JP6491641B2 - 電子機器用熱伝導性積層体 - Google Patents
電子機器用熱伝導性積層体 Download PDFInfo
- Publication number
- JP6491641B2 JP6491641B2 JP2016510549A JP2016510549A JP6491641B2 JP 6491641 B2 JP6491641 B2 JP 6491641B2 JP 2016510549 A JP2016510549 A JP 2016510549A JP 2016510549 A JP2016510549 A JP 2016510549A JP 6491641 B2 JP6491641 B2 JP 6491641B2
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- Prior art keywords
- foam sheet
- adhesive tape
- heat
- thickness
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 2
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 1
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- MWRWFPQBGSZWNV-UHFFFAOYSA-N Dinitrosopentamethylenetetramine Chemical compound C1N2CN(N=O)CN1CN(N=O)C2 MWRWFPQBGSZWNV-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- GWFGDXZQZYMSMJ-UHFFFAOYSA-N Octadecansaeure-heptadecylester Natural products CCCCCCCCCCCCCCCCCOC(=O)CCCCCCCCCCCCCCCCC GWFGDXZQZYMSMJ-UHFFFAOYSA-N 0.000 description 1
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- OCKWAZCWKSMKNC-UHFFFAOYSA-N [3-octadecanoyloxy-2,2-bis(octadecanoyloxymethyl)propyl] octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(COC(=O)CCCCCCCCCCCCCCCCC)(COC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC OCKWAZCWKSMKNC-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
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- 239000000853 adhesive Substances 0.000 description 1
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- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 229910000411 antimony tetroxide Inorganic materials 0.000 description 1
- 229940007424 antimony trisulfide Drugs 0.000 description 1
- NVWBARWTDVQPJD-UHFFFAOYSA-N antimony(3+);trisulfide Chemical compound [S-2].[S-2].[S-2].[Sb+3].[Sb+3] NVWBARWTDVQPJD-UHFFFAOYSA-N 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
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- VJRITMATACIYAF-UHFFFAOYSA-N benzenesulfonohydrazide Chemical compound NNS(=O)(=O)C1=CC=CC=C1 VJRITMATACIYAF-UHFFFAOYSA-N 0.000 description 1
- DAMJCWMGELCIMI-UHFFFAOYSA-N benzyl n-(2-oxopyrrolidin-3-yl)carbamate Chemical compound C=1C=CC=CC=1COC(=O)NC1CCNC1=O DAMJCWMGELCIMI-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
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- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
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- 150000004665 fatty acids Chemical class 0.000 description 1
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- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
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- 239000010439 graphite Substances 0.000 description 1
- NDNPFWOOAFWTAI-UHFFFAOYSA-N hexazinc;tetraborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] NDNPFWOOAFWTAI-UHFFFAOYSA-N 0.000 description 1
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- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
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- 238000000465 moulding Methods 0.000 description 1
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- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- NKBWPOSQERPBFI-UHFFFAOYSA-N octadecyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCCCCCCCCCCCCCCCC NKBWPOSQERPBFI-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- LIYKJALVRPGQTR-UHFFFAOYSA-M oxostibanylium;chloride Chemical compound [Cl-].[Sb+]=O LIYKJALVRPGQTR-UHFFFAOYSA-M 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002984 plastic foam Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
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- 239000004094 surface-active agent Substances 0.000 description 1
- CIWAOCMKRKRDME-UHFFFAOYSA-N tetrasodium dioxido-oxo-stibonatooxy-lambda5-stibane Chemical compound [Na+].[Na+].[Na+].[Na+].[O-][Sb]([O-])(=O)O[Sb]([O-])([O-])=O CIWAOCMKRKRDME-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- PZRXQXJGIQEYOG-UHFFFAOYSA-N zinc;oxido(oxo)borane Chemical compound [Zn+2].[O-]B=O.[O-]B=O PZRXQXJGIQEYOG-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
- C09J2400/243—Presence of a foam in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
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- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesive Tapes (AREA)
Description
また、熱伝導性発泡体は薄く柔軟性が良好であるため、薄型の電子機器内部の熱を外部に放熱する用途に適しているが、シリコーンのように自着性を有していないため粘着層を付与する必要がある。しかし、発泡体が柔らかく薄いため、被着面に一度貼付けてしまうとリワーク時に破れやすいという欠点があった。
本発明において用いる発泡体シートの25%圧縮強度は200kPa以下である。前記圧縮強度が200kPaを超えると、発泡体シートの柔軟性が低下するため好ましくない。発泡体シートの柔軟性の観点から、発泡体シートの25%圧縮強度は5kPa以上が好ましく、10kPa以上がより好ましく、15kPa以上が更に好ましく、20kPa以上がより更に好ましく、そして、190kPa以下が好ましく、180kPa以下がより好ましく、150kPa以下が更に好ましく、100kPa以下がより更に好ましく、50kPa以下がより更に好ましく、40kPa以下がより更に好ましい。
発泡体シートの25%圧縮強度は、発泡体シートの柔軟性の観点から、5〜190kPaが好ましく、10〜190kPaがより好ましく、15〜150kPaがより好ましく、20〜100kPaが更に好ましい。
本発明において用いる発泡体シートは、エラストマー樹脂を発泡させることにより得られたものである。
