CN106103629B - 基材密合性优异的有机硅粘合剂组合物及粘合性物品 - Google Patents

基材密合性优异的有机硅粘合剂组合物及粘合性物品 Download PDF

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Publication number
CN106103629B
CN106103629B CN201580012920.8A CN201580012920A CN106103629B CN 106103629 B CN106103629 B CN 106103629B CN 201580012920 A CN201580012920 A CN 201580012920A CN 106103629 B CN106103629 B CN 106103629B
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CN106103629A (zh
Inventor
土田理
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
CN201580012920.8A 2014-06-18 2015-06-05 基材密合性优异的有机硅粘合剂组合物及粘合性物品 Active CN106103629B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014125487 2014-06-18
JP2014-125487 2014-06-18
PCT/JP2015/066284 WO2015194389A1 (ja) 2014-06-18 2015-06-05 基材密着性に優れるシリコーン粘着剤組成物及び粘着性物品

Publications (2)

Publication Number Publication Date
CN106103629A CN106103629A (zh) 2016-11-09
CN106103629B true CN106103629B (zh) 2019-12-20

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CN201580012920.8A Active CN106103629B (zh) 2014-06-18 2015-06-05 基材密合性优异的有机硅粘合剂组合物及粘合性物品

Country Status (5)

Country Link
JP (1) JP6292305B2 (ko)
KR (1) KR102320575B1 (ko)
CN (1) CN106103629B (ko)
TW (1) TWI669365B (ko)
WO (1) WO2015194389A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102412465B1 (ko) * 2017-04-12 2022-06-23 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 점착제용 프라이머 조성물 및 물품
JP6778328B2 (ja) * 2017-08-10 2020-10-28 株式会社寺岡製作所 接着シート
TWI802631B (zh) * 2018-01-16 2023-05-21 日商信越化學工業股份有限公司 聚矽氧黏著劑組成物、硬化物、黏著膜及黏著帶

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3189133B2 (ja) 1992-07-03 2001-07-16 ニホンハンダ株式会社 クリームはんだ
JP3324166B2 (ja) 1992-12-10 2002-09-17 信越化学工業株式会社 接着性シリコーンゴム組成物
JP3232004B2 (ja) 1995-08-17 2001-11-26 信越化学工業株式会社 コーティング材組成物
JP2002338890A (ja) * 2000-03-23 2002-11-27 Shin Etsu Chem Co Ltd シリコーン粘着剤用プライマー組成物
JP2002285129A (ja) * 2001-03-23 2002-10-03 Shin Etsu Chem Co Ltd シリコーン感圧接着剤組成物
JP4996797B2 (ja) 2001-09-28 2012-08-08 東レ・ダウコーニング株式会社 オルガノハイドロジェンポリシロキサン混合物および剥離性硬化皮膜形成性シリコーン組成物
JP4073223B2 (ja) * 2002-03-19 2008-04-09 株式会社カネカ 封止剤、半導体等の封止方法、半導体装置の製造方法、および半導体装置
WO2004083334A2 (en) * 2003-03-17 2004-09-30 Dow Corning Corporation Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength
DE10338478A1 (de) * 2003-08-21 2005-03-17 Wacker-Chemie Gmbh Selbsthaftende additionsvernetzende Siliconzusammensetzungen
US7745505B2 (en) * 2004-12-29 2010-06-29 Henkel Ag & Co. Kgaa Photoinitiators and UV-crosslinkable acrylic polymers for pressure sensitive adhesives
GB0616021D0 (en) 2006-08-14 2006-09-20 Dow Corning Silicone release coating compositions
DE102007044789A1 (de) * 2007-09-19 2009-04-02 Wacker Chemie Ag Selbsthaftende additionsvernetzende Siliconzusammensetzung
JP2010285507A (ja) * 2009-06-10 2010-12-24 Kaneka Corp 接着性硬化性組成物
JP2012149240A (ja) 2010-12-31 2012-08-09 Dow Corning Toray Co Ltd シリコーン粘着剤用プライマー組成物、積層体およびシリコーン粘着テープ
JP2013159671A (ja) * 2012-02-02 2013-08-19 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP5799915B2 (ja) * 2012-08-20 2015-10-28 信越化学工業株式会社 付加硬化型自己接着性シリコーンゴム組成物
JP6168002B2 (ja) * 2014-02-27 2017-07-26 信越化学工業株式会社 基材密着性に優れるシリコーン粘着剤組成物及び粘着性物品

Also Published As

Publication number Publication date
CN106103629A (zh) 2016-11-09
KR20170018803A (ko) 2017-02-20
JPWO2015194389A1 (ja) 2017-04-20
KR102320575B1 (ko) 2021-11-02
TW201614033A (en) 2016-04-16
TWI669365B (zh) 2019-08-21
JP6292305B2 (ja) 2018-03-14
WO2015194389A1 (ja) 2015-12-23

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