华中科技大学 | 一种封装间距可高精度控制的mems封装结构及封装方法 |
CN107572474B (zh) * | 2017-08-22 | 2019-04-12 | 华中科技大学 | 一种封装间距可高精度控制的mems封装结构的封装方法 |
Also Published As
Publication number | Publication date |
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CN105932003B (zh) | 2018-04-24 |
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C06 | Publication | ||
PB01 | Publication | ||
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CB03 | Change of inventor or designer information |
Inventor after: Zhao Liwu Inventor after: Zhang Xianghua Inventor before: Wang Wenqing |
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CB03 | Change of inventor or designer information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180321 Address after: 523878 Building No. 9, building A, building No. 9, Xingxi Road, Changan Town, Dongguan, Guangdong Applicant after: Dongguan Xuan Hua Electronics Co., Ltd. Address before: 523000 Guangdong province Dongguan City Songshan Lake high tech Industrial Zone Building 406 industrial development productivity Applicant before: Dongguan Lianzhou Intellectual Property Operation Management Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
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CP02 | Change in the address of a patent holder |
Address after: 523925, two floor and third floor, A tower, 39-1 East Tower Phoenix Road, North Gate community, Humen Town, Dongguan, Guangdong. Patentee after: Dongguan Xuan Hua Electronics Co., Ltd. Address before: 523878 four building, 9 building, No. 9, Shanghai Xingxi Road, Changan Town, Dongguan, Guangdong. Patentee before: Dongguan Xuan Hua Electronics Co., Ltd. |
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CP02 | Change in the address of a patent holder |