CN105977184B - 接合装置及接合方法 - Google Patents

接合装置及接合方法 Download PDF

Info

Publication number
CN105977184B
CN105977184B CN201610122439.0A CN201610122439A CN105977184B CN 105977184 B CN105977184 B CN 105977184B CN 201610122439 A CN201610122439 A CN 201610122439A CN 105977184 B CN105977184 B CN 105977184B
Authority
CN
China
Prior art keywords
bare die
reference mark
photographic unit
camera
mounting position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610122439.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN105977184A (zh
Inventor
牧浩
坂本秀章
山本启太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jie Jin Science And Technology Ltd
Original Assignee
Jie Jin Science And Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jie Jin Science And Technology Ltd filed Critical Jie Jin Science And Technology Ltd
Publication of CN105977184A publication Critical patent/CN105977184A/zh
Application granted granted Critical
Publication of CN105977184B publication Critical patent/CN105977184B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201610122439.0A 2015-03-11 2016-03-03 接合装置及接合方法 Active CN105977184B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015048178A JP6510838B2 (ja) 2015-03-11 2015-03-11 ボンディング装置及びボンディング方法
JP2015-048178 2015-03-11

Publications (2)

Publication Number Publication Date
CN105977184A CN105977184A (zh) 2016-09-28
CN105977184B true CN105977184B (zh) 2019-02-15

Family

ID=56984120

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610122439.0A Active CN105977184B (zh) 2015-03-11 2016-03-03 接合装置及接合方法

Country Status (4)

Country Link
JP (1) JP6510838B2 (ko)
KR (1) KR101793366B1 (ko)
CN (1) CN105977184B (ko)
TW (1) TWI647767B (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6316340B2 (ja) * 2016-06-02 2018-04-25 株式会社カイジョー ボンディング装置、ボンディング方法及びボンディング制御プログラム
JP6705727B2 (ja) * 2016-09-26 2020-06-03 ファスフォードテクノロジ株式会社 フリップチップボンダおよび半導体装置の製造方法
US11031367B2 (en) * 2016-10-25 2021-06-08 Kulicke and Soffa Industries, In. Bond head assemblies including reflective optical elements, related bonding machines, and related methods
CN106373914B (zh) * 2016-11-10 2020-03-24 北京中电科电子装备有限公司 一种芯片键合装置
TWI662638B (zh) * 2017-04-21 2019-06-11 台灣愛司帝科技股份有限公司 半導體晶片修補方法以及半導體晶片修補裝置
JP7164314B2 (ja) 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
KR102408524B1 (ko) 2017-09-19 2022-06-14 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법
JP7033878B2 (ja) * 2017-10-16 2022-03-11 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP7018341B2 (ja) 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
US11031368B2 (en) * 2018-05-14 2021-06-08 Panasonic Intellectual Property Management Co., Ltd. Bonding apparatus
US10861819B1 (en) * 2019-07-05 2020-12-08 Asm Technology Singapore Pte Ltd High-precision bond head positioning method and apparatus
JP7291586B2 (ja) * 2019-09-19 2023-06-15 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR102350557B1 (ko) * 2020-03-06 2022-01-14 세메스 주식회사 다이 본딩 방법 및 다이 본딩 장치
TWI792785B (zh) * 2020-12-31 2023-02-11 南韓商Ｔｅｓ股份有限公司 基板接合裝置及基板接合方法
WO2023181346A1 (ja) * 2022-03-25 2023-09-28 株式会社Fuji 検査支援装置、生産管理システム、および検査支援方法
JP7292463B1 (ja) * 2022-03-29 2023-06-16 キヤノンマシナリー株式会社 位置合わせ装置、位置合わせ方法、ボンディング装置、ボンディング方法、および半導体装置製造方法
WO2024161507A1 (ja) * 2023-01-31 2024-08-08 株式会社日立ハイテク 搬送方法、搬送装置および解析システム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1194456A (zh) * 1997-03-26 1998-09-30 财团法人工业技术研究院 晶片接合方法与装置
TW200929425A (en) * 2007-10-09 2009-07-01 Oerlikon Assembly Equipment Ag Steinhausen Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate
CN103000558A (zh) * 2011-09-15 2013-03-27 株式会社日立高新技术仪器 芯片接合机以及接合方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252303A (ja) * 1999-02-26 2000-09-14 Shibaura Mechatronics Corp ペレットボンディング方法
JP2003092313A (ja) * 2001-09-19 2003-03-28 Nec Machinery Corp チップ反転装置およびダイボンダ
JP2003249797A (ja) * 2002-02-25 2003-09-05 Toray Eng Co Ltd 実装装置および実装装置におけるアライメント方法
JP2007115851A (ja) * 2005-10-19 2007-05-10 Toshiba Corp 半導体部品の位置検査方法、位置検査装置および半導体装置の製造方法
KR101303024B1 (ko) * 2012-02-23 2013-09-03 한미반도체 주식회사 플립칩 본딩장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1194456A (zh) * 1997-03-26 1998-09-30 财团法人工业技术研究院 晶片接合方法与装置
TW200929425A (en) * 2007-10-09 2009-07-01 Oerlikon Assembly Equipment Ag Steinhausen Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate
CN103000558A (zh) * 2011-09-15 2013-03-27 株式会社日立高新技术仪器 芯片接合机以及接合方法

Also Published As

Publication number Publication date
CN105977184A (zh) 2016-09-28
KR101793366B1 (ko) 2017-11-02
JP2016171107A (ja) 2016-09-23
TW201701379A (zh) 2017-01-01
JP6510838B2 (ja) 2019-05-08
KR20160110110A (ko) 2016-09-21
TWI647767B (zh) 2019-01-11

Similar Documents

Publication Publication Date Title
CN105977184B (zh) 接合装置及接合方法
CN106057704B (zh) 接合装置及接合方法
CN102646572B (zh) 芯片焊接机以及半导体制造方法
CN101794721B (zh) 半导体晶圆的定位装置
CN110364455B (zh) 芯片贴装装置及半导体装置的制造方法
CN105977183B (zh) 贴装装置及贴装方法
CN110036462A (zh) 半导体装置的制造方法以及封装装置
CN109075104B (zh) 用于翻转及多次检测电子装置的转送系统
JP2004288792A (ja) アライメント装置及びアライメント方法
CN109906029A (zh) 电子部件安装装置以及电子部件安装方法
KR20140054728A (ko) 전자부품 실장장치의 교정방법
TWI516759B (zh) 半導體封裝的印刷電路板之檢測方法
KR101237056B1 (ko) 반도체 패키지 집합체 정렬방법
JP6438826B2 (ja) ボンディング装置及びボンディング方法
KR20140022582A (ko) 플립칩 본딩장치 및 본딩장치의 교정방법
US20210043488A1 (en) Alignment apparatus and method of manufacturing semiconductor device
SG185017A1 (en) Method for aligning semiconductor materials
US11031367B2 (en) Bond head assemblies including reflective optical elements, related bonding machines, and related methods
JP2009010307A (ja) ボンディング装置
KR102538843B1 (ko) 반도체 소자 테스트 방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant