CN106062057B - 可光固化的环氧树脂体系 - Google Patents

可光固化的环氧树脂体系 Download PDF

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Publication number
CN106062057B
CN106062057B CN201580011832.6A CN201580011832A CN106062057B CN 106062057 B CN106062057 B CN 106062057B CN 201580011832 A CN201580011832 A CN 201580011832A CN 106062057 B CN106062057 B CN 106062057B
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epoxy resin
resin composition
core
weight
composition according
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Expired - Fee Related
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CN201580011832.6A
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English (en)
Chinese (zh)
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CN106062057A (zh
Inventor
M·哈根布赫尔
M·霍尔农
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Henkel AG and Co KGaA
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Henkel AG and Co KGaA
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • B05D3/067—Curing or cross-linking the coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F15/00—Other methods of preventing corrosion or incrustation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2504/00—Epoxy polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C08L2203/162—Applications used for films sealable films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
CN201580011832.6A 2014-03-07 2015-03-06 可光固化的环氧树脂体系 Expired - Fee Related CN106062057B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014204265 2014-03-07
DE102014204265.8 2014-03-07
PCT/EP2015/054697 WO2015132372A1 (de) 2014-03-07 2015-03-06 Photohärtbare epoxidharzsysteme

Publications (2)

Publication Number Publication Date
CN106062057A CN106062057A (zh) 2016-10-26
CN106062057B true CN106062057B (zh) 2020-10-30

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CN201580011832.6A Expired - Fee Related CN106062057B (zh) 2014-03-07 2015-03-06 可光固化的环氧树脂体系

Country Status (8)

