CN105980540A - 用于剥离光刻胶的智能液体 - Google Patents
用于剥离光刻胶的智能液体 Download PDFInfo
- Publication number
- CN105980540A CN105980540A CN201480067008.8A CN201480067008A CN105980540A CN 105980540 A CN105980540 A CN 105980540A CN 201480067008 A CN201480067008 A CN 201480067008A CN 105980540 A CN105980540 A CN 105980540A
- Authority
- CN
- China
- Prior art keywords
- formula
- photoresist
- multiphase system
- acetoacetate
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 47
- 239000007788 liquid Substances 0.000 title claims description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 33
- 238000000576 coating method Methods 0.000 claims abstract description 25
- 239000011248 coating agent Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- -1 acetoacetate ester Chemical class 0.000 claims description 11
- 239000004094 surface-active agent Substances 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims description 10
- 239000001257 hydrogen Substances 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical compound CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 claims description 6
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 claims description 6
- 150000003505 terpenes Chemical class 0.000 claims description 6
- 235000007586 terpenes Nutrition 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 claims description 4
- OJVAMHKKJGICOG-UHFFFAOYSA-N 2,5-hexanedione Chemical compound CC(=O)CCC(C)=O OJVAMHKKJGICOG-UHFFFAOYSA-N 0.000 claims description 4
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 claims description 4
- KVFQMAZOBTXCAZ-UHFFFAOYSA-N 3,4-Hexanedione Chemical compound CCC(=O)C(=O)CC KVFQMAZOBTXCAZ-UHFFFAOYSA-N 0.000 claims description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical class OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 4
- OKJIRPAQVSHGFK-UHFFFAOYSA-N N-acetylglycine Chemical compound CC(=O)NCC(O)=O OKJIRPAQVSHGFK-UHFFFAOYSA-N 0.000 claims description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 4
- 150000002009 diols Chemical class 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- MWVFCEVNXHTDNF-UHFFFAOYSA-N hexane-2,3-dione Chemical compound CCCC(=O)C(C)=O MWVFCEVNXHTDNF-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- TZMFJUDUGYTVRY-UHFFFAOYSA-N pentane-2,3-dione Chemical compound CCC(=O)C(C)=O TZMFJUDUGYTVRY-UHFFFAOYSA-N 0.000 claims description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002280 amphoteric surfactant Substances 0.000 claims description 3
- 239000003945 anionic surfactant Substances 0.000 claims description 3
