CN106068182A - 电子设备用导热性叠层体 - Google Patents

电子设备用导热性叠层体 Download PDF

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CN106068182A
CN106068182A CN201580011287.0A CN201580011287A CN106068182A CN 106068182 A CN106068182 A CN 106068182A CN 201580011287 A CN201580011287 A CN 201580011287A CN 106068182 A CN106068182 A CN 106068182A
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thermal conductivity
electronic equipment
laminated body
thickness
foaming body
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加藤哲裕
下西弘二
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Abstract

本发明提供一种电子设备用导热性叠层体，其是在25％压缩强度为200kPa以下、厚度为0.05～1.0mm的发泡体片的至少一面粘贴有双面粘合带的电子设备用导热性叠层体，上述双面粘合带的基材是厚度为2～100μm的聚对苯二甲酸乙二醇酯。

Description

电子设备用导热性叠层体
技术领域
本发明涉及用于将电子设备内部的热有效率地散热至外部的电子设备用导热性叠层体。
背景技术
在智能手机等要求小型化的电子设备中，高密度地集成的电子部件产生大量的热，该热成为故障的原因，因此设置有用于将该热散热至设备外部的热沉材料。作为上述热沉材料，通常设置于作为发热体的电子部件与金属壳体之间，因此提出了凹凸追随性高的散热润滑脂、散热凝胶、以及使它们含浸于氨基甲酸酯发泡体而得的材料、含有导热体的导热性发泡体等(例如专利文献1、2)。
现有技术文献
专利文献
专利文献1：日本特开2003-31980号公报
专利文献2：日本特开2013-227486号公报
发明内容
发明所要解决的课题
上述散热润滑脂虽然散热性良好，但有一旦涂布润滑脂就难以重新涂布、制品的成品率降低这样的问题。另一方面，散热凝胶一般而言有难以加工成厚度1mm以下的片状、如果进行压缩则形状变形这样的问题。此外，薄片有压缩强度变高、柔软性变低这样的问题。
此外，导热性发泡体薄、柔软性良好，因此适于将薄型的电子设备内部的热散热至外部的用途，但由于如有机硅那样不具有自粘性，因此需要赋予粘着层。然而，发泡体柔软且薄，因此有一旦粘贴于被粘面则再加工时易于破裂这样的缺陷。
本发明是鉴于上述以往的课题而提出的，其目的在于提供具有可以适合用于电子设备的内部的薄度、柔软性和导热性，进一步具有在再加工时不易破裂的优异的操作性的电子设备用导热性叠层体。
用于解决课题的方法
本发明的主旨在于一种电子设备用导热性叠层体，其是在25％压缩强度为200kPa以下、厚度为0.05～1.0mm的发泡体片的至少一面粘贴有双面粘合带的电子设备用导热性叠层体，上述双面粘合带的基材是厚度为2～100μm的聚对苯二甲酸乙二醇酯。
发明的效果
根据本发明，能够提供具有可以适合用于电子设备的内部的薄度、柔软性和导热性，进一步具有在再加工时不易破裂的优异的操作性的电子设备用导热性叠层体。
附图说明
