CN106233456A - 电子元件安装用基板以及电子装置 - Google Patents
电子元件安装用基板以及电子装置 Download PDFInfo
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- CN106233456A CN106233456A CN201580020428.5A CN201580020428A CN106233456A CN 106233456 A CN106233456 A CN 106233456A CN 201580020428 A CN201580020428 A CN 201580020428A CN 106233456 A CN106233456 A CN 106233456A
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- circuit board
- electronic component
- metallic plate
- component mounting
- mounting substrate
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Classifications
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H01L23/49531—Additional leads the additional leads being a wiring board
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- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H01L23/49541—Geometry of the lead-frame
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/481—Disposition
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- H01L2224/48106—Connecting bonding areas at different heights the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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Abstract
本发明提供一种能够抑制在与金属板的周边部重合的第1布线基板产生裂缝或者破裂,并且即使连接第2布线基板也能够实现整体的轻薄化的电子元件安装用基板。电子元件安装用基板(1)具有:框状的第1布线基板(2),其将内侧部分设为第1贯通孔(2a),在下表面具有外部电路连接用电极(9);金属板(4),其被设置于第1布线基板(2)的下表面以使得覆盖第1贯通孔(2a)的开口,外缘位于第1布线基板(2)的外缘与第1布线基板(2)的内缘之间,在上表面的由第1布线基板(2)围起的区域具有电子元件安装部(11);和第2布线基板(6),其被设置于第1布线基板(2)的下表面之中金属板(4)的周围区域(5),与外部电路连接用电极(9)电连接。
Description
技术领域
本发明涉及搭载有电子元件、例如CCD(Charge Coupled Device,电荷耦合元件)型或者CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体)型等摄像元件、LED(Light Emitting Diode,发光二极管)等发光元件等电子部件的电子元件安装用基板以及电子装置。
背景技术
以往,已知将电子元件安装于电子元件安装用基板的电子装置。作为被用于这种电子装置的电子元件安装用基板,具有:第1布线基板;与第1布线基板的下表面接合的金属板;和被设置于第1布线基板的上表面的电子元件连接用焊盘。电子装置是在电子元件安装用基板安装电子元件并在电子元件安装用基板的上表面设置盖体等而成的。这样的电子装置在由金属板的上表面和第1布线基板的内侧面形成的凹部安装电子元件,在设置于第1布线基板的上表面等表面的外部电路连接用电极电连接外部电路等(参照日本特开2006-303400号公报)。
一般地,在由绝缘层构成的第1布线基板与金属板之间热膨胀率存在差,金属板与第1布线基板相比,热膨胀率较大。因此,若在构成电子元件安装用基板的第1布线基板的下表面设置金属板并在金属板的上表面安装电子元件,则由于电子元件的工作时产生的热导致在第1布线基板与金属板之间产生热应力。该热应力可能集中于将第1布线基板与金属板粘接的粘接部件并产生裂缝或者剥离。因此,考虑缩小金属板与第1布线基板的接合面积。因此,已知在俯视透视下金属板的周边部位于第1布线基板的周边部的内侧的电子元件安装用基板。
一般地,在将透镜壳体等部件、盖体或电子部件等安装于第1布线基板的上表面的工序、或者在第1布线基板的上表面进行引线接合的工序中,从第1布线基板的上表面向下表面的方向施加力。但是,若是上述构成的电子元件安装用基板,则在第1布线基板与金属板不重合的区域,没有支承的物体,只有金属板的厚度程度的空间。因此,由于从第1布线基板的上表面向下表面施加力,导致在第1布线基板产生以金属板的周边部为起点的弯曲应力,担心在第1布线基板产生裂缝或者破裂等。此外,对于第1布线基板存在轻薄化的要求。由于该轻薄化,更加担心在第1布线基板产生裂缝或者破裂等。
本发明的目的在于,提供一种能够抑制在俯视透视下与金属板的周边部重合的第1布线基板产生裂缝或者破裂,并且即使连接第2布线基板也能够实现整体的轻薄化的电子元件安装用基板、使用了该电子元件安装用基板的电子装置。
发明内容
本发明的一个方式所涉及的电子元件安装用基板具有框状的第1布线基板,其将内侧部分设为第1贯通孔,在下表面具有外部电路连接用电极。此外,具有板状的金属板,其被设置于该第1布线基板的下表面以使得覆盖所述第1贯通孔的开口,外缘位于所述第1布线基板的外缘与所述第1布线基板的内缘之间,在上表面的由所述第1布线基板围起的区域具有电子元件安装部。进一步地,具有第2布线基板,其被设置于所述第1布线基板的下表面之中所述金属板的周围区域,与所述外部电路连接用电极电连接。
本发明的一个方式所涉及的电子装置具有:所述电子元件安装用基板;和被安装于所述金属板的所述电子元件安装部的电子元件。
附图说明
图1(a)是表示本发明的第1实施方式所涉及的电子元件安装用基板以及电子装置的外观的俯视图,(b)是与(a)的A-A线对应的纵剖视图。
图2(a)是表示本发明的第1实施方式的另一方式所涉及的电子元件安装用基板以及电子装置的外观的俯视图,(b)是与(a)的A-A线对应的纵剖视图。
图3(a)是图1所示的第1实施方式所涉及的电子元件安装用基板的俯视图,(b)是图2所示的第1实施方式的另一方式所涉及的电子元件安装用基板的俯视图。
图4(a)是表示本发明的第2实施方式所涉及的电子元件安装用基板以及电子装置的外观的俯视图,(b)是与(a)的A-A线对应的纵剖视图。
图5(a)是表示本发明的第3实施方式所涉及的电子元件安装用基板以及电子装置的外观的俯视图,(b)是与(a)的A-A线对应的纵剖视图。
图6(a)是表示本发明的第4实施方式所涉及的电子元件安装用基板以及具有电子装置的电子模块的外观的俯视图,(b)是(a)的俯视图。
图7(a)是表示本发明的第5实施方式所涉及的电子元件安装用基板以及电子装置的外观的俯视图,(b)是与(a)的A-A线对应的纵剖视图。
具体实施方式
以下,参照附图来对本发明的几个示例性的实施方式进行说明。另外,在以下的说明中,将在电子元件安装用基板安装电子元件并且电子元件安装用基板的上表面与盖体接合的构成设为电子装置。电子元件安装用基板以及电子装置可以将任意方向设为上方或下方,但为了方便,定义了正交坐标系xyz并且将z方向的正侧设为上方,使用上表面或下表面的用语。
(第1实施方式)
参照图1~图3,对本发明的第1实施方式中的电子装置21以及电子元件安装用基板1进行说明。本实施方式中的电子装置21具备电子元件安装用基板1和电子元件10。
在图1~图3所示的例子中,电子元件安装用基板1具备:将内侧部分设为第1贯通孔2a并在下表面具有外部电路连接用电极9的框状的第1布线基板2;被设置于第1布线基板2的下表面使得覆盖第1贯通孔2a的开口的、外缘位于第1布线基板2的外缘与第1布线基板2的内缘之间且在上表面的被第1布线基板2围起的区域具有电子元件安装部11的框状的金属板4;和被设置于第1布线基板2的下表面之中金属板4的周围区域5且与外部电路连接用电极9电连接的第2布线基板6。
在图1~图3所示的例子中,第1布线基板2具有第1贯通孔2a,在下表面具有外部电路连接用电极9。此外,如图1、图2所示的例子那样,在第1布线基板2的上表面设置有电子元件连接用焊盘3。此外,在第1布线基板2的下表面设置有外部电路连接用电极9。
第1布线基板2是在绝缘基板形成后述的布线导体而成的。该绝缘基板的材料例如能够使用电绝缘性陶瓷或者树脂等。
作为被用作为第1布线基板2的绝缘基板的材料的电绝缘性陶瓷,例如举例有:氧化铝质烧结体、莫来石质烧结体、碳化硅质烧结体、氮化铝质烧结体、氮化硅质烧结体或者玻璃陶瓷烧结体等。
作为被用作为第1布线基板2的绝缘基板的材料的树脂,例如举例有:环氧树脂、聚酰亚胺树脂、丙烯酸树脂、酚醛树脂或者氟类树脂等。作为氟类树脂,例如举例有:聚酯树脂或者四氟化乙烯树脂。
如图1、图2所示的例子那样,第1布线基板2是将由所述材料构成的绝缘层分别上下层叠多个而形成的。
第1布线基板2可以如图1、图2所示的例子那样,由2层绝缘层形成,也可以由单层或者3层以上的绝缘层形成。在图1、图2所示的例子中,第1布线基板2由2层绝缘层形成。