- 239000003093 cationic surfactant Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000002736 nonionic surfactant Substances 0.000 claims description 3
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 claims description 2
- MVCFRLITIYRWEA-XQRVVYSFSA-N (Z)-2-(2-methylpropyl)but-2-enediamide Chemical compound CC(C)C\C(=C\C(N)=O)C(N)=O MVCFRLITIYRWEA-XQRVVYSFSA-N 0.000 claims description 2
- NAICOPBFGRDALQ-SNAWJCMRSA-N (Z)-2-tert-butylbut-2-enediamide Chemical compound CC(C)(C)C(\C(N)=O)=C\C(N)=O NAICOPBFGRDALQ-SNAWJCMRSA-N 0.000 claims description 2
- FSQQTNAZHBEJLS-OWOJBTEDSA-M (e)-4-amino-4-oxobut-2-enoate Chemical compound NC(=O)\C=C\C([O-])=O FSQQTNAZHBEJLS-OWOJBTEDSA-M 0.000 claims description 2
- LMUKJAZFWLIKCI-ARJAWSKDSA-N (z)-n'-ethylbut-2-enediamide Chemical compound CCNC(=O)\C=C/C(N)=O LMUKJAZFWLIKCI-ARJAWSKDSA-N 0.000 claims description 2
- NEJHGWYTZPBYTF-ARJAWSKDSA-N (z)-n'-propan-2-ylbut-2-enediamide Chemical compound CC(C)NC(=O)\C=C/C(N)=O NEJHGWYTZPBYTF-ARJAWSKDSA-N 0.000 claims description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 claims description 2
- 229940035437 1,3-propanediol Drugs 0.000 claims description 2
- 229940043375 1,5-pentanediol Drugs 0.000 claims description 2
- HEWZVZIVELJPQZ-UHFFFAOYSA-N 2,2-dimethoxypropane Chemical compound COC(C)(C)OC HEWZVZIVELJPQZ-UHFFFAOYSA-N 0.000 claims description 2
- ZWNMRZQYWRLGMM-UHFFFAOYSA-N 2,5-dimethylhexane-2,5-diol Chemical compound CC(C)(O)CCC(C)(C)O ZWNMRZQYWRLGMM-UHFFFAOYSA-N 0.000 claims description 2
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 claims description 2
- OMQHDIHZSDEIFH-UHFFFAOYSA-N 3-Acetyldihydro-2(3H)-furanone Chemical compound CC(=O)C1CCOC1=O OMQHDIHZSDEIFH-UHFFFAOYSA-N 0.000 claims description 2
- PVLKSJIUOKAUMV-UHFFFAOYSA-N 3-oxohexanal Chemical compound CCCC(=O)CC=O PVLKSJIUOKAUMV-UHFFFAOYSA-N 0.000 claims description 2
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 claims description 2
- 239000004475 Arginine Substances 0.000 claims description 2
- REIYHFWZISXFKU-UHFFFAOYSA-N Butyl acetoacetate Chemical compound CCCCOC(=O)CC(C)=O REIYHFWZISXFKU-UHFFFAOYSA-N 0.000 claims description 2
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 claims description 2
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 claims description 2
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 2
- 229910006069 SO3H Inorganic materials 0.000 claims description 2
- RHQDFWAXVIIEBN-UHFFFAOYSA-N Trifluoroethanol Chemical compound OCC(F)(F)F RHQDFWAXVIIEBN-UHFFFAOYSA-N 0.000 claims description 2
