CN105900224B - 焊接凸点的形成方法及焊球固定用焊膏 - Google Patents
焊接凸点的形成方法及焊球固定用焊膏 Download PDFInfo
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- CN105900224B CN105900224B CN201580003945.1A CN201580003945A CN105900224B CN 105900224 B CN105900224 B CN 105900224B CN 201580003945 A CN201580003945 A CN 201580003945A CN 105900224 B CN105900224 B CN 105900224B
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- soldered ball
- soldering paste
- pedestal
- powder
- welding powder
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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Abstract
本发明的焊接凸点的形成方法具有:在基板的电极上涂布焊膏,并且在所述焊膏上搭载焊球而使该焊球临时固定的工序;接着,对所述焊膏及所述焊球进行回流处理的工序。该焊球固定用焊膏含有焊粉和助焊剂,焊粉的平均粒径为0.1μm~10μm,助焊剂的混合量为75体积%~93体积%。
Description
技术领域
本发明涉及一种为了通过倒装芯片装配等将半导体设备连接于基板上而使用焊球形成焊接凸点的方法。
本申请主张基于2014年5月20日于日本申请的专利申请2014-104345号的优先权,并将其内容援用于此。
背景技术
近年来,伴随着网络信息社会的快速发展,作为对应于半导体设备的高功能化/小型化的高密度芯片的装配方法正在普及倒装芯片装配。该倒装芯片装配中有使用焊球来形成为了连接半导体设备而设置于晶圆、内插板上的焊接凸点的方法。焊球为小球状的焊料,搭载于晶圆、内插板的电极上而使用。
通常,晶圆与内插板之间的凸点被称作内凸点,内插板经由内凸点装配于晶圆(倒装芯片装配)。另一方面,内插板与母基板之间的凸点被称作外凸点。该外凸点是使用比内凸点大的焊球而形成的,内插板通过外凸点而与母基板接合。
作为内凸点,在将焊球搭载于晶圆、内插板时,首先在电极上印刷用于临时固定焊球的助焊剂,之后搭载焊球。而且,在氮气氛中的回流炉中焊球被熔融而成为凸点。然而,由于助焊剂在回流处理时软化并流动,因此所搭载的焊球也流动。由此,焊球从电极上滚落而有可能无法形成凸点。并且,尤其在窄间距(间隔狭窄的间距)中彼此相邻的焊球有可能熔融并结合,有时构成焊接凸点的高度偏差的原因。
专利文献1中公开有为了防止电极表面的氧化及提高焊球的润湿性等,通过印刷等在电极上涂布预涂用焊膏而进行回流处理,从而在电极上形成薄而均匀且平滑性优异的预涂层,在该预涂层上搭载焊球进行回流处理。
由此,预涂层对电极发挥较大的润湿性,因此在进行焊球的回流处理时,预涂层的焊料和焊球的焊料彼此熔融而能够在电极上适当地形成焊接凸点。并且,由于形成平滑而均匀的预涂层,因此可推断也能够减少回流处理时的焊球的流动。
专利文献1中记载的预涂处理的方法以往主要作为外凸点的形成方法而已知。当然,也是作为内凸点的形成方法而使用的技术。但要求一种使用焊球的更简单且更可靠的内凸点及外凸点的形成方法。
专利文献1:日本专利公开2012-179624号公报
发明内容
在这种背景下,本发明的目的在于,代替通过印刷助焊剂而搭载和固定焊球的方法、和实施专利文献1中记载的预涂处理而搭载和接合焊球的方法,提供一种能够更简单且更可靠地临时固定焊球并提高成品率及高度精度的焊接凸点(内凸点或外凸点)的形成方法及用于固定焊球的焊膏。