可以在第1布线基板2的内部设置由使各绝缘层间导通的贯通导体和内部布线构成的布线导体,也可以第1布线基板2具有在表面露出的布线导体。此外,也可以通过该布线导体,外部电路连接用电极9与电子元件连接用焊盘3电连接。此外,也可以被设置于形成第1布线基板2的各个框体的内部的各个布线导体通过在各个框体的表面露出的布线导体等分别电连接。
此外,第1布线基板2也可以在上表面或侧面也设置外部电路连接用电极9。外部电路连接用电极9例如是为了将电子装置21与后述的第2布线基板6或者外部装置等电连接而设置的。
在第1布线基板2由电绝缘性陶瓷构成的情况下,电子元件连接用焊盘3、外部电路连接用电极9以及布线导体由钨(W)、钼(Mo)、锰(Mn)、银(Ag)或铜(Cu)、或者含有从这些选择的至少1种以上的金属材料的合金等构成。此外,在第1布线基板2由树脂构成的情况下,电子元件连接用焊盘3、外部电路连接用电极9以及布线导体由铜(Cu)、金(Au)、铝(Al)、镍(Ni)、铬(Cr)、钼(Mo)或钛(Ti)或者含有从这些选择的至少1种以上的金属材料的合金等构成。
优选在电子元件连接用焊盘3、外部电路连接用电极9以及布线导体的露出的表面设置镀层。根据该构成,能够保护电子元件连接用焊盘3、外部电路连接用电极9以及布线导体的露出表面并防止氧化。此外,根据该构成,能够使经由电子元件连接用焊盘3与电子元件10的引线接合等的电连接良好,或者能够将外部电路连接用电极9与设置于第2布线基板6的表面的电极良好地电连接。镀层例如覆盖厚度0.5~10μm的Ni镀层。或者,也可以在该Ni镀层上覆盖厚度0.5~3μm的金(Au)镀层。
在图1~图3所示的例子中,金属板4被设置于第1布线基板2的下表面以使得覆盖第1贯通孔2a的开口,在上表面的中央部具有电子元件安装部11。
在图1~图3所示的例子中,电子元件10被安装于电子元件安装部11,该电子元件10被收纳于由第1布线基板2的第1贯通孔2a的内侧面和金属板4的上表面形成的凹部。
在图1~图3所示的例子中,金属板4的外周边在俯视下比第1布线基板2的外周边更位于内侧。由此,能够减小金属板4与第1布线基板2的接合面积。因此,在电子元件10发热、金属板4与第1布线基板2的热膨胀产生差的情况下,能够减少施加到第1布线基板2与金属板4之间的应力。
在图1、图2所示的例子中,金属板4的上表面的外周部通过由钎料、热固化性树脂或者低熔点玻璃等构成的接合材料15来与第1布线基板2的下表面接合。作为热固化性树脂,例如能够使用双酚A型液状环氧树脂等。作为接合材料15,通过使用不会由于电子元件10的安装时或者工作时的热量导致改性的材料,能够良好地抑制电子元件10的安装时或者工作时第1布线基板2与金属板4剥离,因此优选。另外,优选接合材料15被连续设置为环状。由此,接合材料15被设置在金属板4的整周上,因此能够更良好地保持由金属板4、第1布线基板2和盖体12围起的区域的气密性。
如图1~图3所示的例子那样,第2布线基板6是第1布线基板2的下表面,被设置于金属板4的周围区域,与外部电路连接用电极9连接。
所谓周边区域5,也可以被解释为在第1布线基板2的下表面未形成金属板4的区域。
通过在周围区域5设置第2布线基板6,即使在对第1布线基板2的上表面施加力的情况下,第1布线基板2的下表面也被第2布线基板支承。因此,能够抑制在第1布线基板2产生以金属板4的周边部为起点的弯曲应力,能够减少在第1布线基板2产生裂缝或者破裂等。
此外,为了缓和弯曲应力,考虑第1布线基板设置向其下表面即俯视透视下不与金属板重合的区域突出的突出部。
此外,一般的电子元件安装用基板在第1布线基板的上表面连接用于取出信号的第2布线基板,因此难以实现电子元件安装用基板的轻薄化。
在本发明中,未设置突出部,而在周围区域5设置了第2布线基板6,因此能够将应设置于第1布线基板的上表面的第2布线基板6收纳到突出部用的空间。因此,能够将电子元件安装用基板21整体的厚度轻薄化。
第2布线基板6由在绝缘基板形成后述的布线导体而成。该绝缘基板的材料例如能够使用电绝缘性陶瓷或者树脂等。
作为被用作为第2布线基板6的绝缘基板的材料的电绝缘性陶瓷,例如举例有;氧化铝质烧结体、莫来石质烧结体、碳化硅质烧结体、氮化铝质烧结体、氮化硅质烧结体或者玻璃陶瓷烧结体等。
作为被用作为第2布线基板6的绝缘基板的材料的树脂,例如举例有:环氧树脂、聚酰亚胺树脂、丙烯酸树脂、酚醛树脂或者氟类树脂等。作为氟类树脂,例如举例有:聚酯树脂或者四氟化乙烯树脂。
作为第2布线基板6的材料,优选使用树脂。通过使用由如树脂那样弹性率较低的材料构成的第2布线基板6,例如在引线接合的工序等中,能够减少在从第1布线基板2的上表面向下表面施加力的情况下,在第2布线基板6的周边部产生缺口等。
如图1~图3所示的例子那样,优选第2布线基板6的周边部(x的负方向一侧)比第1布线基板2的周边部更位于内侧。由此,在使第1布线基板2与第2布线基板6接合的工序中,即使产生偏离,也能够将电子装置21的外边尺寸设为第1布线基板2的尺寸。因此,能够使将电子装置21安装于外部设备等时的安装区域保持恒定。此时,作为从第1布线基板2的周边部到第2布线基板6的周边部的距离,若为20μm~200μm左右,则能够提高所述效果。