图1为显示用于测定由实施例和比较例制成的电子设备用导热性叠层体的散热性能的叠层结构的图。
具体实施方式
本发明的电子设备用导热性叠层体是在25％压缩强度为200kPa以下、厚度为0.05～1.0mm的发泡体片的至少一面粘贴有双面粘合带的电子设备用导热性叠层体，上述双面粘合带的基材是厚度为2～100μm的聚对苯二甲酸乙二醇酯。
＜发泡体片＞
本发明中所使用的发泡体片的25％压缩强度为200kPa以下。如果上述压缩强度超过200kPa，则发泡体片的柔软性降低，因此不优选。从发泡体片的柔软性的观点出发，发泡体片的25％压缩强度优选为5kPa以上，更优选为10kPa以上，进一步优选为15kPa以上，更进一步优选为20kPa以上，而且优选为190kPa以下，更优选为180kPa以下，进一步优选为150kPa以下，更进一步优选为100kPa以下，更进一步优选为50kPa以下，更进一步优选为40kPa以下。
关于发泡体片的25％压缩强度，从发泡体片的柔软性的观点出发，优选为5～190kPa，更优选为10～190kPa，更优选为15～150kPa，进一步优选为20～100kPa。
本发明中所使用的发泡体片的50％压缩强度优选为200kPa以下。如果上述发泡体片的50％压缩强度为200kPa以下，则能够适合用于移动终端等薄型电子设备。从提高柔软性的观点出发，发泡体片的50％压缩强度更优选为150kPa以下，进一步优选为100kPa以下。
发泡体片的厚度为0.05～1mm。如果发泡体片的厚度小于0.05mm，则发泡体片易于破裂，如果超过1mm，则难以在小型的电子设备内部的空隙中使用。从发泡体片的强度的观点出发，发泡体片的厚度优选为0.05～0.8mm，更优选为0.05～0.7mm，进一步优选为0.05～0.5mm。
发泡体片的导热率优选为0.3～10W/m·K，更优选为0.4～2.0W/m·K，进一步优选为0.45～2.0W/m·K。如果发泡体片的导热率在上述范围内，则能够将电子设备内部的热有效率地散热至外部。
发泡体片的发泡倍率优选为1.5～6倍，更优选为1.5～5倍，进一步优选为1.5～4倍，更进一步优选为1.5～3.5倍。如果发泡体片的发泡倍率在上述范围内，则可以兼具片的薄度和柔软性。
发泡体片的表观密度优选为0.3～1.5g/cm3，更优选为0.35～1.5g/cm3，进一步优选为0.4～1.5g/cm3，更进一步优选为0.4～1.4g/cm3，更进一步优选为0.5～1.4g/cm3，更进一步优选为0.55～1.2g/cm3。如果发泡体片的表观密度在上述范围内，则可以获得兼具所期望的厚度、柔软性、导热率的发泡体片。
＜弹性体树脂＞
本发明中所使用的发泡体片通过使弹性体树脂发泡来获得。
作为本发明可以使用的弹性体树脂，可举出丙烯腈丁二烯橡胶、液状丙烯腈丁二烯橡胶、乙烯-丙烯-二烯橡胶、液状乙烯-丙烯-二烯橡胶、乙烯-丙烯橡胶、液状乙烯-丙烯橡胶、天然橡胶、聚丁二烯橡胶、液状聚丁二烯橡胶、聚异戊二烯橡胶、液状聚异戊二烯橡胶、苯乙烯-丁二烯嵌段共聚物、液状苯乙烯-丁二烯嵌段共聚物、氢化苯乙烯-丁二烯嵌段共聚物、液状氢化苯乙烯-丁二烯嵌段共聚物、氢化苯乙烯-丁二烯-苯乙烯嵌段共聚物、液状氢化苯乙烯-丁二烯-苯乙烯嵌段共聚物、氢化苯乙烯-异戊二烯嵌段共聚物、液状氢化苯乙烯-异戊二烯嵌段共聚物、氢化苯乙烯-异戊二烯-苯乙烯嵌段共聚物、液状氢化苯乙烯-异戊二烯-苯乙烯嵌段共聚物等，其中，优选为丙烯腈丁二烯橡胶、液状丙烯腈丁二烯橡胶、乙烯-丙烯-二烯橡胶和液状乙烯-丙烯-二烯橡胶。
关于弹性体树脂中的液状弹性体含量，从提高柔软性的观点出发，优选为10质量％以上，更优选为20质量％以上，而且优选为90质量％以下，更优选为80质量％以下。
＜导热体＞
