JP2020072139A - ウエーハの拡張方法およびウエーハの拡張装置 - Google Patents
ウエーハの拡張方法およびウエーハの拡張装置 Download PDFInfo
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- JP2020072139A JP2020072139A JP2018203831A JP2018203831A JP2020072139A JP 2020072139 A JP2020072139 A JP 2020072139A JP 2018203831 A JP2018203831 A JP 2018203831A JP 2018203831 A JP2018203831 A JP 2018203831A JP 2020072139 A JP2020072139 A JP 2020072139A
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- wafer
- adhesive tape
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000002390 adhesive tape Substances 0.000 claims abstract description 98
- 238000003825 pressing Methods 0.000 claims abstract description 35
- 238000002360 preparation method Methods 0.000 claims abstract description 7
- 230000001105 regulatory effect Effects 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 103
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000002679 ablation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
2a、2a’:表面
4、4’:分割予定ライン
6、6’:デバイス
8:フレーム
8a:開口部
10:粘着テープ
10a:露出粘着テープ
12:ウエーハの拡張装置
14:フレーム固定手段
16:押圧部材
20:治具
20a:短軸部
20b:長軸部
20c:開口部
Claims (2)
- 分割予定ラインによって区画され複数の長方形のデバイスが形成されたウエーハを拡張し、デバイスとデバイスとの間隔を広げるウエーハの拡張方法であって、
ウエーハを収容する開口部を備えたフレームに粘着テープを介して支持され分割予定ラインが分割された又は分割予定ラインに分割の起点が形成されたウエーハを準備するウエーハ準備工程と、
上端にフレームを載置可能なフレーム固定手段にフレームを固定するフレーム固定工程と、
ウエーハの外周に対応する外周を備えた押圧部材によって粘着テープ側からウエーハを押圧してフレームから遠ざけウエーハとフレームとの間にある露出粘着テープを拡張しデバイスとデバイスとの間隔を広げる拡張工程と、
を少なくとも含み、
該拡張工程において、該押圧部材によってウエーハをフレームから遠ざけるとデバイスの短辺が並ぶ方向の該露出粘着テープが貼着して該露出粘着テープの幅を規制する短軸部と、デバイスの長辺が並ぶ方向の該露出粘着テープが貼着して該露出粘着テープの幅を該短軸部よりも広く規制する長軸部とを有する楕円の開口部を備え、長方形のデバイスとデバイスとの間隔を均等にするための治具がフレームの上部に配設されるウエーハの拡張方法。 - 分割予定ラインによって区画され複数の長方形のデバイスが形成されたウエーハを拡張し、デバイスとデバイスとの間隔を広げるウエーハの拡張装置であって、
分割予定ラインが分割された又は分割予定ラインに分割の起点が形成されたウエーハを収容する開口部を備え粘着テープを介してウエーハを支持したフレームを固定するフレーム固定手段と、
ウエーハの外周に対応する外周を備え粘着テープ側からウエーハを押圧してフレームから遠ざけウエーハとフレームとの間にある露出粘着テープを拡張する押圧部材と、
を少なくとも備え、
該押圧部材によってウエーハをフレームから遠ざけるとデバイスの短辺が並ぶ方向の該露出粘着テープが貼着して該露出粘着テープの幅を規制する短軸部と、デバイスの長辺が並ぶ方向の該露出粘着テープが貼着して該露出粘着テープの幅を該短軸部よりも広く規制する長軸部とを有する楕円の開口部を備え、長方形のデバイスとデバイスとの間隔を均等にするための治具がフレームの上部に配設されるウエーハの拡張装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018203831A JP2020072139A (ja) | 2018-10-30 | 2018-10-30 | ウエーハの拡張方法およびウエーハの拡張装置 |
KR1020190119692A KR20200049514A (ko) | 2018-10-30 | 2019-09-27 | 웨이퍼의 확장 방법 및 웨이퍼의 확장 장치 |
CN201911010540.7A CN111128840A (zh) | 2018-10-30 | 2019-10-23 | 晶片的扩展方法和晶片的扩展装置 |
TW108138589A TWI807124B (zh) | 2018-10-30 | 2019-10-25 | 晶圓擴張方法以及晶圓擴張裝置 |
DE102019216642.3A DE102019216642A1 (de) | 2018-10-30 | 2019-10-29 | Waferausdehnungsverfahren und waferausdehnungsvorrichtung |
US16/667,164 US11031276B2 (en) | 2018-10-30 | 2019-10-29 | Wafer expanding method and wafer expanding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018203831A JP2020072139A (ja) | 2018-10-30 | 2018-10-30 | ウエーハの拡張方法およびウエーハの拡張装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2020072139A true JP2020072139A (ja) | 2020-05-07 |
Family