此外,也可以第2布线基板6的周边部(x的负方向一侧)比第1布线基板2的周边部更位于外侧。在该情况下,例如即使在电子元件安装用基板产生意料外的倾斜(处理时等),第2布线基板6的周边部也先与外部的部件接触,因此能够减少在第1布线基板2的周边部产生裂缝或者破裂。通过第2布线基板6的周边部位于从第1布线基板2的周边部起20μm以上的外侧,能够更可靠地得到所述效果。
此外,也可以第2布线基板6比第1布线基板2的周边部更位于外侧,与其他电路或部件等接合。
此外,通过第2布线基板6的上下方向的厚度与金属板4的上下方向的厚度相等,从而例如在将电子元件10固定于金属板4的工序中,能够减少电子元件安装用基板1的倾斜。此外,例如在将电子元件10与电子元件连接用焊盘3接合的工序中,电子元件10与电子元件连接用焊盘3的接合变得容易。此外,能够抑制向第1布线基板2施加以金属板4的周边部为起点的弯曲应力。
如图3(b)所示的例子那样,第2布线基板6设置于金属板4的周围区域5的一部分即可。此外,优选第2布线基板6设置于周围区域5之中宽度较大的位置。由此,在第1布线基板2的最容易变形的位置,能够高效地支承第1布线基板2。因此,在第1布线基板2的最容易变形的位置,能够更加抑制施加以金属板4的周边部为起点的弯曲应力,能够减少在第1布线基板产生裂缝或者破裂。
此外,如图3(a)所示的例子那样,优选第2布线基板6是将内侧部分设为比第1布线基板2的第1贯通孔2a大的第2贯通孔6a的框状。通过设为这样的构成,金属板4的外缘的整周被第2布线基板6包围。因此,在第1布线基板2的外缘的整周,能够通过第2布线基板6来支承第1布线基板2。因此,在第1布线基板2的外缘的整周,能够抑制施加以金属板4的周边部为起点的弯曲应力,能够减少在第1布线基板2产生裂缝或者破裂。
此外,在图1~图3所示的例子中,第1布线基板2与第2布线基板6经由外部电路连接部件23而连接,第1布线基板2与金属板4经由接合材料15而连接,第2布线基板6与外部电路连接部件23的上下方向的厚度的合计和金属板4与接合材料15的上下方向的厚度的合计相等。由此,例如在电子元件安装时等,能够减少电子元件安装用基板1的倾斜,电子元件10的安装变得容易。另外,此时金属板4与接合材料15的厚度的设计值相等即可,在实际的制品中也可以包含制造时的误差等。
接下来,使用图1~图3来对电子装置21进行说明。在图1所示的例子中,电子装置21具有:电子元件安装用基板1、和安装于金属板4的电子元件安装部11的电子元件10。此外,在图1~图3所示的例子中,电子装置21具有与电子元件安装用基板1的上表面接合的盖体12。
电子元件10例如能够使用CCD型或者CMOS型等摄像元件或者LED等发光元件等。在图1以及图2所示的例子中,电子元件10的各电极通过连接部件13(接合引线)来与电子元件连接用焊盘3电连接。此外,电子元件10例如也可以通过银环氧或者热固化性树脂等粘合剂19来与金属板4粘接。
盖体12例如是平板状的光学滤光器。此外,例如在电子元件10是摄像元件或者发光元件的情况下,盖体12也可以使用玻璃材料或者光学滤光器等透明度高的物品。此外,例如在电子元件10是存储器或者ASIC等运算元件的情况下,盖体12也可以是由金属材料构成的平板。盖体12例如通过热固化性树脂或者低熔点玻璃等接合部件14,与框体2的上表面接合。
此外,如图2所示的例子那样,也可以在第1布线基板2的上表面安装电容器等电子部件22。在第1布线基板2的上表面安装电子部件22的情况下,优选在俯视透视下,将第2布线基板6设置于与电子部件22的连接端子24重合的位置。由此,即使在安装电子部件22的工序中向第1布线基板2的上表面施加力的情况下,也能够通过第2布线基板6来支承第1布线基板2的下表面。因此,能够抑制向第1布线基板施加以金属板的周边部为起点的弯曲应力。此外,电子部件22也可以被设置于第1布线基板2的侧面或者下表面。
通过本发明的电子装置21具有上述构成的电子元件安装用基板1、安装于金属板4的电子元件安装部11的电子元件10、和与电子元件安装用基板1的框体2的上表面接合的盖体12,能够提供一种能够减少在第1布线基板2产生裂缝或者破裂并且能够实现轻薄化的电子装置21。
接下来,对本实施方式的电子元件安装用基板1的制造方法的一个例子进行说明。
另外,下述所示的制造方法的一个例子是使用了多个组合布线基板的制造方法。
(1)首先,形成构成第1布线基板2的陶瓷生片。例如,在得到氧化铝(Al2O3)质烧结体即第1布线基板2的情况下,作为烧结助剂,向Al2O3的粉末添加二氧化硅(SiO2)、氧化镁(MgO)或者氧化钙(CaO)等粉末,进一步添加适当的粘合剂、溶剂以及增塑剂,接下来将这些混合物混炼并使其为浆料状。然后,通过以往公知的刮刀片法或者压延辊法等成型方法来得到多个组合用的陶瓷生片。
另外,在第1布线基板2例如由树脂构成的情况下,使用能够成型为规定的形状的模具,通过传递模塑法或者注射模塑法等来成型从而能够形成第1布线基板2。
此外,第1布线基板2也可以例如玻璃环氧树脂那样,使树脂浸入到由玻璃纤维构成的基材。在该情况下,使环氧树脂的前体浸入到由玻璃纤维构成的基材,并以规定的温度使该环氧树脂前体热固化,从而能够形成第1布线基板2。
(2)接下来,通过丝网印刷法等,在由上述(1)的工序得到的陶瓷生片,在成为电子元件连接用焊盘3、外部电路连接用电极9以及布线导体的部分涂覆或填充金属糊膏。该金属糊膏通过与成为第1布线基板2的陶瓷生片同时烧制,形成电子元件连接用焊盘3、外部电路连接用电极9、布线导体等。
该金属糊膏是通过向由所述金属材料构成的金属粉末添加适当的溶剂以及粘合剂并混炼,调整为适度的粘度而制成的。另外,为了提高与第1布线基板2的接合强度,金属糊膏也可以包含玻璃或者陶瓷。
(3)接下来,通过模具等来对所述生片进行加工。在成为第1布线基板2的生片的中央部形成第1贯通孔。
(4)接下来,通过将成为各绝缘层的陶瓷生片层叠并加压,制作成为第1布线基板2的陶瓷生片层叠体。此外,在本工序中,例如,也可以在分别制作出成为第1布线基板2的各个层的生片层叠体之后,通过将多个生片层叠体层叠并加压,来制作成为第1布线基板2的生片层叠体。
(5)接下来,在大约1500~1800℃的温度下对该陶瓷生片层叠体进行烧制,得到排列有多个第1布线基板2的多个组合布线基板。另外,通过该工序,所述金属糊膏成为电子元件连接用焊盘3、外部电路连接用电极9或者布线导体。
(6)接下来,将烧制得到的多个组合布线基板与多个第1布线基板2断开。在该断开中,能够使用沿着成为第1布线基板2的外缘的位置在多个组合布线基板形成分割槽,并沿着该分割槽使其破断并分割的方法,或者能够使用通过切片法等来沿着成为第1布线基板2的外缘的位置切断的方法等。另外,分割槽能够在烧制后利用切片装置,通过切割为比多个组合布线基板的厚度小而形成,但也可以通过将切刀按压于多个组合布线基板用的陶瓷生片层叠体或者通过利用切片装置而切割为比陶瓷生片层叠体的厚度小来形成。
(7)接下来,准备与第1布线基板2的下表面接合的金属板4。金属板4是通过对由金属构成的板材进行使用了以往公知的冲压模具的冲压加工或蚀刻加工等而制作的。在此之后,在金属板4由Fe-Ni-Co合金或42合金、Cu、铜合金等金属构成的情况下,也可以在其表面覆盖镍镀层以及金镀层。由此,能够有效地防止金属板4的表面的氧化腐蚀。
另外,在金属板4设置有第2贯通孔的情况下,也使用上述的冲压加工或蚀刻加工等即可。
(8)接下来,经由接合材料15而将金属板4与第1布线基板2接合。在该工序中,通过丝网印刷法或分配法等来将糊膏状的热固化性树脂(粘接部件)涂覆于框体2或者金属板4的任意一个的接合面,在通过隧道式的环境炉或者加热炉等来使其干燥后,在使第1布线基板2与金属板4重合的状态下通过隧道式的环境炉或者加热炉等并在约150℃下加热约90分钟,从而使接合材料15完全热固化,使第1布线基板2与金属板4稳固地粘接。
接合材料15通过如下工序而得到:例如向由双酚A型液状环氧树脂、双酚F型液状环氧树脂、苯酚酚醛型液状树脂等构成的主剂添加作为着色剂的碳粉末等、由球状的二氧化硅等构成的填充材料、以四氢甲基邻苯二甲酸酐等酸酐等为主的固化剂,并使用离心搅拌机等来混合并混炼使其为糊膏状。
此外,作为接合材料15,也可以使用例如向双酚A型环氧树脂或双酚A改性环氧树脂、双酚F型环氧树脂、苯酚酚醛型环氧树脂、甲酚酚醛型环氧树脂、特殊酚醛清漆型环氧树脂、苯酚衍生物环氧树脂、双酚骨架型环氧树脂等环氧树脂添加了咪唑系或胺系、磷系、肼系、咪唑加合物系、胺加合物系、阳离子聚合系、双氰胺系等固化剂的材料等。
此外,接合材料15除了树脂以外也能够使用低熔点玻璃。低熔点玻璃例如使用向包含氧化铅56~66质量%、氧化硼素4~14质量%、氧化硅1~6质量%以及氧化锌1~11质量%的玻璃成分添加4~15质量%的氧化锆-二氧化硅系化合物而作为填料的材料。向具有这些组成的玻璃粉末添加混合适当的有机溶剂、溶剂来得到玻璃糊膏。通过以往公知的丝网印刷法来将该玻璃糊膏涂覆于第1布线基板2以及金属板4的任意一个的接合面,通过在约430℃的温度下对其进行烧制,来在所述框体2或者金属板4的表面固定粘接部件。然后,在金属板4与第1布线基板2重合的状态下使其通过隧道式的环境炉或者加热炉等,加热到大约470℃,从而使粘接部件熔融并固定,能将第1布线基板2与金属板4稳固地接合。
(9)接下来,准备第2布线基板6。第2布线基板6例如由电绝缘性陶瓷或者树脂等构成。制造方法例如能够通过与(1)~(6)所述的第1布线基板2相同的方法来制作。此外,在第2布线基板6是可挠性布线基板的情况下,例如能够经过利用在由聚酰亚胺构成的基板上形成光致抗蚀剂层的工序以及DES(Development Etching Stripping,显影蚀刻剥离)工序等而在基板上形成的电路图案的上面粘接聚酰亚胺被覆膜的工序来制作。