Country Link
US (1) US10508199B2 (https=)
EP (1) EP3114161B1 (https=)
JP (1) JP6964981B2 (https=)
KR (1) KR102334119B1 (https=)
CN (1) CN106062057B (https=)
CA (1) CA2941484A1 (https=)
MX (1) MX388803B (https=)
WO (1) WO2015132372A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102042190B1 (ko) * 2016-12-27 2019-11-07 삼성에스디아이 주식회사 감광성 수지 조성물, 그로부터 형성된 경화막, 및 경화막을 갖는 전자 소자
EP3630883A4 (en) * 2017-05-25 2020-12-09 Henkel IP & Holding GmbH Curable compositions
EP3421567B1 (de) * 2017-06-28 2024-09-18 Henkel AG & Co. KGaA Uv vorhärtbare epoxid-zusammensetzung für zweistufigen montageprozess
CZ308202B6 (cs) * 2017-09-11 2020-02-26 TESORO Spin off, s.r.o. Flexibilní kompozitní materiály a způsob jejich přípravy a využití
KR102244791B1 (ko) 2017-12-15 2021-04-26 주식회사 엘지화학 편광판, 편광판-캐리어 필름 적층체, 편광판-캐리어 필름 적층체의 제조방법, 편광판의 제조방법 및 활성 에너지선 경화형 조성물
KR102244789B1 (ko) * 2017-12-15 2021-04-26 주식회사 엘지화학 편광판, 편광판-캐리어 필름 적층체, 편광판-캐리어 필름 적층체의 제조방법, 편광판의 제조방법 및 활성 에너지선 경화형 조성물
US10858541B2 (en) * 2017-12-19 2020-12-08 Rohm And Haas Electronic Materials Llc Curable composition
CN107964333B (zh) * 2017-12-29 2020-01-17 中科院广州化学有限公司 一种端氨基反应性含氟聚合物改性水性环氧涂料及其制备与应用
WO2019153108A1 (zh) * 2018-02-06 2019-08-15 株式会社大赛璐 固化性环氧树脂组合物及其固化物
CN108623726B (zh) * 2018-05-15 2020-10-02 闽江学院 三维打印用腰果酚树脂及其制备方法
CN109553766B (zh) * 2018-09-28 2021-11-02 长兴材料工业（广东）有限公司 改性聚酯多元醇及其制备方法与应用
KR20260005392A (ko) * 2019-08-07 2026-01-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Uv 경화성 접착제 조성물 및 접착 필름, 접착 테이프, 및 이를 포함하는 접합 구성 요소
KR102836682B1 (ko) * 2019-09-25 2025-07-18 주식회사 엘지화학 하드 코팅 조성물, 이를 포함하는 광학 적층체 및 플렉서블 디스플레이 장치
EP4051744A1 (en) * 2019-11-01 2022-09-07 Cytec Industries Inc. Primer composition for adhesive bonding and method of using the same
WO2021112091A1 (ja) * 2019-12-03 2021-06-10 株式会社Adeka 樹脂組成物
CN112680159B (zh) * 2020-12-28 2023-04-07 上海仁速新材料有限公司 一种紫外光固化环氧胶黏剂及其制备方法和应用
CN112831302A (zh) * 2021-01-29 2021-05-25 安田信邦（厦门）电子科技有限公司 一种阳离子环保型半导体底部填充胶及其制备方法
CN118725209B (zh) * 2024-09-02 2024-12-13 上海品诚晶曜光伏科技有限公司 一种高耐候光伏增强预浸料环氧树脂及其制备方法和应用
CN119432283A (zh) * 2024-11-28 2025-02-14 杭州之江有机硅化工有限公司 一种折边胶及其制备方法和应用
CN121022321A (zh) * 2025-10-29 2025-11-28 厦门优佰电子材料有限公司 一种手机窄边框低压注塑密封粘接胶及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997005172A1 (en) * 1995-07-26 1997-02-13 Lockheed Martin Energy Systems, Inc. Ionizing radiation curing of epoxy resin systems incorporating cationic photoinitiators
CN1942424A (zh) * 2004-04-19 2007-04-04 西巴特殊化学品控股有限公司 新的光引发剂
CN102272227A (zh) * 2009-03-13 2011-12-07 帝斯曼知识产权资产管理有限公司 可辐射固化树脂组合物以及使用这种组合物的快速三维成像方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4256828A (en) * 1975-09-02 1981-03-17 Minnesota Mining And Manufacturing Company Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
EP0585360A1 (en) * 1991-05-16 1994-03-09 Minnesota Mining And Manufacturing Company Epoxide-based adhesive
WO1993015124A1 (en) 1992-01-22 1993-08-05 Minnesota Mining And Manufacturing Company Photoactivatable, thermally curable epoxy compositions
US5346939A (en) * 1993-01-25 1994-09-13 Minnesota Mining And Manufacturing Company Water curable resin compositions
US6482868B1 (en) * 1998-12-31 2002-11-19 3M Innovative Properties Company Accelerators useful for energy polymerizable compositions
KR101303246B1 (ko) * 2005-08-24 2013-09-06 헨켈 아일랜드 리미티드 개선된 내충격성을 갖는 에폭시 조성물
JP2011179101A (ja) * 2010-03-04 2011-09-15 Autonetworks Technologies Ltd 防食剤、端子付き被覆電線およびワイヤーハーネス
US20150045510A1 (en) * 2012-04-02 2015-02-12 Christof Braendli Epoxy adhesive, manufacture and use thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997005172A1 (en) * 1995-07-26 1997-02-13 Lockheed Martin Energy Systems, Inc. Ionizing radiation curing of epoxy resin systems incorporating cationic photoinitiators
CN1942424A (zh) * 2004-04-19 2007-04-04 西巴特殊化学品控股有限公司 新的光引发剂
CN102272227A (zh) * 2009-03-13 2011-12-07 帝斯曼知识产权资产管理有限公司 可辐射固化树脂组合物以及使用这种组合物的快速三维成像方法

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Publication number Publication date
CN106062057A (zh) 2016-10-26
JP2017508858A (ja) 2017-03-30
KR102334119B1 (ko) 2021-12-01
KR20160132062A (ko) 2016-11-16
MX388803B (es) 2025-03-20
JP6964981B2 (ja) 2021-11-10
US20160376435A1 (en) 2016-12-29
EP3114161B1 (de) 2023-10-18
US10508199B2 (en) 2019-12-17
MX2016011506A (es) 2016-11-29
WO2015132372A1 (de) 2015-09-11
CA2941484A1 (en) 2015-09-11
EP3114161A1 (de) 2017-01-11

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