在本发明中，从提高导热性的观点出发，构成上述发泡体片的弹性体树脂优选含有导热体。
作为本发明可以使用的导热体，可举出氧化铝和氧化镁等氧化物、氮化硼和氮化铝等氮化物、石墨和石墨烯等碳化合物、和滑石，其中，优选为选自氧化物、氮化物和滑石中的1种以上，更优选为选自氧化物中的1种以上，进一步优选为选自氧化铝和氧化镁中的1种以上，更进一步优选为氧化镁。它们可以单独使用，也可以组合使用2种以上。
作为上述导热体的导热率，优选为5W/m·K以上，更优选为20W/m·K以上。如果导热率在上述范围内，则发泡体片的导热率充分地高。
上述导热体的含量相对于弹性体树脂100质量份优选为100～500质量份。如果导热体的含量为100质量份以上，则可以对发泡体片赋予充分的导热性，如果导热体的含量为500质量份以下，则可以防止发泡体片的柔软性降低。从发泡体片的导热性、柔软性的观点出发，导热体相对于弹性体树脂100质量份的含量优选为120～480质量份，更优选为150～450质量份。
＜发泡剂＞
本发明中的发泡体片优选通过将上述弹性体树脂与发泡剂进行混合，使其化学地发泡来制造。
作为进行化学地发泡的情况下的发泡剂，优选为通过热发生分解而产生气体的热分解型发泡剂。作为热分解型发泡剂，可举出例如，偶氮二甲酰胺、苯磺酰肼、二亚硝基五亚甲基四胺、甲苯磺酰肼、4,4-氧基双(苯磺酰肼)等。它们可以单独使用，也可以组合使用2种以上。
发泡剂的含量相对于上述弹性体树脂100质量份优选为1～30质量份，更优选为3～25质量份，进一步优选为5～20质量份。如果发泡剂的配合量在上述范围内，则可以获得柔软性优异的发泡体。
＜任意成分＞
在本发明中，在不损害本发明的目的的范围内，可以根据需要含有各种添加成分。
该添加成分的种类没有特别限定，可以使用发泡成型时通常所使用的各种添加剂。作为这样的添加剂，可举出例如，润滑剂、防收缩剂、气泡成核剂、结晶成核剂、增塑剂、着色剂(颜料、染料等)、紫外线吸收剂、抗氧化剂、防老化剂、除了上述导电赋予材料以外的填充剂、增强剂、阻燃剂、阻燃助剂、抗静电剂、表面活性剂、硫化剂、表面处理剂等。添加剂的添加量可以在不损害气泡的形成等的范围内适当选择，可以采用通常的树脂的发泡、成型所使用的添加量。它们可以单独使用，也可以组合使用2种以上。
润滑剂使树脂的流动性提高，并且具有抑制树脂的热劣化的作用。作为本发明中所使用的润滑剂，如果在树脂的流动性的提高方向显示效果，则没有特别限制。可举出例如，液体石蜡、石蜡、微晶蜡、聚乙烯蜡等烃系润滑剂；硬脂酸、山嵛酸、12-羟基硬脂酸等脂肪酸系润滑剂；硬脂酸丁酯、硬脂酸单甘油酯、季戊四醇四硬脂酸酯、氢化蓖麻油、硬脂酸十八醇酯等酯系润滑剂等。
作为润滑剂的添加量，相对于弹性体树脂100质量份，优选为0.01～5质量份左右，更优选为0.05～4质量份，进一步优选为0.1～3质量份。如果添加量超过10质量份，则可能流动性变得过高而发泡倍率降低，如果小于0.5质量份，则可能不能谋求流动性的提高，发泡时的拉伸性降低而发泡倍率降低。
作为阻燃剂，除了氢氧化铝、氢氧化镁等金属氢氧化物以外，可举出十溴二苯基醚等溴系阻燃剂、多磷酸铵等磷系阻燃剂等。
作为阻燃助剂，可举出三氧化锑、四氧化锑、五氧化锑、焦锑酸钠、三氯化锑、三硫化锑、氯氧化锑、二氯化锑全氯戊烷、锑酸钾等锑化合物、偏硼酸锌、四硼酸锌、硼酸锌、碱性硼酸锌等硼化合物、锆氧化物、锡氧化物、钼氧化物等。
＜发泡体片的制造方法＞
本发明所使用的发泡体片可以通过公知的化学发泡法或物理发泡法来制造，制造方法没有特别限制。
另外，发泡处理方法可以使用包含塑料泡沫手册(牧广，小坂田笃编集日刊工业新闻社发行1973年)所记载的方法在内的公知的方法。
＜双面粘合带＞