(10)接下来,经由外部电路连接部件23,将设置于第1布线基板2的下表面的外部电路连接用电极9与第2布线基板6接合。作为外部电路连接部件23的材料,例如有由焊料等金属材料构成的材料、由各向异性导电性膜等树脂构成的材料。
在外部电路连接部件23例如由焊料等构成的情况下,能够向第2布线基板6涂覆膏状焊料等,在规定的位置固定第1布线基板2并施加压力并且进行回流来接合,从而使其电导通。
此外,例如在外部电路连接部件23由各向异性导电性树脂等构成的情况下,能够在第1布线基板2或者第2布线基板6的规定的位置涂覆由各向异性导电性树脂构成的外部电路连接部件23,进行挤压并加热,从而将第1布线基板2与第2布线基板6接合并使其电导通。
此外,此时,第1布线基板2和第2布线基板6也可以通过将金属板4与第1布线基板2接合的接合材料15来进一步接合。通过这样将第1布线基板2与第2布线基板6接合,能够制作电子元件安装用基板1。
通过上述(1)~(10)的工序,得到电子元件安装用基板1。另外,(1)~(10)的工序也可以改变顺序。
将电子元件10安装于这样形成的电子元件安装用基板1的电子元件安装部11,能够制作电子装置21。
(第2实施方式)
接下来,参照图4来对基于本发明的第2实施方式的电子元件安装用基板1以及电子装置21进行说明。另外,图4所示的电子装置21省略了盖体12。
在本实施方式中的电子装置21中,与第1实施方式的电子装置21不同的方面在于,在俯视透视中,在金属板4的侧面与第2布线基板6的金属板4侧的侧面之间具有缝隙7;以及第1布线基板2具有台阶部。
如图4所示的例子那样,通过在金属板4与第2布线基板6之间设置缝隙7,从而在第2布线基板6与第1布线基板2接合时,能够抑制第2布线基板6与金属板4接触,并能够抑制在金属板4或者第2布线基板6产生破裂或者缺口。因此,能够减少从金属板4或者第2布线基板6产生的灰尘等进入到电子元件10的密封空间。此外,能够减少第2布线基板6与金属板4在其他地方重合并接合。因此,能够抑制产生以第2布线基板6与金属板4重合的位置为起点的电子元件安装用基板1的倾斜,此外,能够减少产生弯曲应力。
此外,在图4所示的例子中,第1布线基板2在具有第3贯通孔2b的第1框体2d的上表面,由具有比第3贯通孔2b大的第4贯通孔2c的第2框体2e构成,缝隙7被设置于在俯视透视下与第2框体2e重合的位置。根据该构成,能够将缝隙7设置于俯视透视下与第1布线基板2的最厚部分重合的位置。因此,在引线接合等工序、安装透镜壳体31的工序中从第1布线基板2的上表面施加力的情况下,能够抑制施加第1布线基板2进入到缝隙7的应力并翘曲。因此,第1布线基板难以变形,能够减少在第1布线基板2产生裂缝或者破裂。
此外,如图4所示的例子那样,优选缝隙7被设置在俯视透视下与第2框体2e重合的位置,并且,该缝隙7被设置在俯视透视下不与第2框体2e的内壁的位置重合的位置。在将透镜壳体31、盖体12或者电子部件22等与第1布线基板2接合时,向第2框体2e的上表面施加力。基于该力的弯曲应力的起点是金属板4或者第2贯通孔6a(第2布线基板6)的端部。根据上述构成,金属板4或者第2贯通孔6a(第2布线基板6)的端部处于第2框体2e的正下并重合。这里,在该第2框体2e与第1框体2d层叠的区域,第1布线基板2的厚度较厚。因此,由于从金属板4或者第2贯通孔6a(第2布线基板6)的端部施加的弯曲应力难以作用于具有充分厚度的第1布线基板2,因此能够减少裂缝或者破裂等的产生。
此外,若将缝隙7的宽度设为x1、将第1布线基板2中内侧面与外侧面之间的宽度设为w1,则优选x1是w1的0.1%~25%左右。若是该数值的范围内,则即使在第1布线基板2被从上表面施加力的情况下,也能够减少第1布线基板2弯曲并进入到缝隙7的力起作用。因此,能够抑制向第1布线基板2施加以金属板4的周边部为起点的弯曲应力,能够减少在第1布线基板2产生裂缝或者破裂。
此外,如图4所示的例子那样,在第1布线基板2的上表面设置有电子元件连接用焊盘3,优选该电子元件连接用焊盘3位于在俯视透视下不与缝隙7重合。通过该构成,金属板4或者第2布线基板6被设置在俯视透视下与电子元件连接用焊盘3重合的位置。由此,在对电子元件连接用焊盘3进行引线接合等时,即使在向第1布线基板2的上表面施加力的情况下,也能够减少施加第1布线基板2弯曲并进入到缝隙7的力。
如图4所示的例子那样,第1贯通孔2a由第3贯通孔2b和第4贯通孔2c构成。此外,第1框体2d以及第2框体2e可以如图4所示的例子那样由单层的绝缘层形成,也可以分别由双层以上的绝缘层形成。
另外,也可以在由第1框体2d以及第2框体2e构成的第1布线基板2的内部设置包含内部布线以及贯通导体的布线导体。此外,也可以设置于形成第1布线基板2的第1框体2d以及第2框体2e的内部的各个布线导体通过在第1框体2d以及第2框体2e的表面露出的布线导体等而分别电连接。