ID=70327376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018203831A Pending JP2020072139A (ja) | 2018-10-30 | 2018-10-30 | ウエーハの拡張方法およびウエーハの拡張装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11031276B2 (ja) |
JP (1) | JP2020072139A (ja) |
KR (1) | KR20200049514A (ja) |
CN (1) | CN111128840A (ja) |
DE (1) | DE102019216642A1 (ja) |
TW (1) | TWI807124B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116631905B (zh) * | 2023-05-06 | 2024-06-14 | 深圳市博辉特科技有限公司 | 一种扩晶设备及扩晶方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5470363U (ja) * | 1977-10-25 | 1979-05-18 | ||
JP2016063016A (ja) * | 2014-09-17 | 2016-04-25 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
WO2018079536A1 (ja) * | 2016-10-28 | 2018-05-03 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4647830B2 (ja) | 2001-05-10 | 2011-03-09 | 株式会社ディスコ | 被加工物の分割処理方法および分割処理方法に用いるチップ間隔拡張装置 |
JP2005129607A (ja) | 2003-10-22 | 2005-05-19 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP2007250598A (ja) * | 2006-03-14 | 2007-09-27 | Renesas Technology Corp | 半導体装置の製造方法 |
JP5580701B2 (ja) * | 2010-09-13 | 2014-08-27 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
KR101903312B1 (ko) * | 2012-12-26 | 2018-10-01 | 히타치가세이가부시끼가이샤 | 익스팬드 방법, 반도체 장치의 제조방법, 및 반도체 장치 |
JP6189066B2 (ja) * | 2013-03-27 | 2017-08-30 | 株式会社ディスコ | ウエーハの加工方法 |
US9230862B2 (en) * | 2013-05-14 | 2016-01-05 | Texas Instruments Incorporated | Wafer die separation |
US20140339673A1 (en) * | 2013-05-14 | 2014-11-20 | Texas Instruments Incorporated | Wafer processing |
JP6178724B2 (ja) * | 2013-12-26 | 2017-08-09 | 株式会社ディスコ | ウェーハの分割方法 |
JPWO2015178369A1 (ja) * | 2014-05-23 | 2017-04-20 | 日立化成株式会社 | ダイボンドダイシングシート |
DE102017201154A1 (de) * | 2017-01-25 | 2018-07-26 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers und Waferbearbeitungssystem |
US10615075B2 (en) * | 2018-06-13 | 2020-04-07 | Texas Instruments Incorporated | Dicing a wafer |
-
2018
- 2018-10-30 JP JP2018203831A patent/JP2020072139A/ja active Pending
-
2019
- 2019-09-27 KR KR1020190119692A patent/KR20200049514A/ko not_active Application Discontinuation
- 2019-10-23 CN CN201911010540.7A patent/CN111128840A/zh active Pending
- 2019-10-25 TW TW108138589A patent/TWI807124B/zh active
- 2019-10-29 DE DE102019216642.3A patent/DE102019216642A1/de active Pending
- 2019-10-29 US US16/667,164 patent/US11031276B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5470363U (ja) * | 1977-10-25 | 1979-05-18 | ||
JP2016063016A (ja) * | 2014-09-17 | 2016-04-25 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
WO2018079536A1 (ja) * | 2016-10-28 | 2018-05-03 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
Also Published As
Publication number | Publication date |
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KR20200049514A (ko) | 2020-05-08 |
US11031276B2 (en) | 2021-06-08 |
DE102019216642A1 (de) | 2020-04-30 |
TW202017025A (zh) | 2020-05-01 |
CN111128840A (zh) | 2020-05-08 |
US20200135533A1 (en) | 2020-04-30 |
TWI807124B (zh) | 2023-07-01 |
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