CN105904507A - 切削装置 - Google Patents

切削装置 Download PDF

Info

Publication number
CN105904507A
CN105904507A CN201610094653.XA CN201610094653A CN105904507A CN 105904507 A CN105904507 A CN 105904507A CN 201610094653 A CN201610094653 A CN 201610094653A CN 105904507 A CN105904507 A CN 105904507A
Authority
CN
China
Prior art keywords
cutting
unit
plate workpiece
chuck table
burr removing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610094653.XA
Other languages
English (en)
Chinese (zh)
Inventor
植山博光
栗村茂也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN105904507A publication Critical patent/CN105904507A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D9/00—Cutting apparatus combined with punching or perforating apparatus or with dissimilar cutting apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/06—Grooving involving removal of material from the surface of the work
    • B26D3/065—On sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
CN201610094653.XA 2015-02-23 2016-02-19 切削装置 Pending CN105904507A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015032799A JP6486710B2 (ja) 2015-02-23 2015-02-23 切削装置
JP2015-032799 2015-02-23

Publications (1)

Publication Number Publication Date
CN105904507A true CN105904507A (zh) 2016-08-31

Family

ID=56745032

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610094653.XA Pending CN105904507A (zh) 2015-02-23 2016-02-19 切削装置

Country Status (4)

Country Link
JP (1) JP6486710B2 (ja)
KR (1) KR102365978B1 (ja)
CN (1) CN105904507A (ja)
TW (1) TWI669201B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6909621B2 (ja) * 2017-04-24 2021-07-28 株式会社ディスコ ウォータージェット加工装置
JP7169061B2 (ja) * 2017-11-29 2022-11-10 株式会社ディスコ 切削方法
JP7072986B2 (ja) * 2018-05-29 2022-05-23 株式会社ディスコ ウォータージェット加工装置
JP7340911B2 (ja) 2018-08-17 2023-09-08 株式会社ディスコ パッケージ基板の加工方法
JP2023180400A (ja) 2022-06-09 2023-12-21 株式会社ディスコ バリ除去装置及び切削装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0957692A (ja) * 1995-08-25 1997-03-04 Toshiba Chem Corp 半導体封止用樹脂シートの切断方法及び切断装置
CN101337400A (zh) * 2007-07-05 2009-01-07 株式会社迪思科 切削装置
JP2013144324A (ja) * 2012-01-13 2013-07-25 Disco Corp 切削装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57126139A (en) * 1981-01-27 1982-08-05 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS6480506A (en) * 1987-09-24 1989-03-27 Hitachi Ltd Dicer
JPH03149183A (ja) * 1989-11-02 1991-06-25 Nec Yamaguchi Ltd 半導体基板の切削方法
JP3725226B2 (ja) 1996-01-22 2005-12-07 リックス株式会社 ウォータジェット樹脂バリ取り装置
JP4394210B2 (ja) 1999-09-08 2010-01-06 株式会社ディスコ 切削方法
JP2001345287A (ja) * 2000-05-31 2001-12-14 Hitachi Ltd 半導体装置の製造方法
JP4540421B2 (ja) 2004-07-28 2010-09-08 株式会社ディスコ ダイシング方法
JP2007125667A (ja) * 2005-11-07 2007-05-24 Disco Abrasive Syst Ltd 基板の切断装置
KR20090024408A (ko) * 2007-09-04 2009-03-09 삼성전자주식회사 스크라이브 래인 내의 금속 버를 제거하는 노즐을 갖는웨이퍼 소잉 장치, 웨이퍼 소잉 방법 및 이를 이용하여제작된 반도체 패키지
JP2010123823A (ja) * 2008-11-21 2010-06-03 Disco Abrasive Syst Ltd 切削装置
JP5875331B2 (ja) * 2011-11-08 2016-03-02 株式会社ディスコ 切削装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0957692A (ja) * 1995-08-25 1997-03-04 Toshiba Chem Corp 半導体封止用樹脂シートの切断方法及び切断装置
CN101337400A (zh) * 2007-07-05 2009-01-07 株式会社迪思科 切削装置
JP2013144324A (ja) * 2012-01-13 2013-07-25 Disco Corp 切削装置

Also Published As

Publication number Publication date
KR20160102888A (ko) 2016-08-31
TW201641246A (zh) 2016-12-01
KR102365978B1 (ko) 2022-02-22
JP2016157722A (ja) 2016-09-01
JP6486710B2 (ja) 2019-03-20
TWI669201B (zh) 2019-08-21

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Legal Events

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C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160831

WD01 Invention patent application deemed withdrawn after publication