此外,在图4所示的例子中,通过第2框体2e的内侧侧面和第1框体2d的上表面来形成台阶部,在该台阶部设置电子元件连接用焊盘3。在连接部件13由键合线构成时,通过这样在台阶部设置电子元件连接用焊盘3,能够将接合引线的顶点较低设置。因此,在通过盖体12和接合部件14来将电子元件安装用基板1密封的工序中,能够减少键合线13与盖体12接触。
(第3实施方式)
接下来,参照图5来对基于本发明的第3实施方式的电子元件安装用基板1以及电子装置21进行说明。另外,图5所示的电子装置21省略了盖体12。
在本实施方式中的电子装置21中,与第2实施方式的电子装置21不同的方面在于,在金属板4与第2布线基板6之间的缝隙7填充有接合材料15。
在图5所示的例子中,金属板4与第2布线基板6之间的缝隙7被接合材料15填充。通过这样将缝隙7由接合材料15等填充,即使在第1布线基板2被从上表面施加力的情况下,也能够减少受到第1布线基板2进入到缝隙7的应力并弯曲。因此,能够抑制向第1布线基板2施加以金属板4的周边部为起点的弯曲应力,能够减少在第1布线基板2产生裂缝或者破裂。
此外,通过由接合材料15填充缝隙7,能够抑制水分或灰尘等进入缝隙7。由此,能够防止将第1布线基板2与第2布线基板6接合的外部电路连接部件23或者将金属板4与第1布线基板2接合的位置的接合材料15劣化,能够减少剥离。
另外,在图5所示的例子中,填充到缝隙7的物质是接合材料15,但也可以例如是外部电路连接部件23的一部分或者其他部件。优选地,若是热固化性树脂等绝缘性的树脂,则能够容易防止外部电路连接电极9与金属板4短路。
作为向缝隙7填充热固化性树脂等(接合材料15)的方法,例如有向电子装置21的缝隙7涂覆热固化性树脂,回流来使其固化的方法。
(第4实施方式)
接下来,参照图6来对基于本发明的第4实施方式的电子元件安装用基板1以及电子模块30进行说明。
在本实施方式中的电子模块30中,与第1实施方式的电子装置21不同的方面在于,金属板4与第2布线基板6之间的缝隙7在俯视透视下与透镜壳体31重合。
图6中示例了在安装有CMOS传感器等摄像元件而作为电子元件10的电子装置21的上表面接合透镜壳体31的电子模块30(摄像模块)的一个例子。
在图6所示的例子中,金属板4与第2布线基板6之间的缝隙7位于在俯视透视下与透镜壳体31的侧壁重合。在图6所示的例子中,在第1布线基板2的上表面未配置上述侧壁的区域,安装例如电子元件连接用焊盘3或电子部件22。此时,根据上述构成,能够设为在安装有电子元件连接用焊盘3或电子部件22的区域的正下不存在缝隙7的配置。因此,在电子部件22的安装时或者向电子元件连接用焊盘3的引线接合时,即使从第1布线基板2的上表面施加力,第1布线基板2也通过第2布线基板6或者金属板4的支承而被充分支承。因此,难以向第1布线基板2施加弯曲应力,能够减少在第1布线基板2产生裂缝或者破裂。
此外,若将此时的缝隙7的宽度设为x2、将透镜壳体31的侧壁的宽度设为w2,则优选x2是w2的5~40%左右。通过将x2设为该范围,即使在安装透镜壳体31的工序中第1布线基板2被从上表面施加力的情况下,也能够减少第1布线基板2弯曲并进入到缝隙7。因此,能够抑制向第1布线基板2施加以金属板4的周边部为起点的弯曲应力,能够减少在第1布线基板2产生裂缝或者破裂。
(第5实施方式)
接下来,参照图7来对基于本发明的第5实施方式的电子元件安装用基板1以及电子装置21进行说明。
在本实施方式中的电子装置21中,与第1实施方式的电子装置21不同的方面在于,第2布线基板6的上下方向的厚度比金属板4的上下方向的厚度大。
在图7所示的例子中,第2布线基板6的上下方向的厚度比金属板4的上下方向的厚度大。由此,在安装电子部件10的工序、将盖体设置于电子装置21的工序、或者为了制作电子模块30而将透镜壳体31等安装于电子装置21的工序等中,能够减少金属板4与制造装置等相接。因此,能够减少例如与制造装置的工作台的接触,或者在与工作台接触的状态下从上方加压导致金属板4变形,能够减少在电子元件10的安装中电子元件10倾斜。此外,能够减少在安装电子部件10后从下面侧向金属板4施加应力或者由于金属板4变形导致应力传递到电子部件10。特别是近年来,在电子元件10是摄像装置的情况下,由于要求金属板4轻薄化,金属板4容易变形,因此有效。此外,例如在金属板4与电子部件10或者第1布线基板2通过接地电位等而接合的情况下,也能够防止与外部装置等的接触导致的意料之外的短路。
另外,本发明并不限定于上述的实施方式的例子,在不脱离本发明的主旨的范围内能够进行各种变更。
此外,例如在图1~图6所示的例子中,第1布线基板2的第1贯通孔2a或第2布线基板6的第2贯通孔6a的开口是矩形形状,但也可以是圆形形状或者其他的多角形状。
此外,本实施方式中的电子元件连接用焊盘3的配置、数量、形状等并不被指定。
Claims (8)
1.一种电子元件安装用基板,具有:
框状的第1布线基板,其将内侧部分设为第1贯通孔,在下表面具有外部电路连接用电极;
板状的金属板,其被设置于该第1布线基板的下表面以使得覆盖所述第1贯通孔的开口,外缘位于所述第1布线基板的外缘与所述第1布线基板的内缘之间,在上表面的由所述第1布线基板围起的区域具有电子元件安装部;和
