CN105870091B - 具有悬伸部分的半导体封装 - Google Patents

具有悬伸部分的半导体封装 Download PDF

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CN105870091B
CN105870091B CN201510033748.6A CN201510033748A CN105870091B CN 105870091 B CN105870091 B CN 105870091B CN 201510033748 A CN201510033748 A CN 201510033748A CN 105870091 B CN105870091 B CN 105870091B
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conducting wire
main structure
structure body
film
semiconductor packages
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CN105870091A (zh
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全湧泰
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SK Hynix Inc
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Hynix Semiconductor Inc
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Abstract

具有悬伸部分的半导体封装。一种半导体封装可包含一基板、以及一设置在所述基板之上的结构主体。所述半导体封装可包含一半导体芯片，其被堆叠在所述结构主体之上，并且具有一突出在所述结构主体的一侧表面之上而且在所述结构主体的所述侧表面之上悬伸出的悬伸部分。所述半导体封装可包含一或多个设置在所述悬伸部分上的接合焊盘、以及一条或多条将所述接合焊盘电连接至基板的导线。所述半导体封装可包含一固定导线的膜，其被附接到所述结构主体之上而且在所述结构主体的所述侧表面之上悬伸出，以固定所述一条或多条导线。

Description

具有悬伸部分的半导体封装
相关申请的交叉引用
本申请案主张2014年8月21日在韩国知识产权申请的韩国专利申请案号10-2014-108716的优先权，所述申请案以其整体被纳入在此作为参考。
技术领域
各种的实施例是大致有关于一种半导体技术，并且更具体而言是有关于一种具有悬伸(overhang)部分的半导体封装。
背景技术
电子产业可能是趋向以降低的成本来制造产品，同时尝试维持高可靠度，而且同时试着维持或达成轻的重量、小型化、高速的操作、多重功能以及高的效能。封装组件技术是在设计此种产品所考虑的重要技术中的一种。
封装组件技术可能涉及到保护组件与外界环境隔离。封装组件技术可包含一具有形成于其中的集成电路的半导体芯片的使用，并且可能有关于容易将所述半导体芯片安装至一基板，使得所述半导体芯片的操作可靠度可加以确保。有关于封装组件技术，用于电连接一半导体芯片以及一基板的方案中之一包含一种引线接合的设计。所述引线接合的设计是利用导线来将所述半导体芯片及基板彼此电连接。
发明内容
在一实施例中，一种半导体封装可包含基板、以及设置在所述基板之上的结构主体。所述半导体封装可包含半导体芯片，其被堆叠在所述结构主体之上，并且具有突出超出所述结构主体的侧表面而且在所述结构主体的所述侧表面之上悬伸出的悬伸部分。所述半导体封装可包含一或多个设置在所述悬伸部分上的接合焊盘、以及一或多条将所述接合焊盘电连接至所述基板的导线。所述半导体封装可包含固定导线的膜，其被附接到所述结构主体之上而且在所述结构主体的所述侧表面之上悬伸出，以固定所述一条或多条导线。
其中所述一条或多条导线被形成为使得所述一条或多条导线的部分埋入到所述固定层中。