- DFPAKSUCGFBDDF-ZQBYOMGUSA-N [14c]-nicotinamide Chemical compound N[14C](=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-ZQBYOMGUSA-N 0.000 claims description 2
- 150000004729 acetoacetic acid derivatives Chemical class 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims description 2
- 150000003863 ammonium salts Chemical class 0.000 claims description 2
- 229960005070 ascorbic acid Drugs 0.000 claims description 2
- 235000010323 ascorbic acid Nutrition 0.000 claims description 2
- 239000011668 ascorbic acid Substances 0.000 claims description 2
- 235000019437 butane-1,3-diol Nutrition 0.000 claims description 2
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 claims description 2
- OILAIQUEIWYQPH-UHFFFAOYSA-N cyclohexane-1,2-dione Chemical compound O=C1CCCCC1=O OILAIQUEIWYQPH-UHFFFAOYSA-N 0.000 claims description 2
- DCZFGQYXRKMVFG-UHFFFAOYSA-N cyclohexane-1,4-dione Chemical compound O=C1CCC(=O)CC1 DCZFGQYXRKMVFG-UHFFFAOYSA-N 0.000 claims description 2
- 125000005594 diketone group Chemical group 0.000 claims description 2
- KJSZRMCHQUWQSJ-UHFFFAOYSA-N ethyl 2-oxopropanoate;2-oxopentanoic acid Chemical compound CCCC(=O)C(O)=O.CCOC(=O)C(C)=O KJSZRMCHQUWQSJ-UHFFFAOYSA-N 0.000 claims description 2
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 claims description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- FSQQTNAZHBEJLS-UPHRSURJSA-N maleamic acid Chemical class NC(=O)\C=C/C(O)=O FSQQTNAZHBEJLS-UPHRSURJSA-N 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 239000011976 maleic acid Substances 0.000 claims description 2
- GTCCGKPBSJZVRZ-UHFFFAOYSA-N pentane-2,4-diol Chemical compound CC(O)CC(C)O GTCCGKPBSJZVRZ-UHFFFAOYSA-N 0.000 claims description 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 claims description 2
- GVIIRWAJDFKJMJ-UHFFFAOYSA-N propan-2-yl 3-oxobutanoate Chemical compound CC(C)OC(=O)CC(C)=O GVIIRWAJDFKJMJ-UHFFFAOYSA-N 0.000 claims description 2
- DHGFMVMDBNLMKT-UHFFFAOYSA-N propyl 3-oxobutanoate Chemical compound CCCOC(=O)CC(C)=O DHGFMVMDBNLMKT-UHFFFAOYSA-N 0.000 claims description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 claims description 2
- JKUYRAMKJLMYLO-UHFFFAOYSA-N tert-butyl 3-oxobutanoate Chemical compound CC(=O)CC(=O)OC(C)(C)C JKUYRAMKJLMYLO-UHFFFAOYSA-N 0.000 claims description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 2
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 claims description 2
- 239000004474 valine Substances 0.000 claims description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 claims 2