本发明的一方式所涉及的焊接凸点的形成方法,具有:在基板的电极上涂布焊膏,并且在所述焊膏上搭载焊球而使该焊球临时固定的工序;接着,对所述焊膏及所述焊球进行回流处理的工序。
即,通过焊膏的粘结力将焊球临时固定于电极上。并且,在焊膏含有焊粉的情况下,在进行回流处理时,与现有技术中仅通过助焊剂来临时固定焊球的情况不同,该焊粉与焊球一同熔融而成为一体。因此焊球不会滚落。另外,作为基板包括上述晶圆、内插板中的任一种。
在本发明的一方式所涉及的焊接凸点的形成方法中,所述焊膏含有焊粉,所述焊粉的平均粒径可以为0.1μm~10μm。
若焊粉的平均粒径过大,则在电极上的涂布厚度(焊膏的涂膜的厚度)上有可能产生高度偏差,搭载于该焊膏上的焊球上容易产生倾斜。并且,若焊粉的平均粒径过大,则也容易产生空穴。另一方面,若焊粉的平均粒径过小,则不易制造焊粉,并且在回流处理时不易熔融。从这种观点考虑,焊粉的平均粒径优选为0.1μm~10μm。
在本发明的一方式所涉及的焊接凸点的形成方法中,所述焊膏含有助焊剂,所述焊膏中的所述助焊剂的混合量可以为75体积%~93体积%。
若助焊剂的量过多,则成为与现有技术中仅通过助焊剂来临时固定焊球的情况相同的状态,因此焊球容易滚落。若助焊剂的量过少,则相对地焊粉的量增多,因此有可能在焊膏的涂膜厚度上产生高度偏差。从这种观点考虑,焊膏中的助焊剂量优选为75体积%~93体积%。
本发明的一方式所涉及的焊球固定用焊膏含有焊粉和助焊剂,所述焊粉的平均粒径为0.1μm~10μm,所述助焊剂的混合量为75体积%~93体积%。
通过使用含有这种焊粉和助焊剂的焊膏而能够简单且可靠地临时固定焊球。
根据本发明的一方式,能够以通过涂布焊膏而搭载焊球的简单的方法来临时固定焊球且能够防止焊球滚落,从而可靠地形成焊接凸点(内凸点、外凸点),并能够提高成品率、高度精度。
附图说明
图1是依次表示利用本发明的一实施方式的方法形成凸点电极的工序的剖视图。
具体实施方式
以下,参考附图对本发明的实施方式进行说明。在此,针对内凸点在内插板上形成的情况(内插板中,在形成内凸点的部位形成焊接凸点的情况)进行记载。虽然在此未记载,但针对内凸点在晶圆一侧形成的情况(晶圆中,在形成内凸点的部位形成焊接凸点的情况)、针对外凸点的情况(在内插板和母基板中,在形成外凸点的部位形成焊接凸点的情况)也无太大区别,均能够应用本实施方式。
图1的(d)表示应用本实施方式的方法而形成的凸点电极10,在基板1的电极焊盘2上形成有焊接凸点3。在倒装芯片装配中形成多个焊接凸点,但在图1中仅记载了1个焊接凸点3。
基板1具备半导体封装用有机基板和形成于该有机基板表面上的电路层、绝缘层等。在基板1的表面露出电极焊盘2。电极焊盘2也可以使用Sn或Au/Ni/Cu等金属化层,但优选使用Cu或涂布有抗氧化膜的Cu。
并且,作为成为焊接凸点3的焊球、焊球固定用焊膏的材料,优选由Sn和添加成分构成的Sn类合金,如Sn-Ag合金、Pb-Sn合金、Sn-Bi合金、Sn-Zn合金、Sn-Sb合金、Sn-Cu合金、Sn-Ag-Cu合金等。更具体而言,可以举出具有后述实施例中所记载组成的合金。
接着,关于在基板1上制造如此构成的凸点电极10的方法(凸点的形成方法),按照图1所示的工序顺序进行说明。
(抗蚀层形成工序)
首先,在基板1上形成抗蚀层11,通过对该抗蚀层11实施曝光、显影处理,在抗蚀层11中相当于各电极焊盘2的位置上形成开口部12(图1的(a))。由此成为各电极焊盘2的上表面经由开口部12而露出的状态。该抗蚀层11的厚度设为例如15μm~20μm,开口部12的内径对应于所得到的焊接凸点3的外径而设定。
(焊膏涂布工序)
接着,如图1的(b)所示,用厚度10μm~30μm的模板掩模13来覆盖抗蚀层11的上表面。另外,在模板掩模13上相当于抗蚀层11的开口部12且填充焊膏14的部分设置有开口部。在用模板掩模13覆盖抗蚀层11的状态下,通过丝网印刷从基板1的抗蚀层11的上方涂布焊膏14,从而将焊膏14填充于抗蚀层11的开口部12内。
该焊膏(本实施方式的焊球固定用焊膏)14含有焊粉和助焊剂,并具有粘结性。
焊粉通过雾化法等而制造,该材料可以从上述合金中进行选择,但由与后述的焊球15相同的材料构成。焊粉的平均粒径为0.1μm~10μm,优选为2μm~6μm。
并且,助焊剂含有松香等树脂成分、活性剂、触变剂及溶剂,能够使用无卤型、活性(RA)型、弱活性(RMA)型、水溶性型等助焊剂。
作为助焊剂中的树脂成分,可以举出脂松香、木松香、浮油松香、歧化松香、聚合松香、氢化松香及它们的衍生物等松香类、以及它们的改性物即松香类改性树脂等。
作为活性剂,可以举出有机酸、非解离性含卤化合物、解离型含卤化合物、胺类、咪唑类等。
作为有机酸,可以举出丙酸、丁酸、戊酸、己酸、庚酸、癸酸、月桂酸、肉豆蔻酸、十五烷酸、棕榈酸、十七烷酸、硬脂酸、结核硬脂酸、花生酸、山萮酸、木蜡酸、乙醇酸、草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、富马酸、马来酸、酒石酸、二甘醇酸、二聚酸、乙酰丙酸、乳酸、丙烯酸、苯甲酸、水杨酸、茴香酸、柠檬酸、吡啶甲酸等。
作为非解离性含卤化合物,可以举出2,3-二溴丙醇、2,3-二溴丁烷二醇、1,4-二溴-2-丁醇、三溴新戊醇等溴化醇;1,3-二氯-2-丙醇、1,4-二氯-2-丁醇等氯化醇;3-氟邻苯二酚等氟化醇;及其它此类化合物。
作为解离型含卤化合物,可以举出甲胺、二甲胺、三甲胺、乙胺、二乙胺、三乙胺、正丙基胺、二正丙基胺、三正丙基胺、异丙胺、二异丙胺、丁胺、二丁胺、三丁胺、环己胺、单乙醇胺、二乙醇胺、三乙醇胺等碳原子数较小的胺的氢氯酸盐及氢溴酸盐;咪唑、2-甲基咪唑、2-乙基咪唑、2-甲基-4-甲基咪唑、2-甲基-4-乙基咪唑、2-乙基-4-乙基咪唑、2-丙基咪唑、2-丙基-4-丙基咪唑等咪唑的氢氯酸盐及氢溴酸盐等。
作为触变剂,可以举出饱和脂肪酸酰胺、饱和脂肪酸二酰胺类;二亚苄基山梨醇类;氢化蓖麻油等。
作为溶剂,可以举出己基二乙二醇、(2-乙基己基)二乙二醇、苯基乙二醇、丁基卡必醇、辛二醇、α萜品醇、β萜品醇、四乙二醇二甲醚、偏苯三酸三(2-乙基己基)酯、癸二酸双(2-乙基己基)酯等。
助焊剂中的树脂成分的含量为30质量%~50质量%,优选为40质量%~50质量%。
助焊剂中的活性剂的含量为0.1质量%~5质量%,优选为0.5质量%~3质量%。
助焊剂中的触变剂的含量为0质量%~10质量%,优选为3质量%~8质量%。
助焊剂中的溶剂的含量为30质量%~65质量%,优选为40质量%~60质量%。
焊粉和助焊剂的混合比率设定为助焊剂的混合量(混合比率)成为75体积%~93体积%。助焊剂的混合量优选为75体积%~89体积%。
即,与使用于通常的焊接凸点形成用焊膏中的焊粉不同,该焊膏14的平均粒径较小,并且助焊剂的混合比率(混合量)也大。
以填埋开口部12内部的方式涂布焊膏14,接着,去除模板掩模13,则焊膏14被涂布为具有从抗蚀层11的开口部12向上方稍微突出相当于模板掩模13的厚度的状态。作为该焊膏14的涂布量,建议涂布厚度成为5μm~30μm的量。在此,焊膏14的涂布厚度为从抗蚀层11的上表面突出的部分的厚度,涂布厚度优选为5~20μm。
(焊球搭载工序)
在焊膏14未干燥期间,使用焊球搭载机(省略图示)将焊球15搭载于焊膏14上(图1的(c))。如上所述,在基板1上的抗蚀层11上形成有多个开口部12,在各开口部12搭载有焊球15。
该焊球15也取决于凸点之间的间隔(距离),但使用例如孔径为70μm~90μm的焊球。
若将该焊球15搭载于焊膏14上,则如图1的(c)所示通过其重量而成为焊球15的一部分沉入焊膏14内的状态。由于焊膏14具有粘结性,因此焊膏14粘结于焊球15的下表面。由此焊球15临时固定于焊膏14上。另外,焊膏14通常不会干燥固化,如上所述,焊球15通过焊膏14的粘结性而被临时固定。
(回流处理工序)
接着,进行回流处理,加热焊膏14及焊球15以使其熔融。该回流处理在氮气氛、低氧气氛或还原气氛中进行加热。加热温度(回流处理温度)设定为比使用于焊球及焊膏的焊料的熔点(液相线温度)高30℃~50℃的温度。
在该回流处理中,包含于焊膏14中的助焊剂去除焊膏14中的焊粉及焊球15表面的氧化膜和污垢,之后,被熔融的焊粉和焊球15润湿电极而形成凸点。
通过该回流处理,如图1的(d)所示,在基板1的电极焊盘2上形成焊接凸点3,形成凸点电极10。
另外,在该回流处理工序中,也可以加热到达到回流处理温度(焊料的熔点(液相线温度)+30℃~50℃)的升温分布成为两个阶段以上的温度分布,也可以利用在温度到达焊料熔融温度为止的期间附带以低于焊料熔融温度的温度保持规定时间的预热处理的温度分布。
如此,利用焊膏的粘结力临时固定焊球,因此能够稳定地搭载焊球。并且,在回流处理时,也与仅通过助焊剂临时固定焊球的情况不同,焊膏中的焊粉熔融而与焊球成为一体化,因此焊球不会滚落。
该情况下,由于焊膏中的焊粉的平均粒径为0.1μm~10μm而较小,因此在涂布焊膏时的厚度(涂布厚度)上很少产生偏差,也能够防止空穴的产生。并且,由于焊膏中的助焊剂的混合比率(混合量)较大,因此同样在涂布厚度上很少产生偏差。
从而,能够减小通过回流处理得到的焊接凸点的高度偏差,有利于高密度的装配。
实施例
焊球及焊球固定用焊膏中使用了相同种类的焊料(焊料合金)。作为焊料合金使用了Sn-3.0质量%Ag-0.5质量%Cu(缩写为SAC305)、Sn-0.7质量%Cu或Pb-63质量%Sn。使用具有表1所示的平均粒径的焊粉,并以表1的助焊剂的混合比率来混合焊粉和助焊剂,从而制作出焊膏。在厚度为20μm的抗蚀层上形成2000个直径为75μm的开口部。对这些开口部内涂布了焊膏。接着,搭载了直径为90μm的焊球。该焊球具有与焊球固定用焊膏中的焊粉相同的组成。
并且,在氮气氛下,以比焊料的熔点高30℃的温度实施了60秒钟的回流处理工序。接着,确认焊球是否滚落,并且测定出焊接凸点的高度偏差。
将焊球滚落的状态称作漏失,将产生5个以上该漏失的试料评价为D(差)。将产生1~4个漏失的试料评价为C(一般)。将未产生漏失的试料称作B(好)。
如下评价焊接凸点的高度偏差。测定各焊接凸点的高度而求出其标准偏差σ。将3σ的值小于10μm的试料评价为A(优异)。将3σ的值为10μm以上且小于15μm,且在焊接凸点的高度上确认到若干偏差的试料评价为B(好)。将3σ的值为15μm以上的试料评价为C(一般)。
将这些结果示于表1中。另外,表1中的“焊粉的熔点”为构成焊粉的焊料合金的熔点。
[表1]
如该表1所示,通过将焊球搭载于焊膏上进行回流处理而能够防止产生焊球的滚落。并且通过调整焊粉的平均粒径和助焊剂混合量能够进一步抑制焊球的滚落,且能够抑制焊接凸点的高度偏差。
另外,本发明并不限定于上述实施方式,在不脱离本发明的主旨的范围内可追加各种变更。
产业上的可利用性
通过本实施方式的焊接凸点的形成方法及焊球固定用焊膏能够以简单的方法临时固定焊球,并能够防止焊球的滚落。并且,能够抑制焊接凸点的高度偏差。由此,能够以高成品率形成高精度的焊接凸点(内凸点、外凸点)。从而本实施方式的焊接凸点的形成方法及焊球固定用焊膏能够适当地适用于倒装芯片装配的工序中。
符号说明
1-基板,2-电极焊盘,3-焊接凸点,10-凸点电极,11-抗蚀层,12-开口部,13-模板掩模,14-焊膏,15-焊球。
Claims (3)
1.一种焊接凸点的形成方法,其特征在于,具有:
在基板的电极上涂布焊膏,并且在所述焊膏上搭载焊球而使该焊球临时固定的工序;及
接着,对所述焊膏及所述焊球进行回流处理的工序,
所述焊膏含有焊粉,所述焊粉和所述焊球为相同的焊料种类,通过所述回流处理,所述焊粉与所述焊球成为一体,
所述焊膏含有助焊剂,所述焊膏中的所述助焊剂的混合量为75体积%~93体积%。
2.根据权利要求1所述的焊接凸点的形成方法,其特征在于,
所述焊粉的平均粒径为0.1μm~10μm。
3.一种焊球固定用焊膏,其为用于固定焊球的焊球固定用焊膏,其特征在于,
所述焊球固定用焊膏含有焊粉和助焊剂,所述焊粉的平均粒径为0.1μm~10μm,所述助焊剂的混合量为75体积%~93体积%,
所述焊粉和所述焊球为相同的焊料种类。
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