其中所述一条或多条导线被形成为使得所述一条或多条导线的部分坐落在所述固定层上。
在一实施例中，一种半导体封装可包含基板、以及设置在所述基板之上的结构主体。所述半导体封装可包含半导体芯片，其具有多个接合焊盘并且被堆叠在所述结构主体之上，使得所述半导体芯片的具有一或多个接合焊盘的一个端部突出超出所述结构主体的侧表面而且从所述结构主体的所述侧表面悬伸。所述半导体封装可包含附接到所述结构主体之上的固定导线的膜，使得所述固定导线的膜的一个端部突出超出所述结构主体的所述侧表面，而且从所述结构主体的所述侧表面悬伸。所述半导体封装可包含导线，其横跨(across)所述固定导线的膜以电连接所述接合焊盘以及所述基板，并且被固定至所述固定导线的膜。
其中所述导线中的与被设置在所述半导体芯片的所述一个端部上的所述接合焊盘电连接的导线在横跨所述固定导线的膜的所述一个端部延伸时，被固定至所述固定导线的膜的所述一个端部。
其中所述固定导线的膜以及所述半导体芯片被基本上水平地设置在所述结构主体之上。
该半导体封装进一步包括：黏着构件，其形成在所述结构主体以及所述半导体芯片之间，以将所述结构主体以及所述半导体芯片彼此附接。
其中所述固定导线的膜形成在所述半导体芯片的两个相对的侧边上。
其中所述固定导线的膜只形成在所述半导体芯片的一个侧边上。
其中所述固定导线的膜被形成为在所述结构主体的顶表面以及所述半导体芯片的底表面之间延伸，以将所述结构主体以及所述半导体芯片彼此附接。
其中所述半导体芯片以及所述固定导线的膜突出超出所述结构主体的相同的侧表面，并且从所述结构主体的相同的侧表面悬伸。
其中所述结构主体包括半导体芯片、虚设芯片以及绝缘体中的至少任何一个。
其中所述固定导线的膜包括：支撑层；黏着层，其形成在所述支撑层的底表面上，并且被配置用于将所述支撑层以及所述结构主体彼此附接；以及固定层，其形成在所述支撑层的顶表面上，并且被配置用于固定所述导线。
其中所述导线被形成为使得各个导线的部分埋入到所述固定层中。
其中所述导线被形成为使得各个导线的部分坐落在所述固定层上。
附图说明
图1是描绘根据一实施例的一种半导体封装的一个例子的表示的立体图。
图2是沿着图1的线A-A'所取的视图的一横截面的表示。
图3是沿着图1的线B-B'所取的视图的一横截面的表示。
图4是描绘根据一实施例的一种半导体封装的一个例子的表示的立体图。
图5是沿着图4的线C-C'所取的视图的一横截面的表示。
图6是描绘根据一实施例的一种半导体封装的一个例子的表示的立体图。
图7是沿着图6的线D-D'所取的视图的一横截面的表示。
图8是描绘根据一实施例的一种半导体封装的一个例子的表示的横截面图。
图9是描绘一种包含根据所述实施例的半导体封装的电子系统的一个例子的表示的方块图。
图10是描绘一种包含根据所述实施例的半导体封装的记忆卡的一个例子的表示的方块图。
具体实施方式
在以下，一种具有悬伸部分的半导体封装将会在以下参考附图通过实施例的各种例子来加以描述。
参照图1至3，根据一实施例的一种半导体封装可包含一基板10、一结构主体20、以及一半导体芯片30。所述半导体封装可包含一固定导线的膜40以及导线50。
所述基板10可以是一印刷电路板(PCB)。
多个连接垫11可以形成在所述基板10的顶表面上。在一实施例中，如同在图1中所绘，所述连接垫11可以相邻基板10的顶表面而且在x轴的方向上沿着基板10的顶表面的相对的边缘来加以设置。多个电极垫12可以形成在所述基板10的底表面上。例如但不限于焊料球的外部的连接电极13可以形成在所述电极垫12上。尽管未加以描绘，所述基板10可包含电路布线的导线(未绘出)，其电连接形成在所述顶表面上的连接垫11与形成在所述底表面上的电极垫12。所述基板10可以藉由例如但不限于导线架、挠性基板以及中介体中的任一个来加以配置。
所述结构主体20可被设置在所述基板10上。
所述结构主体20可包含例如但不限于阻焊膜的绝缘体、半导体芯片以及虚设(dummy)芯片中的至少任何一个。在描绘于图1至3的一实施例中，其描绘所述结构主体20是藉由阻焊膜所建构的。
尽管未加以描绘，在其中所述结构主体20是半导体芯片的例子中，所述半导体芯片可以和基板10电连接。为了用于和所述基板10电连接，所述半导体芯片可以在其前表面上具有多个其上设置接合焊盘的凸块，并且可以藉由所述凸块的媒介来覆晶接合到基板10之上。所述半导体芯片可以藉由黏着构件的媒介来附接到基板10之上，并且可以藉由导线的媒介来和所述基板10电连接。在其中所述结构主体20是虚设芯片的例子中，所述虚设芯片可以藉由一黏着构件的媒介来附接到基板10之上。
所述半导体芯片30可具有前表面、背对所述前表面的背表面、以及连接所述前表面与背表面的侧表面。
多个接合焊盘31可以形成在所述半导体芯片30的前表面上。作用为电路单元(未绘出)的电性接点以用于和一外部的电路或装置电连接的接合焊盘31可以相邻并且沿着所述半导体芯片30的前表面的相对的边缘来加以形成。换言之，所述半导体芯片30可具有一种边缘垫类型的结构。尽管未被描绘，所述接合焊盘31可以位于并且沿着所述半导体芯片30的前表面的中心部分来加以形成。换言之，所述半导体芯片30可具有一种中心垫类型的结构。
所述电路单元可包含一半导体内存装置或/及一半导体逻辑设备。所述电路单元可以是一集成电路，其中对于一芯片的操作而言为必要的个体组件(例如但不限于一晶体管、一电阻器、一电容器、一熔线等等)彼此电连接。
黏着构件60可以附接至所述半导体芯片30的背表面。所述半导体芯片30可以藉由所述黏着构件60的媒介来附接到结构主体20上。
所述半导体芯片30可以用半导体芯片30的包含一或多个接合焊盘31的一个端部在x轴的方向上突出超出结构主体20的侧表面20A的此种方式，来附接到所述结构主体20之上。所述半导体芯片30可具有突出超出结构主体20的侧表面20A的悬伸部分OP，并且一或多个接合焊盘31可被设置在所述悬伸部分OP上。所述半导体芯片的悬伸部分OP可以突出超出侧表面20A并且从所述结构主体20的侧表面20A悬伸、或是在所述结构主体20的侧表面20A之上悬伸出。
所述固定导线的膜40可以附接到结构主体20之上。亦即，所述半导体芯片30以及固定导线的膜40可以被水平地设置、或是被基本上水平地设置在所述结构主体20上。
所述固定导线的膜40可被用来固定所述导线50。所述导线50可被使用于电连接所述半导体芯片30的接合焊盘31与所述基板10的连接垫11，并且可被设置在所述半导体芯片30的接合焊盘31以及所述基板10的连接垫11之间。所述固定导线的膜可被设置在所述半导体芯片30的接合焊盘31以及所述基板10的连接垫11之间，并且可被用来将所述导线50固定在所述接合焊盘31以及连接垫11之间。在一实施例中，所述固定导线的膜40可以沿着半导体芯片30的、接合焊盘31被设置所相邻的相对边缘，而被设置在所述半导体芯片30的两侧上。对应于所述半导体芯片30的悬伸部分OP，固定导线的膜40的一个端部40A可以在x轴的方向上突出超出所述结构主体20的侧表面20A。换言之，固定导线的膜40的所述一个端部40A可以不被结构主体20所支承，而是可以悬伸。
所述固定导线的膜40可包含支撑层41、黏着层42、以及固定层43。
所述支撑层41可以藉由一种具有相当高硬度的材料来加以形成。例如，所述支撑层41可以是由聚酰亚胺所形成的。由于所述具有相当高硬度的支撑层41的存在，因此固定导线的膜40的并未被结构主体20所支承而为悬伸的一个端部40A可以避免因为其本身的重量而向下弯曲。于是，所述支撑层41可以避免一个端部40A因为所述一个端部40A的重量而向下弯曲。
所述黏着层42可以形成在所述支撑层41的底表面上。所述黏着层42可以将支撑层41以及结构主体20彼此附接。
所述固定层43可以形成在所述支撑层41的顶表面上。所述固定层43可以是由一种能够容许导线的贯穿且/或能够热固的材料所形成的。例如，所述固定层43可以藉由热固的黏着构件，例如但不限于PST(一贯穿间隔带)所建构。类似于所述固定层43，黏着层42亦可以藉由热固的黏着构件，例如但不限于PST所建构。