- JOOWUNKQFDHPRH-IHWYPQMZSA-N (z)-n'-methylbut-2-enediamide Chemical compound CNC(=O)\C=C/C(N)=O JOOWUNKQFDHPRH-IHWYPQMZSA-N 0.000 claims 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000007513 acids Chemical class 0.000 claims 1
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- 229940114081 cinnamate Drugs 0.000 claims 1
- 229930016911 cinnamic acid Natural products 0.000 claims 1
- 235000013985 cinnamic acid Nutrition 0.000 claims 1
- 150000001924 cycloalkanes Chemical class 0.000 claims 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 claims 1
- 150000003628 tricarboxylic acids Chemical class 0.000 claims 1
- 239000012459 cleaning agent Substances 0.000 abstract description 7
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- 238000009413 insulation Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 21
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- 238000004519 manufacturing process Methods 0.000 description 8
- 238000004380 ashing Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- 238000004132 cross linking Methods 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical class CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
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- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical class CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 2
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- 235000020971 citrus fruits Nutrition 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical class CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical class CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical class CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
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- FSQQTNAZHBEJLS-OWOJBTEDSA-N (e)-4-amino-4-oxobut-2-enoic acid Chemical class NC(=O)\C=C\C(O)=O FSQQTNAZHBEJLS-OWOJBTEDSA-N 0.000 description 1
- HNSDLXPSAYFUHK-UHFFFAOYSA-N 1,4-bis(2-ethylhexyl) sulfosuccinate Chemical class CCCCC(CC)COC(=O)CC(S(O)(=O)=O)C(=O)OCC(CC)CCCC HNSDLXPSAYFUHK-UHFFFAOYSA-N 0.000 description 1
- USIJIEBVAXTHQN-UHFFFAOYSA-N 1-methyl-4-propan-2-ylcyclohexane Chemical compound CC(C)C1CCC(C)CC1.CC(C)C1CCC(C)CC1 USIJIEBVAXTHQN-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
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- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 241000207199 Citrus Species 0.000 description 1
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- 235000005979 Citrus limon Nutrition 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