第2布线基板,其被设置于所述第1布线基板的下表面之中所述金属板的周围区域,与所述外部电路连接用电极电连接。
2.根据权利要求1所述的电子元件安装用基板,其特征在于,
所述第2布线基板的上下方向的厚度与所述金属板的上下方向的厚度相等。
3.根据权利要求1或者2所述的电子元件安装用基板,其特征在于,
所述第2布线基板是将内侧部分设为比所述第1布线基板的所述第1贯通孔大的第2贯通孔的框状。
4.根据权利要求1至3的任意一项所述的电子元件安装用基板,其特征在于,
在所述金属板的侧面与所述第2布线基板的所述金属板侧的侧面之间设置有缝隙。
5.根据权利要求4所述的电子元件安装用基板,其特征在于,
所述第1布线基板由第1框体和第2框体构成,该第1框体将内侧部分设为第3贯通孔,该第2框体被设置于该第1框体的上表面并且将内侧部分设为比所述第3贯通孔大的第4贯通孔,
所述缝隙被设置于俯视透视下与所述第2框体重合的位置。
6.根据权利要求4或者5所述的电子元件安装用基板,其特征在于,
所述第1布线基板在上表面具有电子元件连接用焊盘,该电子元件连接用焊盘被设置于俯视透视下不与所述缝隙重合的位置。
7.根据权利要求1至6的任意一项所述的电子元件安装用基板,其特征在于,
所述第1布线基板与所述第2布线基板经由外部电路连接部件而连接,
所述第1布线基板与所述金属板经由接合材料而连接,
所述第2布线基板与所述外部电路连接部件的上下方向的厚度的合计和所述金属板与所述接合材料的上下方向的厚度的合计相等。
8.一种电子装置,具有:
权利要求1至7的任意一项所述的电子元件安装用基板;和
被安装于所述金属板的所述电子元件安装部的电子元件。
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CN109148408A (zh) * | 2017-06-28 | 2019-01-04 | 京瓷株式会社 | 电子元件安装用基板、电子装置以及电子模块 |
CN111418055A (zh) * | 2017-11-28 | 2020-07-14 | 京瓷株式会社 | 电子元件安装用基板、电子装置以及电子模块 |
CN113169129A (zh) * | 2018-11-28 | 2021-07-23 | 京瓷株式会社 | 电子元件安装用基板以及电子装置 |
CN113597669A (zh) * | 2019-03-25 | 2021-11-02 | 京瓷株式会社 | 电子部件及其制造方法 |
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JP6329065B2 (ja) * | 2014-12-25 | 2018-05-23 | 京セラ株式会社 | 電子素子実装用基板および電子装置 |
JP6693754B2 (ja) * | 2016-01-25 | 2020-05-13 | 京セラ株式会社 | 撮像素子実装用基板および撮像装置 |
JP2017152521A (ja) * | 2016-02-24 | 2017-08-31 | 京セラ株式会社 | 撮像素子実装用基板および撮像装置 |
JP6677595B2 (ja) * | 2016-07-11 | 2020-04-08 | 京セラ株式会社 | 電子素子実装用基板、電子装置および電子モジュール |
JP6955366B2 (ja) * | 2017-04-25 | 2021-10-27 | 京セラ株式会社 | 電子素子実装用基板、電子装置および電子モジュール |
US10651107B2 (en) * | 2017-09-26 | 2020-05-12 | Electronics And Telecommunications Research Institute | Semiconductor device and method for fabricating the same |
US10573674B2 (en) * | 2018-07-19 | 2020-02-25 | Psemi Corporation | SLT integrated circuit capacitor structure and methods |
JP7039450B2 (ja) * | 2018-12-25 | 2022-03-22 | 京セラ株式会社 | 光学装置用パッケージおよび光学装置ならびに光学装置の製造方法 |
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WO2015163192A1 (ja) | 2015-10-29 |
US9806005B2 (en) | 2017-10-31 |
JPWO2015163192A1 (ja) | 2017-04-13 |
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