CN105990167A - 导线键合装置及半导体装置 - Google Patents
导线键合装置及半导体装置 Download PDFInfo
- Publication number
- CN105990167A CN105990167A CN201510096752.7A CN201510096752A CN105990167A CN 105990167 A CN105990167 A CN 105990167A CN 201510096752 A CN201510096752 A CN 201510096752A CN 105990167 A CN105990167 A CN 105990167A
- Authority
- CN
- China
- Prior art keywords
- wire
- bonding
- bond pad
- foot
- instrument
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-187680 | 2014-09-16 | ||
JP2014187680A JP2016062962A (ja) | 2014-09-16 | 2014-09-16 | ワイヤボンディング装置、及び半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105990167A true CN105990167A (zh) | 2016-10-05 |
CN105990167B CN105990167B (zh) | 2019-08-02 |
Family
ID=55798081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510096752.7A Active CN105990167B (zh) | 2014-09-16 | 2015-03-04 | 导线键合装置及半导体装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2016062962A (zh) |
CN (1) | CN105990167B (zh) |
TW (1) | TWI615907B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI739379B (zh) | 2019-04-24 | 2021-09-11 | 日商新川股份有限公司 | 半導體裝置、半導體裝置的製造方法、以及打線接合裝置 |
JP2022049485A (ja) | 2020-09-16 | 2022-03-29 | キオクシア株式会社 | 半導体記憶装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1996584A (zh) * | 2006-01-06 | 2007-07-11 | 株式会社瑞萨科技 | 半导体器件及其制造方法 |
CN101375382A (zh) * | 2003-08-14 | 2009-02-25 | 宇芯(毛里求斯)控股有限公司 | 半导体器件封装及其制造方法 |
WO2014077026A1 (ja) * | 2012-11-16 | 2014-05-22 | 株式会社新川 | ワイヤボンディング装置及び半導体装置の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4422568A (en) * | 1981-01-12 | 1983-12-27 | Kulicke And Soffa Industries, Inc. | Method of making constant bonding wire tail lengths |
JPS61214531A (ja) * | 1985-03-20 | 1986-09-24 | Hitachi Ltd | ウエツジおよびそれを用いたワイヤボンダ |
JP2006250648A (ja) * | 2005-03-09 | 2006-09-21 | Yamaha Corp | 物理量センサの製造方法及びボンディング装置 |
US20130119117A1 (en) * | 2011-11-04 | 2013-05-16 | Invensas Corporation | Bonding wedge |
-
2014
- 2014-09-16 JP JP2014187680A patent/JP2016062962A/ja active Pending
-
2015
- 2015-03-04 CN CN201510096752.7A patent/CN105990167B/zh active Active
- 2015-03-05 TW TW104107075A patent/TWI615907B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101375382A (zh) * | 2003-08-14 | 2009-02-25 | 宇芯(毛里求斯)控股有限公司 | 半导体器件封装及其制造方法 |
CN1996584A (zh) * | 2006-01-06 | 2007-07-11 | 株式会社瑞萨科技 | 半导体器件及其制造方法 |
WO2014077026A1 (ja) * | 2012-11-16 | 2014-05-22 | 株式会社新川 | ワイヤボンディング装置及び半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201611927A (en) | 2016-04-01 |
CN105990167B (zh) | 2019-08-02 |
JP2016062962A (ja) | 2016-04-25 |
TWI615907B (zh) | 2018-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170810 Address after: Tokyo, Japan Applicant after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Applicant before: Toshiba Corp. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo Patentee after: Kaixia Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. Address after: Tokyo Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo Patentee before: Pangea Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220130 Address after: Tokyo Patentee after: Pangea Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |
|
TR01 | Transfer of patent right |