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- XNPOFXIBHOVFFH-UHFFFAOYSA-N N-cyclohexyl-N'-(2-(4-morpholinyl)ethyl)carbodiimide Chemical compound C1CCCCC1N=C=NCCN1CCOCC1 XNPOFXIBHOVFFH-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
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- 229910019142 PO4 Inorganic materials 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- 150000008051 alkyl sulfates Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 229940007550 benzyl acetate Drugs 0.000 description 1
- 239000003225 biodiesel Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
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- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
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Abstract
本发明涉及一种基于多相系统的新型清洁剂,使用该清洁剂从表面去除光刻胶涂层的用途,及用于从表面去除光刻胶涂层的方法。根据本发明,该多相系统特别适用于从表面去除涂层、光刻胶涂层、聚合物层、污垢层、绝缘层和金属层。
Description
技术领域
本发明描述了基于多相系统的新型清洁剂、该清洁剂用于从表面去除光刻胶涂层的用途以及从表面去除光刻胶涂层的方法。
背景技术
根据本发明的多相系统特别适用于从表面去除涂层、光刻胶涂层、聚合物层、污垢层、绝缘层和金属层。
制造硅片是从由单晶硅制成的盘状硅片开始。晶片大约1mm厚。电路、电线和电子部件均由这些晶片层叠而成。根据所需的具体产品,制造过程需要几百个加工步骤,并且一些步骤重复多次。
为了在晶片的硅表面涂覆上所需要的结构,首先采用蒸汽将所述表面氧化。通过化学反应(采用氟化学),所述氧化层使表面结构化。
接着涂覆光刻胶。采用平版印刷的方法通过掩模版转移光刻胶。光刻胶可应用在微电子学和微系统技术中,用于生产微米和亚微米级结构,以及应用在印刷电路板制造业中。在化学术语中,这些是基于甲基丙烯酸甲酯、线型酚醛清漆、聚甲基戊二酰亚胺或环氧树脂的预聚物或聚合物与溶剂和光敏成分组合起来的混合物。
有两种基本类型的光刻胶:
●所谓的负性抗蚀剂通过光照聚合,以及视需要之后进行热稳定化,因此,显影之后,曝光区域仍然保留。被掩模版保护的未曝光区域仍然是可溶的,且可采用溶剂或碱性溶液去除。负性光刻胶主要用在微系统技术中,用于生产微米和亚微米级的极小结构。
●对于正性抗蚀剂,由于光照,已经聚合的涂层再一次变成部分可溶解(解聚)于合适的显影液中。光刻胶的其余部分保护硅或没有改变的二氧化硅表面部分,但是在曝光部分可能发生化学改性。通过这种方法,可以采用氢氟酸或CF4在刻蚀步骤去除二氧化硅,或通过离子轰击掺杂自由硅。
所描述的涂胶、曝光、剥离和刻蚀操作通常重复多次,使用不同的掩模版。
湿化学方法的应用领域分类如下:
●湿法刻蚀:
指的是去除覆盖于部分或全部表面上的掺杂的和未掺杂的氧化层。
●晶片清洁:
硅表面的颗粒物、有机物和金属物质以及自然氧化层需要连续不断地去除。
●涂层去除:
涂层下方的结构在刻蚀工序中被烧蚀之后,或该涂层已在注入工序期间被当做掩蔽层使用,这些涂层必须去除。
●金属剥离:
一种特殊的涂层去除方式,在该方式中附加的是涂覆于该涂层上的金属层也必须去除。
●背面处理:
去除在烘烤工序中在晶片背部显影的涂层。
●聚合物去除:
去除在等离子刻蚀期间出现的副产品,并收集于晶片盘中。
因此,在微芯片制造中,清洁操作是必要的。然而,迄今为止,尚没有研究提出上文所述类型的清洁的全部范围以解决这个问题。
最重要的一点是,需要不断重复清洁操作去除光刻胶。光刻胶被用作掩模层之后,一定要去除。
在现有技术中,这以两种不同的方法进行:涂层的干法等离子体灰化或湿式化学剥离,例如,借助于易燃溶剂(如丙酮)。然而,作为工艺可靠性的一部分,并且需要特别考虑到燃点问题,需要不断寻找能够与丙酮具有相同的去除光刻胶的速度的原材料。困难在于存在一个事实,溶剂的燃点越高,其去除光刻胶的速度越慢。另一个问题是,采用这种方法只能够去除轻度交联的光刻胶。随着交联度的增加,涂层的溶解度大幅度地降低。
高度交联或甚至已实现的光刻胶(掺杂之后)很难用溶剂去除,因此,它们必须通过刻蚀工序或等离子灰化去除。然而,不利地是,等离子灰化不能完全去除抗蚀剂,即灰化之后,需要实施进一步的、附加的湿式化学清洗工序。此外,灰化在高温下发生,会产生材料应力,例如,导致由具有不同膨胀系数的不同材料组成的复杂部件等的变形、热应力等等。此外,在侵蚀性自由基重组之前,自由基燃烧产物会侵蚀基质表面。其结果是,会破坏微小的结构。
生成自由基的复杂加工工艺、必要的工艺控制管理和材料的分配也会导致高的费用。
同样的,对于金属剥离,很难将涂层从衬底剥离。该方法是微电子部件、传感器或激光器制造中的标准工艺。除了光刻胶涂层,还必须剥离连续的金属涂层。
自动化程度相对比较高。普通的机器具有的晶片生产量高达80单位每小时。有批量也有单晶片加工工艺。此外,也有两者的结合,这在市场上占主导地位。将剥离器放置于可加热的水池中,加热至所需要的温度(例如,对于NMP加热至85℃)。在规定的浸泡时间(大约10至30分钟)内,溶解、熔化或剥离光刻胶。在随后的步骤中,分别将每个晶片从水浴中拿出,进行单晶片加工工艺。将光刻胶的残留物、剥离器的残留物和金属层的残留物排出。在进一步的清洗步骤中提高表面的纯度,例如,使用IPA、软化水等。
因此,对于微电子领域的清洗过程,急需一种更加环保、更有利于健康、更有效的清洁剂和衬底。
发明内容
因此,本发明的目的是提供此类清洁剂及使用此类清洁剂例如从表面去除光刻胶涂层。
这些清洁剂意图被用作由于高侵蚀性而很危险的清洁剂的替代品。采用生物可降解的、毒理学的和皮肤可接受的原料也免除了处理场所和工作防护。除了与安全相关的方面之外,目的找到新型清洁剂以实现工艺过程的最优化(关于时间和程序)。因此,有利的是可以省掉工艺步骤,例如,等离子灰化之后的湿式步骤。
根据本发明,本发明的目的是通过多相系统实现,该多相系统包括两种不互溶的液体,一种液体是水或与水相似的物质,两种液体中另外一种是不溶于水的物质,其在水中的溶解度小于4g/L,此外,包含至少一种表面活性剂、除了与表面活性剂相关的物质以外的两亲化合物,及任选的添加剂和/或辅助材料,该多相系统的特点是,其具有的浊度特征是大于0,高至200NTU。
比浊法浊度单位(NTU)是用于水处理中液体的浊度测量的单位。它是用校准的浊度计测量的液体浊度的单位。
根据本发明的一个实施例,所使用的表面活性剂是非离子表面活性剂、阳离子表面活性剂、阴离子表面活性剂或两性表面活性剂。
本发明意义中的表面活性剂是可以减少液体的表面张力或两相之间的界面张力的物质,其允许或促进分散体/乳状液的形成或能作为增溶剂。在表面活性剂的作用下,实际上彼此不能混溶的两种液体,例如,水和油,可以完全地混合(分散)。表面活性剂形成一种典型的胶束结构,即在大于一定浓度之后,它们形成相当大且松散的结构,在本申请的背景中称为“结构-形成”(“strukturbildend”)。在本发明意义中的表面活性剂具有定向结构,其中一部分通常由疏水的、憎水的碳部分组成,另一个部分由分子的亲水的、耐水部分组成。
本发明意义中的表面活性剂的实例包括但不限于高级醇,特别是具有亲水性-亲脂性分子部分的那些高级醇,例如,丁醇、戊醇、己醇、庚醇、辛醇、壬醇、癸醇、十一烷醇和十二烷醇的正、异同分异构体,或它们在分子的疏水性和/或亲水性部分中的改性的衍生物。
例如,可以作为阴离子表面活性剂是长链脂肪酸的碱金属盐或铵盐、烷基(苯)磺酸盐、链烷烃磺酸盐、二(2-乙基己基)磺基琥珀酸盐和烷基硫酸盐(主要是十二烷基硫酸钠),以及在特殊应用中(例如涉及防腐蚀性的特殊应用中),有时也可以使用烷基磷酸盐(例如,PE 65,Akzo Nobel)。
可以作为非离子表面活性剂使用的是聚氧化烯烃改性的脂肪醇(例如,型(Akzo-Nobel)和T型(Julius Hoesch))、烷基乙氧基化物(特别是选自C9-C13的正烷基-乙氧基化物或C9-C19的异烷基-乙氧基化物以及相应的辛基苯酚(triton型)或壬基苯酚(假设后者不会大量地释放到环境中))。在一个特殊领域应用中,七甲基三硅氧烷(例如,型,GE硅酮)可以作为一种能够大幅度提高液体的延展性能或显著降低界面张力的试剂。
可以作为阳离子型表面活性剂的是,例如,椰油基双(2-羟基乙基)甲基氯化铵或聚氧化乙烯改性的三烷基甲基氯化铵。也可以使用多种两性表面活性剂。如果要覆盖较宽的pH范围,经证明合适的是椰油基二甲基氧化胺(MCD,Akzo-Nobel)。
根据本发明,包含于多相系统中的表面活性剂优选地其重量占多相系统的总重量的2%至20%。
根据本发明,不溶于水的物质是那些在水中的溶解度小于4g/L,优选的,溶解度小于2g/L的物质。这些物质优选地应该具有溶胀性和/或溶解性。实例包括链烷烃(汽油)和环烷烃(优选是环己烷)。芳香族化合物,例如甲苯、二甲苯或其它烷基苯和萘也是合适的。优选地是长链的链烷酸酯,例如,脂肪油和脂肪酸甲酯(生物柴油)。进一步优选的是油,例如酯类,琥珀酸酯、己二酸酯、戊二酸酯,也可以是二-正乙酰醚、石油醚和对-薄荷烷(p-menthan)。根据本发明,所使用的不溶于水的物质也包括乙酸苄酯。然而,萜烯,例如,也可以使用具有环己烷骨架的单环的单萜烯。柑橘类水果中的萜烯,例如,柑橘属萜烯和/或橙萜烯或柠檬中含有的萜烯在这里是尤为优选的。多相系统中含有的不溶于水的物质的量优选地为1.5-30wt%。
根据一个实施例,优选的,多相系统没有二氧化碳,尤其是超临界CO2的形式的二氧化碳。
根据一个实施例,至少一个两亲化合物选自:
a)式I的二醇;
R1R2COH-(CH2)n-COHR1R2[式Ⅰ]
其中:
N可以是0、1、2、3或4,
在每种情况下,R1和R2独立地是氢或无支链的或有支链的Cl-C3烷基,前提是当n=0时,R1不是氢并且二醇不是2-甲基-2,4-戊二醇,
或选自1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、1,5-戊二醇、1,6-己二醇、2,3-丁二醇、2,4-戊二醇或2,5-二甲基-2,5-己二醇。
b)式Ⅱ的乙酰乙酸酯;
C(R3)3-CO-CH2-CO-O-R4[式Ⅱ]
其中:
在每种情况下,R3独立地是氢或Cl-C2烷基,且R4是有支链或无支链的Cl-C4烷基;
或式Ⅲ的乙酰乙酸酯;
CH3-CO-CH2-CO-O-R5[式Ⅲ]
其中,R5是Cl-C4烷基;
或选自乙酰乙酸乙酯、乙酰乙酸异丙酯、乙酰乙酸甲酯、乙酰乙酸正丁酯、乙酰乙酸正丙酯或乙酰乙酸叔丁酯;
c)式Ⅳ的二酮;
CH3-(CH2)p-CO-(CH2)q-CO-(CH2)r-CH3[式Ⅳ]
其中:
p、q、r可以独立地是0、1或2,前提是当p、q和r的总和=2时,式Ⅳ的化合物也可以是环状的(环己烷二酮),
或选自2,3-丁二酮(二乙酰基)、2,4-戊二酮(乙酰基丙酮)、3,4-己二酮、2,5-己二酮、2,3-戊二酮、2,3-己二酮、1,4-环己二酮或1,3-己二酮。
d)式V的酯;
R6-CO-O-R7[式V]
其中:
R6是连接至R7的环键、CH3或COCH3,和
R7是连接至R6的(CH2)2-O-的环键,或(CH2)2-O-(CH2)3-CH3、CH2-CH3或连接至R6的CH2-CH(CH3)-O-环键;
