CN105990187B - 半导体制造装置及半导体装置的制造方法 - Google Patents
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JP2014-188530 | 2014-09-17 | ||
JP2014188530A JP6270671B2 (ja) | 2014-09-17 | 2014-09-17 | 半導体製造装置および半導体装置の製造方法 |
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CN105990187A CN105990187A (zh) | 2016-10-05 |
CN105990187B true CN105990187B (zh) | 2019-02-15 |
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JP (1) | JP6270671B2 (zh) |
CN (1) | CN105990187B (zh) |
TW (1) | TWI579948B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6759524B2 (ja) * | 2016-10-28 | 2020-09-23 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
JP6820494B2 (ja) * | 2016-10-28 | 2021-01-27 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
JP6945152B2 (ja) * | 2016-10-28 | 2021-10-06 | 株式会社東京精密 | ワーク分割装置 |
KR102434738B1 (ko) * | 2016-10-28 | 2022-08-22 | 가부시키가이샤 도교 세이미쓰 | 워크 분할 장치 및 워크 분할 방법 |
JP6896990B2 (ja) * | 2017-03-27 | 2021-06-30 | 株式会社東京精密 | ワーク分割方法 |
JP7110540B2 (ja) * | 2018-01-11 | 2022-08-02 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
JP7284439B2 (ja) * | 2018-01-11 | 2023-05-31 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
JP7221649B2 (ja) * | 2018-10-30 | 2023-02-14 | 株式会社ディスコ | ウエーハの拡張方法およびウエーハの拡張装置 |
JP2020072139A (ja) * | 2018-10-30 | 2020-05-07 | 株式会社ディスコ | ウエーハの拡張方法およびウエーハの拡張装置 |
Citations (1)
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CN102222633A (zh) * | 2010-04-16 | 2011-10-19 | 日东电工株式会社 | 热固型芯片接合薄膜、切割/芯片接合薄膜及半导体装置的制造方法 |
Family Cites Families (12)
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JP3017827B2 (ja) * | 1991-03-26 | 2000-03-13 | 沖電気工業株式会社 | ダイスボンディング装置におけるウエハリング保持機構 |
JPH09190988A (ja) * | 1996-01-11 | 1997-07-22 | Toshiba Mechatronics Kk | シートの引き伸し装置 |
JPH11233458A (ja) * | 1998-02-18 | 1999-08-27 | Hitachi Ltd | 半導体素子の製造方法およびその製造に用いる半導体ウエハ |
US7005317B2 (en) * | 2003-10-27 | 2006-02-28 | Intel Corporation | Controlled fracture substrate singulation |
JP2006310691A (ja) * | 2005-05-02 | 2006-11-09 | Hugle Electronics Inc | 折り畳み式フィルムシート拡張方法および折り畳み式フィルムシート用エキスパンダ |
JP4714950B2 (ja) * | 2005-11-18 | 2011-07-06 | 株式会社東京精密 | エキスパンドリング、及び該エキスパンドリングを使用した基板の分割方法 |
JP2007250598A (ja) * | 2006-03-14 | 2007-09-27 | Renesas Technology Corp | 半導体装置の製造方法 |
JP2010219267A (ja) * | 2009-03-17 | 2010-09-30 | Toshiba Corp | 半導体装置の製造方法 |
JP2010275509A (ja) * | 2009-06-01 | 2010-12-09 | Furukawa Electric Co Ltd:The | 粘着フィルム及び半導体ウエハ加工用テープ |
JP2012243970A (ja) * | 2011-05-20 | 2012-12-10 | Ngk Spark Plug Co Ltd | セラミック配線基板個片の移載方法、およびその移載装置 |
JP6055369B2 (ja) * | 2012-09-28 | 2016-12-27 | 株式会社東芝 | 半導体装置の製造装置および半導体装置の製造方法 |
US10008405B2 (en) * | 2012-12-26 | 2018-06-26 | Hitachi Chemical Company, Ltd | Expansion method, method for manufacturing semiconductor device, and semiconductor device |
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2014
- 2014-09-17 JP JP2014188530A patent/JP6270671B2/ja active Active
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2015
- 2015-02-25 TW TW104106094A patent/TWI579948B/zh active
- 2015-03-04 CN CN201510097273.7A patent/CN105990187B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102222633A (zh) * | 2010-04-16 | 2011-10-19 | 日东电工株式会社 | 热固型芯片接合薄膜、切割/芯片接合薄膜及半导体装置的制造方法 |
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Publication number | Publication date |
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TW201613009A (en) | 2016-04-01 |
CN105990187A (zh) | 2016-10-05 |
JP2016063016A (ja) | 2016-04-25 |
TWI579948B (zh) | 2017-04-21 |
JP6270671B2 (ja) | 2018-01-31 |
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