本発明に用いることができるエラストマー樹脂としては、アクリロニトリルブタジエンゴム、液状アクリロニトリルブタジエンゴム、エチレン−プロピレン−ジエンゴム、液状エチレン−プロピレン−ジエンゴム、エチレン−プロピレンゴム、液状エチレン−プロピレンゴム、天然ゴム、ポリブタジエンゴム、液状ポリブタジエンゴム、ポリイソプレンゴム、液状ポリイソプレンゴム、スチレン−ブタジエンブロック共重合体、液状スチレン−ブタジエンブロック共重合体、水素添加スチレン−ブタジエンブロック共重合体、液状水素添加スチレン−ブタジエンブロック共重合体、水素添加スチレン−ブタジエン−スチレンブロック共重合体、液状水素添加スチレン−ブタジエン−スチレンブロック共重合体、水素添加スチレン−イソプレンブロック共重合体、液状水素添加スチレン−イソプレンブロック共重合体、水素添加スチレン−イソプレン−スチレンブロック共重合体、液状水素添加スチレン−イソプレン−スチレンブロック共重合体等が挙げられ、これらの中では、アクリロニトリルブタジエンゴム、液状アクリロニトリルブタジエンゴム、エチレン−プロピレン−ジエンゴム、及び液状エチレン−プロピレン−ジエンゴムが好ましい。
エラストマー樹脂中の液状エラストマー含有量は、柔軟性を向上させる観点から、10質量%以上が好ましく、20質量%以上がより好ましく、そして、90質量%以下が好ましく、80質量%以下がより好ましい。
本発明においては、熱伝導性を向上させる観点から、前記発泡体シートを構成するエラストマー樹脂が熱伝導体を含有することが好ましい。
本発明に用いることができる熱伝導体としては、酸化アルミニウム、及び酸化マグネシウム等の酸化物、窒化ホウ素、及び窒化アルミニウム等の窒化物、グラファイト、及びグラフェン等の炭素化合物、及びタルクが挙げられ、これらの中では、酸化物、窒化物及びタルクから選ばれる1種以上が好ましく、酸化物から選ばれる1種以上がより好ましく、酸化アルミニウム及び酸化マグネシウムから選ばれる1種以上が更に好ましく、酸化マグネシウムがより更に好ましい。これらは、単独でもよく、2種以上を組み合わせて用いてもよい。
前記熱伝導体の熱伝導率としては、5W/m・K以上が好ましく、20W/m・K以上がより好ましい。熱伝導率が前記範囲内であれば、発泡体シートの熱伝導率が十分に高いものになる。
本発明における発泡体シートは、前記エラストマー樹脂と発泡剤とを混合し、化学的に発泡させることにより製造することが好ましい。
化学的に発泡させる場合における発泡剤としては、熱により分解してガスを発生する熱分解型発泡剤が好ましい。熱分解型発泡剤としては、例えば、アゾジカルボンアミド、ベンゼンスルホニルヒドラジド、ジニトロソペンタメチレンテトラミン、トルエンスルホニルヒドラジド、4,4−オキシビス(ベンゼンスルホニルヒドラジド)等が挙げられる。これらは、単独でもよく、2種以上を組み合わせて用いてもよい。
発泡剤の含有量は、前記エラストマー樹脂100質量部に対して、1〜30質量部が好ましく、は3〜25質量部がより好ましく、5〜20質量部が更に好ましい。発泡剤の配合量が前記範囲内であれば、柔軟性に優れる発泡体を得ることができる。
本発明においては、本発明の目的を損なわない範囲で、必要に応じて各種の添加成分を含有させることができる。
この添加成分の種類は特に限定されず、発泡成形に通常使用される各種添加剤を用いることができる。このような添加剤として、例えば、滑剤、収縮防止剤、気泡核剤、結晶核剤、可塑剤、着色剤(顔料、染料等)、紫外線吸収剤、酸化防止剤、老化防止剤、上記導電付与材を除いた充填剤、補強剤、難燃剤、難燃助剤、帯電防止剤、界面活性剤、加硫剤、表面処理剤等が挙げられる。添加剤の添加量は、気泡の形成等を損なわない範囲で適宜選択でき、通常の樹脂の発泡・成形に用いられる添加量を採用できる。これらは、単独でもよく、2種以上を組み合わせて用いてもよい。
難燃助剤としては、三酸化アンチモン、四酸化アンチモン、五酸化アンチモン、ピロアンチモン酸ナトリウム、三塩化アンチモン、三硫化アンチモン、オキシ塩化アンチモン、二塩化アンチモンパークロロペンタン、アンチモン酸カリウム等のアンチモン化合物、メタホウ酸亜鉛、四ホウ酸亜鉛、ホウ酸亜鉛、塩基性ホウ酸亜鉛等のホウ素化合物、ジルコニウム酸化物、スズ酸化物、モリブデン酸化物等が挙げられる。
本発明に用いる発泡体シートは、公知の化学発泡法又は物理的発泡法により製造することができ、製造方法に特に制限はない。
なお、発泡処理方法は、プラスチックフォームハンドブック(牧広、小坂田篤編集 日刊工業新聞社発行 1973年)に記載されている方法を含め、公知の方法を用いることができる。
本発明の電子機器用熱伝導性積層体は、前記発泡体シートの少なくとも一方の面に両面粘着テープを貼付したものであり、両面粘着テープの基材は、厚さ2〜100μmのポリエチレンテレフタレートで構成される。
両面粘着テープの基材の厚さが2μm未満であると基材が破れやすくなり積層体の作業性が悪くなる。両面粘着テープの基材の厚さは、積層体の作業性の観点から、3〜100μmが好ましく、3〜80μmがより好ましく、4〜50μmが更に好ましい。基材の厚さが100μm以下であると、放熱性能が向上し、更に総厚さが小さくなり小型の電子機器内部の空隙に使用しやすくなる。
本発明においては、基材としてポリエチレンテレフタレート(以下、「PET」ともいう)を用いているため、リワーク時に破れにくい優れた作業性を有する電子機器用熱伝導性積層体を得ることができる。
本発明の電子機器用熱伝導性積層体を製造する方法に特に制限はなく、一般的な方法により製造することができる。例えば、発泡体シートと、両面粘着テープとをラミネートする方法を挙げることができる。なお、ラミネートは常温、常圧下で行ってもよく、また、加熱、加圧下で行ってもよい。
以下の製造例で使用した材料は以下のとおりである。
(1)エチレン−プロピレン−ジエンゴム(EPDM)
JSR株式会社製、商品名「EP21」
密度:0.86g/cm3
プロピレン含量:34質量%
(2)液状エチレン−プロピレン−ジエンゴム(液状EPDM)
三井化学株式会社製、商品名「PX−068」
密度:0.9g/cm3
プロピレン含量:39質量%