本发明的电子设备用导热性叠层体在上述发泡体片的至少一面粘贴有双面粘合带，双面粘合带的基材由厚度2～100μm的聚对苯二甲酸乙二醇酯构成。
如果双面粘合带的基材的厚度小于2μm，则基材易于破裂，叠层体的操作性变差。关于双面粘合带的基材的厚度，从叠层体的操作性的观点出发，优选为3～100μm，更优选为3～80μm，进一步优选为4～50μm。如果基材的厚度为100μm以下，则散热性能提高，进一步总厚度变小，易于在小型的电子设备内部的空隙中使用。
在本发明中，使用聚对苯二甲酸乙二醇酯(以下，也称为“PET”)作为基材，因此可以获得具有在再加工时不易破裂的优异的操作性的电子设备用导热性叠层体。
在本发明中，双面粘合带的总厚度，即，基材与粘着层的合计的厚度优选为5～150μm，更优选为6～120μm，进一步优选为7～110μm。如果双面粘合带的总厚度在上述范围内，则散热性能提高，进一步易于在小型电子设备内部的空隙中使用。
作为双面粘合带，如果具有上述基材的厚度，则没有特别限制，可以适合使用例如，积水化学工业株式会社制“3801X(PET基材的厚度4μm)”，“3805H(PET基材的厚度40μm)”、“3810H(PET基材的厚度50μm)”。
＜电子设备用导热性叠层体的制造方法＞
对制造本发明的电子设备用导热性叠层体的方法没有特别限制，可以通过一般的方法来制造。例如，可举出将发泡体片与双面粘合带进行层压的方法。另外，层压可以在常温、常压下进行，此外可以在加热、加压下进行。
实施例
通过实施例来进一步详细地说明本发明，本发明不受这些例子的任何限定。
以下的制造例所使用的材料如下。
(1)乙烯-丙烯-二烯橡胶(EPDM)
JSR株式会社制，商品名“EP21”
密度：0.86g/cm3
丙烯含量：34质量％
(2)液状乙烯-丙烯-二烯橡胶(液状EPDM)
三井化学株式会社制，商品名“PX-068”
密度：0.9g/cm3
丙烯含量：39质量％
(3)偶氮二甲酰胺
大塚化学株式会社制，商品名“SO-L”
(4)氧化镁
宇部マテリアルズ株式会社，商品名“RF-10C-SC”
破碎品45μm以下分级平均粒径4μm
导热率：42～60W/m·K
(5)酚系抗氧化剂
BASFジャパン株式会社制，商品名“イルガノックス1010”
[制造例1]
将乙烯-丙烯-二烯橡胶60质量份、液状乙烯-丙烯-二烯橡胶40质量份、偶氮二甲酰胺17质量份、氧化镁360质量份和酚系抗氧化剂0.1质量份的混合物180g进行熔融混炼后，进行压制，从而获得厚度为0.4mm的发泡性树脂片。对于所得的发泡性树脂片的两面以加速电压500keV照射电子射线3.0Mrad而使发泡性树脂片交联。接下来通过将片加热至250℃而使发泡性树脂片发泡，获得表观密度0.60g/cm3、厚度0.5mm的发泡体片。
[制造例2]
将乙烯-丙烯-二烯橡胶50质量份、液状乙烯-丙烯-二烯橡胶50质量份、偶氮二甲酰胺20质量份、氧化镁300质量份和酚系抗氧化剂0.1质量份的混合物180g进行熔融混炼后，进行压制，从而获得厚度为0.32mm的发泡性树脂片。对于所得的发泡性树脂片的两面以加速电压500keV照射电子射线3.0Mrad而使发泡性树脂片交联。接下来通过将片加热至250℃而使发泡性树脂片发泡，获得表观密度0.35g/cm3、厚度0.5mm的发泡体片。
实施例1
在由制造例1获得的发泡体片的一个面上粘贴双面粘合带[积水化学工业株式会社制“3801X”(PET基材的厚度4μm，双面粘合带的总厚度10μm)]，获得电子设备用导热性叠层体。
实施例2
将粘贴的双面粘合带变更为积水化学工业株式会社制“3805H”(PET基材的厚度40μm，双面粘合带的总厚度50μm)，除此以外，与实施例1同样地实施。
