CN106373928A - 一种中空式集成电路封装 - Google Patents
一种中空式集成电路封装 Download PDFInfo
- Publication number
- CN106373928A CN106373928A CN201610865201.7A CN201610865201A CN106373928A CN 106373928 A CN106373928 A CN 106373928A CN 201610865201 A CN201610865201 A CN 201610865201A CN 106373928 A CN106373928 A CN 106373928A
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- CN
- China
- Prior art keywords
- antenna package
- integrated antenna
- base unit
- integrated circuit
- packaging system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Details Of Aerials (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610865201.7A CN106373928B (zh) | 2016-09-25 | 2016-09-25 | 一种中空式集成电路封装 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610865201.7A CN106373928B (zh) | 2016-09-25 | 2016-09-25 | 一种中空式集成电路封装 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106373928A true CN106373928A (zh) | 2017-02-01 |
CN106373928B CN106373928B (zh) | 2018-11-23 |
Family
ID=57897748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610865201.7A Active CN106373928B (zh) | 2016-09-25 | 2016-09-25 | 一种中空式集成电路封装 |
Country Status (1)
Country | Link |
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CN (1) | CN106373928B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108807231A (zh) * | 2018-06-13 | 2018-11-13 | 常州信息职业技术学院 | 一种散热型集成电路的封装装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011214532A (ja) * | 2010-03-31 | 2011-10-27 | Honda Motor Co Ltd | 副室付き内燃機関 |
CN104244627A (zh) * | 2014-09-23 | 2014-12-24 | 中国北方车辆研究所 | 一种板卡封装机构 |
CN204118051U (zh) * | 2014-12-10 | 2015-01-21 | 何帅 | 一种用于传感器封装键合的夹具 |
CN205336722U (zh) * | 2016-01-15 | 2016-06-22 | 昆明新雷电子科技有限公司 | 一种可使电源模块增加热容的装置 |
CN105932003A (zh) * | 2016-06-20 | 2016-09-07 | 东莞市联洲知识产权运营管理有限公司 | 一种便封装的集成电路 |
-
2016
- 2016-09-25 CN CN201610865201.7A patent/CN106373928B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011214532A (ja) * | 2010-03-31 | 2011-10-27 | Honda Motor Co Ltd | 副室付き内燃機関 |
CN104244627A (zh) * | 2014-09-23 | 2014-12-24 | 中国北方车辆研究所 | 一种板卡封装机构 |
CN204118051U (zh) * | 2014-12-10 | 2015-01-21 | 何帅 | 一种用于传感器封装键合的夹具 |
CN205336722U (zh) * | 2016-01-15 | 2016-06-22 | 昆明新雷电子科技有限公司 | 一种可使电源模块增加热容的装置 |
CN105932003A (zh) * | 2016-06-20 | 2016-09-07 | 东莞市联洲知识产权运营管理有限公司 | 一种便封装的集成电路 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108807231A (zh) * | 2018-06-13 | 2018-11-13 | 常州信息职业技术学院 | 一种散热型集成电路的封装装置 |
Also Published As
Publication number | Publication date |
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CN106373928B (zh) | 2018-11-23 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20181010 Address after: 402660 Chongqing Tongnan Industrial Park Phase 1, standard building 6, 1, 2 storey, 3 storey, 1/4 floor, building No. 5. Applicant after: CHONGQING ANYIDA ELECTRONICS Co.,Ltd. Address before: 523000 productivity building 406, high tech Industrial Development Zone, Songshan Lake, Dongguan, Guangdong Applicant before: Dongguan Lianzhou Intellectual Property Operation Management Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 402660 No.1 and No.2 buildings of phase III standard workshop of Zitong Street Industrial Park, Tongnan District, Chongqing Patentee after: Chongqing Guanyang Technology Co.,Ltd. Address before: 402660 Chongqing Tongnan Industrial Park Phase 1, standard building 6, 1, 2 storey, 3 storey, 1/4 floor, building No. 5. Patentee before: CHONGQING ANYIDA ELECTRONICS Co.,Ltd. |