大塚化学株式会社製、商品名「SO−L」
(4)酸化マグネシウム
宇部マテリアルズ株式会社、商品名「RF−10C−SC」
破砕品45μm以下分級平均粒径4μm
熱伝導率:42〜60W/m・K
(5)フェノール系酸化防止剤
BASFジャパン株式会社製、商品名「イルガノックス1010」
エチレン−プロピレン−ジエンゴム60質量部、液状エチレン−プロピレン−ジエンゴム40質量部、アゾジカルボンアミド17質量部、酸化マグネシウム360質量部、及びフェノール系酸化防止剤0.1質量部の混合物180gを溶融混練後、プレスすることにより厚さが0.4mmの発泡性樹脂シートを得た。得られた発泡性樹脂シートの両面に加速電圧500keVにて電子線を3.0Mrad照射して発泡性樹脂シートを架橋させた。次にシートを250℃に加熱することによって発泡性樹脂シートを発泡させて、見掛け密度0.60g/cm3、厚さ0.5mmの発泡体シートを得た。
エチレン−プロピレン−ジエンゴム50質量部、液状エチレン−プロピレン−ジエンゴム50質量部、アゾジカルボンアミド20質量部、酸化マグネシウム300質量部、及びフェノール系酸化防止剤0.1質量部の混合物180gを溶融混練後、プレスすることにより厚さが0.32mmの発泡性樹脂シートを得た。得られた発泡性樹脂シートの両面に加速電圧500keVにて電子線を3.0Mrad照射して発泡性樹脂シートを架橋させた。次にシートを250℃に加熱することによって発泡性樹脂シートを発泡させて、見掛け密度0.35g/cm3、厚さ0.5mmの発泡体シートを得た。
製造例1で得られた発泡体シートの一方の面に両面粘着テープ[積水化学工業株式会社製「3801X」(PET基材の厚さ4μm、両面粘着テープの総厚さ10μm)]を貼付し、電子機器用熱伝導性積層体を得た。
貼付した両面粘着テープを、積水化学工業株式会社製「3805H」(PET基材の厚さ40μm、両面粘着テープの総厚さ50μm)に変更したこと以外は実施例1と同様に実施した。
貼付した両面粘着テープを、積水化学工業株式会社製「3810H」(PET基材の厚さ50μm、両面粘着テープの総厚さ100μm)に変更したこと以外は実施例1と同様に実施した。
製造例2で得られた発泡体シートを使用したこと以外は、実施例1と同様に実施した。
実施例5
製造例2で得られた発泡体シートを使用したこと以外は、実施例3同様に実施した。
製造例1で得られた発泡体シートにアクリル系の粘着剤を20μm塗布し、粘着層付発泡体シートを得た。
製造例1で得られた発泡体シートに不織布基材両面テープ[積水化学工業株式会社製「#5782」(不織布基材の厚さ70μm、不織布基材両面テープの総厚さ130μm)]を貼付し、積層体を得た。
比較例3
製造例1で得られた発泡体シートの一方の面に両面粘着テープ[積水化学工業株式会社製「3820BH」(PET基材の厚さ130μm、両面粘着テープの総厚さ200μm)]を貼付し、積層体を得た。
得られた発泡体シートの物性は以下のように測定した。各測定結果は表1に示す。
〔発泡倍率〕
発泡倍率は、発泡体シ−トの比重を発泡性樹脂シートの比重で除することにより算出した。
〔見掛け密度〕
JIS K 7222に準拠して測定した。
発泡体シートの厚さ方向の25%圧縮強度は、JIS K6767−7.2.3(JIS2009)に準拠して測定した。
〔発泡体シートの熱伝導率〕
レーザーフラッシュ法により、アルバック理工株式会社製「TC−7000」を用いて、未発泡樹脂シートの熱伝導率を25℃にて測定し、該見かけ密度から下記数式により計算値として発泡体シートの熱伝導率を算出した。
1/λe={(1−V1/3)/λS}+V1/3/{λS・(1−V2/3)+λg・V2/3}
λe:発泡体シートの熱伝導率
V:発泡体の気孔率(気孔率=1−〔1/発泡倍率〕)
λS:未発泡樹脂シートの熱伝導率
λg:空気の熱伝導率
実施例及び比較例で得られた積層体の最大抗張力を、引張試験機を用いてJIS K6767(A法)に準拠して行った。
実施例と比較例で得られたシートの熱伝導性は図1に示した積層構造を用いて測定した。具体的には、断熱材の上に25mm×25mm×2mmのヒーター(坂口電熱株式会社製マイクロセラミックヒーター、型番「MS5」)を載せ、その上に25mm×25mmの各実施例及び比較例で作成したサンプルを重ねた。その上に50mm×100mm×2mmのアルミニウム板を載せ、サンプルを伝わった熱がアルミニウム板に拡散する構造を形成した。この状態でヒーターに1Wの電力を引加し、15分後にヒーターの温度が一定となったところで当該ヒーターの温度[T](℃)を測定した。値が小さい程、熱伝導性能がよいことを示す。
Claims (5)
- 25%圧縮強度が200kPa以下であり、厚さが0.05〜1.0mmである発泡体シートの少なくとも一方の面に、両面粘着テープを貼付した電子機器用熱伝導性積層体であり、前記両面粘着テープの基材が厚さ2〜100μmのポリエチレンテレフタレートであり、前記両面粘着テープの総厚さが10〜150μmである、電子機器用熱伝導性積層体。
- 前記発泡体シートを構成するエラストマー樹脂が、酸化物、窒化物及びタルクから選ばれる1種以上の熱伝導体を含有する、請求項1に記載の電子機器用熱伝導性積層体。
- 前記熱伝導体の含有量が、前記エラストマー樹脂100質量部に対して100〜500質量部である、請求項2に記載の電子機器用熱伝導性積層体。
- 前記発泡体シートの発泡倍率が1.5〜6倍である、請求項1〜3のいずれかに記載の電子機器用熱伝導性積層体。
- 前記両面粘着テープの基材の厚さが3〜100μmである、請求項1〜4のいずれかに記載の電子機器用熱伝導性積層体。
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