实施例3
将粘贴的双面粘合带变更为积水化学工业株式会社制“3810H”(PET基材的厚度50μm，双面粘合带的总厚度100μm)，除此以外，与实施例1同样地实施。
实施例4
使用由制造例2获得的发泡体片，除此以外，与实施例1同样地实施。
实施例5
使用由制造例2获得的发泡体片，除此以外，与实施例3同样地实施。
比较例1
在由制造例1获得的发泡体片上涂布丙烯酸系的粘着剂20μm，获得带有粘着层的发泡体片。
比较例2
在由制造例1获得的发泡体片上粘贴无纺布基材双面带[积水化学工业株式会社制“#5782”(无纺布基材的厚度70μm，无纺布基材双面带的总厚度130μm)]，获得叠层体。
比较例3
在由制造例1获得的发泡体片的一个面上粘贴双面粘合带[积水化学工业株式会社制“3820BH”(PET基材的厚度130μm，双面粘合带的总厚度200μm)]，获得叠层体。
＜物性＞
所得的发泡体片的物性如下那样测定。各测定结果示于表1中。
〔发泡倍率〕
发泡倍率通过将发泡体片的比重除以发泡性树脂片的比重来算出。
〔表观密度〕
按照JIS K 7222进行测定。
〔25％压缩强度〕
发泡体片的厚度方向的25％压缩强度按照JIS K6767-7.2.3(JIS2009)来测定。
〔发泡体片的导热率〕
通过激光闪射法，使用アルバック理工株式会社制“TC-7000”，在25℃测定未发泡树脂片的导热率，由该表观密度通过下述数学式作为计算值算出发泡体片的导热率。
1/λe＝{(1-V1/3)/λS}+V1/3/{λS·(1-V2/3)+λg·V2/3}
λe：发泡体片的导热率
V：发泡体的气孔率(气孔率＝1-〔1/发泡倍率〕)
λS：未发泡树脂片的导热率
λg：空气的导热率
〔最大抗张强度〕
对于由实施例和比较例获得的叠层体的最大抗张强度，使用拉伸试验机，按照JISK6767(A法)来进行。
〔导热性能〕
使用图1所示的叠层结构测定由实施例和比较例获得的片的导热性。具体而言，在绝热材上载置25mm×25mm×2mm的加热器(坂口电热株式会社制微陶瓷加热器，型号“MS5”)，在其上重叠25mm×25mm的由各实施例和比较例制成的样品。在其上载置50mm×100mm×2mm的铝板，形成了传入样品的热扩散至铝板的结构。在该状态下向加热器外加1W的电力，在15分钟后加热器的温度变为一定时测定该加热器的温度[T](℃)。值越小，表示导热性能越良好。
[表1]
表1
由实施例和比较例的结果可知，本发明的电子设备用导热性叠层体具有薄度、柔软性和导热性，并且操作性优异。

Claims (5)

1.一种电子设备用导热性叠层体，其是在25％压缩强度为200kPa以下、厚度为0.05～1.0mm的发泡体片的至少一面粘贴有双面粘合带的电子设备用导热性叠层体，所述双面粘合带的基材是厚度为2～100μm的聚对苯二甲酸乙二醇酯。
2.根据权利要求1所述的电子设备用导热性叠层体，构成所述发泡体片的弹性体树脂含有选自氧化物、氮化物和滑石中的1种以上导热体。
3.根据权利要求2所述的电子设备用导热性叠层体，所述导热体的含量相对于所述弹性体树脂100质量份为100～500质量份。
4.根据权利要求1～3的任一项所述的电子设备用导热性叠层体，所述发泡体片的发泡倍率为1.5～6倍。
5.根据权利要求1～4的任一项所述的电子设备用导热性叠层体，所述双面粘合带的基材的厚度为3～100μm。
CN201580011287.0A 2014-03-28 2015-03-27 电子设备用导热性叠层体 Pending CN106068182A (zh)

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