或选自(1-甲氧基-2-丙基)乙酸酯、(2-丁氧基乙基)乙酸酯、碳酸亚乙酯、丙酮酸乙酯(2-氧丙酸乙酯)或碳酸丙烯酯;
e)式VI的马来酸酰胺或富马酸酰胺;
R8-HN-CO-C=C-CO-O-R9[式VI]
其中:
R8是氢、有支链或无支链的Cl-C4烷基,或者有支链或无支链的、线性或环状的Cl-C6烷基,其中Cl-C6烷基被选自OH、NH2、COOH、CO、SO3H、OP(OH)2中的一个或多个基团取代,并且R9是氢或有支链或无支链的Cl-C4烷基,
或选自以下马来酸酰胺和它们的甲基酯、乙基酯、丙基酯和丁基酯:N-甲基马来酰胺(N-methyl maleamide)、N-乙基马来酰胺、N-(正丙基)-马来酰胺、N-(异丙基)-马来酰胺、N-(正丁基)-马来酰胺、N-(异丁基马来酰胺)、N-(叔丁基马来酰胺)和相应的富马酸酰胺和它们的甲基酯、乙基酯、丙基酯和丁基酯。
f)2,2-二甲氧基丙烷、丙酮酸醛-1,1-二甲基乙缩醛、二丙酮醇(2-甲基-2-戊醇-4-酮)、2-丁醇、2-乙酰基-γ-丁内酯、3-氨基-1H-1,2,4-三唑、γ-丁内酯、烟酰胺、抗坏血酸、N-乙酰基氨基酸,尤其是N-乙酰甘氨酸、-丙氨酸、-半胱氨酸、-缬氨酸或-精氨酸、磷酸三乙酯、乙酸正丁酯、二甲基亚砜或2,2,2-三氟乙醇;
两亲化合物特别优选地选自式Ⅲ的乙酰乙酸酯;
CH3-CO-CH2-CO-O-R5[式Ⅲ]
其中:
R5是Cl-C4烷基。
本发明进一步的主题涉及多相系统的用途,正如上文所描述的,用于从表面上去除光刻胶。这个表面是金属表面,优选地是硅片,已知是来自芯片制造。特别的,该表面是非金属表面,优选是硅片或玻璃晶片和/或在其上的金属表面,优选是铜或铝。光刻胶优选是交联的光刻胶。在基于光刻胶中的可交联的基团中,交联度优选大于0.5%,更优选的大于1%,更优选的大于5%,更优选的大于10%,及最优选的是大于25%。在许多情况下,是将金属层涂覆于光刻胶上。特别的,这包含高导电率的金属,例如金。
根据本发明,通过使用多相系统,除了光刻胶,同时金属层也容易剥离。未剥离的是发生在金属层与金属表面直接接触的地方,例如,硅片。因此,金属层仍保留于金属表面上。
本发明进一步的主题涉及从表面上去除光刻胶(抗蚀剂)涂层的方法,其中使用上文所述的组合物。
这个表面是非金属的或金属表面,优选是硅片或玻璃晶片,已知来自芯片制造。金属表面包括铜或铝。光刻胶优选是交联的光刻胶。在基于光刻胶中可交联的基团中,交联度优选大于0.5%,更优选的大于1%,更优选的大于5%,更优选的大于10%,及最优选的是大于25%。在许多情况下,是将金属层涂覆于光刻胶上。特别的,这包含高导电率的金属,例如金。
根据本发明,通过使用多相系统,除了光刻胶,同时金属层也容易剥离。未剥离的是发生在金属层与金属表面直接接触的地方,例如,硅片。因此,金属层仍保留于金属表面上。
该方法通过将多相系统涂覆于要处理的表面而实现,且允许其反应30秒至5小时。随后,将多相系统去除。
根据本发明,试剂的清洁作用关键在于涂料层和金属层的渗透,这通常伴随着涂料层和金属层的破碎,及将它们从基底面的剥离,其中,与现有技术相比,涂层的化学分解不是绝对必要的,相反,能有利地免去化学分解。此外,可免除或很大程度上免除物理溶解。根据本发明,这可以通过所述多相系统完成。
根据本发明,所述多相系统非常适合作为先前已知的高侵蚀性并因此具有危险的清洁剂的替代品。使用生物可降解的、毒理学的和皮肤可接受的原料,也可以免除处理场所和工作保护。除了与安全相关的方面外,关于时间和程序的工艺优化也可以通过使用新型清洁剂而实现。工艺步骤,例如,等离子灰化后的湿式步骤,可以省略。
具体实施方式
现根据典型实施例对本发明进行解释,但实施例并不用于限制保护范围。
实施例1
实施例2
所有的多相系统具有的浊度在大于0至小于或等于200NTU的范围内。浊度可以维持在10℃至95℃较宽的温度范围内。采用浊度计可以很容易地实现浊度的测定,例如,采用本领域技术人员所熟知的Hach 2100浊度计测定。
Claims (20)
1.一种多相系统,包括两种不互溶的液体,一种液体是水或与水相似的物质,两种液体中的另一种是不溶于水的物质,其在水中的溶解度小于4g/L,此外包括至少一种表面活性剂和任选的添加剂和/或辅助材料,其特征在于,多相系统的浊度值大于0至小于或等于200NTU。
2.根据权利要求1所述的多相系统,其特征在于,表面活性剂是阳离子型表面活性剂、阴离子型表面活性剂、非离子型表面活性剂或两性表面活性剂。
3.根据前述权利要求中任一项所述的多相系统,其特征在于,不溶于水的物质选自由链烷烃、环烷烃、芳香族化合物、长链链烷酸酯、二羧酸或三羧酸的酯、萜烯或它们的混合物组成的组。
4.根据前述权利要求中任一项所述的多相系统,其特征在于,多相系统中也包括一种或多种两亲化合物。
5.根据前述权利要求中任一项所述的多相系统,其特征在于,至少其中一种两亲化合物选自:
a)式I的二醇:
R1R2COH-(CH2)n-COHR1R2[式I]
其中:
N可以是0、1、2、3或4,
在每种情况下,R1和R2独立地是氢或无支链的或有支链的Cl-C3烷基,前提是当n=0时,R1不是氢并且二醇不是2-甲基-2,4-戊二醇;
或选自1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、1,5-戊二醇、1,6-己二醇、2,3-丁二醇、2,4-戊二醇或2,5-二甲基-2,5-己二醇;
b)式Ⅱ的乙酰乙酸酯;
C(R3)3-CO-CH2-CO-O-R4[式Ⅱ]
其中:
在每种情况下,R3独立地是氢或Cl-C2烷基,且R4是有支链或无支链的Cl-C4烷基;
或式Ⅲ的乙酰乙酸酯;
CH3-CO-CH2-CO-O-R5[式Ⅲ]
其中,R5是Cl-C4烷基;
或选自乙酰乙酸乙酯、乙酰乙酸异丙酯、乙酰乙酸甲酯、乙酰乙酸正丁酯、乙酰乙酸正丙酯或乙酰乙酸叔丁酯;
c)式Ⅳ的二酮;
CH3-(CH2)p-CO-(CH2)q-CO-(CH2)r-CH3[式IV]
其中:
p、q、r可以独立地是0、1或2,前提是当p、q和r的总和=2时,式Ⅳ的化合物也可以是环状的(环己烷二酮),
或选自2,3-丁二酮(二乙酰基)、2,4-戊二酮(乙酰基丙酮)、3,4-己二酮、2,5-己二酮、2,3-戊二酮、2,3-己二酮、1,4-环己二酮或1,3-己二酮;
d)式V的酯;
R6-CO-O-R7[式V]
其中:
R6是连接至R7的环键、CH3或COCH3,和
R7是连接至R6的(CH2)2-O-的环键,或(CH2)2-O-(CH2)3-CH3、CH2-CH3或连接至R6的CH2-CH(CH3)-O-环键;
或选自(1-甲氧基-2-丙基)乙酸酯、(2-丁氧基乙基)乙酸酯、碳酸亚乙酯、丙酮酸乙酯(2-氧丙酸乙酯)或碳酸丙烯酯;
e)式VI的马来酸酰胺或富马酸酰胺;
R8-HN-CO-C=C-CO-O-R9[式VI]
其中:
R8是氢、有支链或无支链的Cl-C4烷基,或者有支链或无支链的、线性或环状的Cl-C6烷基,其中Cl-C6烷基被选自OH、NH2、COOH、CO、SO3H、OP(OH)2中的一个或多个基团取代,并且R9是氢或有支链或无支链的Cl-C4烷基,
或选自以下马来酸酰胺和它们的甲基酯、乙基酯、丙基酯和丁基酯:N-甲基马来酰胺、N-乙基马来酰胺、N-(正丙基)-马来酰胺、N-(异丙基)-马来酰胺、N-(正丁基)-马来酰胺、N-(异丁基马来酰胺)、N-(叔丁基马来酰胺)和相应的富马酸酰胺和它们的甲基酯、乙基酯、丙基酯和丁基酯;
f)酸、铵盐和它们的胺盐,及它们的酰胺,特别是肉桂酸和肉桂酸盐,及
f)2,2-二甲氧基丙烷、丙酮酸醛-1,1-二甲基乙缩醛、二丙酮醇(2-甲基-2-戊醇-4-酮)、2-丁醇、2-乙酰基-γ-丁内酯、3-氨基-1H-1,2,4-三唑、γ-丁内酯、烟酰胺、抗坏血酸、N-乙酰基氨基酸,尤其是N-乙酰甘氨酸、-丙氨酸、-半胱氨酸、-缬氨酸或-精氨酸、磷酸三乙酯、乙酸正丁酯、二甲基亚砜或2,2,2-三氟乙醇。
6.根据前述权利要求中任一项所述的多相系统,其特征在于,两亲化合物选自式Ⅲ的乙酰乙酸酯:
CH3-CO-CH2-CO-O-R5[式Ⅲ]
其中,
R5是Cl-C4烷基。
7.根据权利要求1-6中任一项所述的多相系统用于从表面去除光刻胶的用途。
8.根据权利要求7所述的用途,其中表面是非金属表面,优选是硅片或玻璃晶片和/或在其上的金属表面,优选是铜或铝。
9.根据权利要求7或8所述的用途,其中光刻胶是交联的光刻胶。
10.根据权利要求7-9中任一项所述的用途,其中金属层涂覆于光刻胶上。
11.根据权利要求10所述的用途,其中采用多相系统剥离位于光刻胶上的金属层。
12.根据权利要求10或11所述的用途,其中金属层仍然在金属表面上。
13.一种从表面上去除光刻胶涂层的方法,其中采用权利要求1-7中任一项所述的组合物。
14.根据权利要求13所述的方法,其中表面是金属表面,优选是硅片。
15.根据权利要求13或14所述的方法,其中光刻胶是交联的光刻胶。
16.根据权利要求13-15中任一项所述的方法,其中金属层涂覆于光刻胶上。
17.根据权利要求16所述的方法,其中采用多相系统将剥离位于光刻胶上的金属层。
18.根据权利要求16或17所述的方法,其中金属层仍然在金属表面上。
19.根据权利要求13-18中任一项所述的方法,其中多相系统涂覆于要处理的表面上,且反应30秒至5小时的时间。
20.根据权利要求19所述的方法,其中多相系统可以去除。
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PCT/EP2014/071915 WO2015052347A1 (de) | 2013-10-11 | 2014-10-13 | Fotoresist-stripping mit intelligenten flüssigkeiten |
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DE102015120611A1 (de) * | 2015-11-27 | 2017-06-01 | Bubbles & Beyond Gmbh | Reinigungszusammensetzung und ihre Verwendung als Felgenreiniger |
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KR20220136990A (ko) * | 2021-03-30 | 2022-10-11 | 텐센트 테크놀로지(센젠) 컴퍼니 리미티드 | 포토레지스트 제거 방법 및 포토레지스트 제거 시스템 |
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US10053655B2 (en) | 2018-08-21 |
WO2015052347A1 (de) | 2015-04-16 |
KR20160068917A (ko) | 2016-06-15 |
JP2017504076A (ja) | 2017-02-02 |
SG11201602790TA (en) | 2016-05-30 |
JP6881978B2 (ja) | 2021-06-02 |
EP3055401A1 (de) | 2016-08-17 |
EP3055401B1 (de) | 2022-11-23 |
JP7022226B2 (ja) | 2022-02-17 |
US20160230130A1 (en) | 2016-08-11 |
MY179045A (en) | 2020-10-26 |
CN105980540B (zh) | 2020-04-14 |
JP2022078039A (ja) | 2022-05-24 |
JP2021091903A (ja) | 2021-06-17 |
KR102360820B1 (ko) | 2022-02-09 |
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