所述导线50可以电连接在所述半导体芯片30的接合焊盘31以及所述基板10的连接垫11之间。所述导线50可以将所述半导体芯片30以及基板10彼此电连接。所述导线50可以延伸横跨所述固定导线的膜40，并且各个导线50的部分可以藉由埋入到所述固定导线的膜40的固定层43来加以固定。尤其，在所述导线50中，和被设置在所述半导体芯片30的悬伸部分OP上的接合焊盘31电连接的悬伸的导线50A可以延伸横跨所述固定导线的膜40的突出的一个端部40A，并且所述各个悬伸的导线50A的部分可以藉由埋入到所述固定导线的膜40的一个端部40A的固定层43中来加以固定。尽管所述固定导线的膜40的一个端部40A并未被下面的结构主体20所支承而为悬伸，但是由于所述固定导线的膜40的支撑层41具有相当高的硬度，因此所述固定导线的膜40的一个端部40A可以固定所述悬伸的导线50A，而不向下弯曲。再者，因为所述固定导线的膜40的支撑层41具有相当高的硬度，因此所述固定导线的膜40的一个端部40A可以固定所述导线50，而不朝向所述基板10弯曲。在图1及2中，附图标记50B代表和被设置在所述半导体芯片30的未悬伸的部分上的接合焊盘31电连接的导线。
由于所述导线50不能够贯穿具有相当高硬度的支撑层41，因此避免一种其中所述导线50贯穿固定导线的膜40的底表面并且接触到下面的结构主体20的现象发生是可能的。所述导线50可以是由一种金属材料所形成的，并且可包含例如但不限于金、银及铜中的至少任何一种。模制部件70可以用模制或实质模制所述结构主体20、半导体芯片30、固定导线的膜40以及导线50的此种方式而形成在所述基板10的顶表面上。所述模制部件70可被实施成保护半导体芯片30与外界环境隔离，并且可包含一种环氧树脂模制化合物。
尽管在以上参考图1至3所述的实施例中描绘固定导线的膜40是在半导体芯片30的两侧，相对于所述半导体芯片30而被水平地设置，但是将注意到的是所述实施例并不限于此，并且可以用各种方式作成修改。修改后的实施例从以下结合参考图4至7的说明来看将会变成明显的。
参照图4及5，所述固定导线的膜40可以不被设置在半导体芯片30的两侧。所述固定导线的膜40可以只被设置在半导体芯片30的一侧。
当从所述结构主体20的中心线来看时，所述半导体芯片30可以被偏离中心地设置在一侧，并且所述固定导线的膜40可被设置在与半导体芯片30相对的另一侧。
相邻且沿着所述半导体芯片30的一个边缘被设置的接合焊盘31A可以通过所述导线50中的第一导线51A来和所述基板10的连接垫11电连接。相邻且沿着所述半导体芯片30的另一与所述一个边缘相对的边缘被设置的接合焊盘31B可以通过所述导线50中的第二导线51B及51C来和所述基板10的连接垫11电连接。所述第二导线51B及51C可以延伸横跨所述固定导线的膜40，并且各个第二导线51B及51C的部分可以藉由埋入到固定导线的膜40的固定层43中来加以固定。在所述第二导线51B及51C中，和被设置在半导体芯片30的悬伸部分OP上的接合焊盘31B电连接的悬伸的第二导线51B可以延伸横跨所述固定导线的膜40的突出的一个端部40A，并且各个悬伸的第二导线51B的部分可以藉由埋入到所述固定导线的膜40的一个端部40A的固定层43中来加以固定。尽管所述固定导线的膜40的一个端部40A并未被下面的结构主体20所支承而为悬伸，但是由于所述固定导线的膜40的支撑层41具有相当高的硬度，因此所述固定导线的膜40的一个端部40A可以固定所述悬伸的第二导线51B，而不向下弯曲。再者，因为所述固定导线的膜40的支撑层41具有相当高的硬度，因此固定导线的膜40的一个端部40A可以固定所述悬伸的第二导线51B，而不朝向所述基板10弯曲。
参照图6及7，所述固定导线的膜40可以不相对半导体芯片30被水平地设置，并且可加以形成而延伸在所述结构主体20的顶表面以及所述半导体芯片30的底表面之间，并且将所述结构主体20以及半导体芯片30彼此附接。
所述固定导线的膜40可以用固定导线的膜40的一个端部40A在图6中界定的x轴的方向上突出超出结构主体20的侧表面20A的此种方式，而被附接到所述结构主体20之上。所述一个端部40A可以从结构主体20的侧表面20A悬伸并且在实质x轴的方向上实质突出。再者，所述半导体芯片30可以用所述半导体芯片30的包含一或多个接合焊盘31的一个端部在x轴的方向上突出在所述结构主体20的侧表面20A之外或是超出的此种方式，而被附接到所述固定导线的膜40之上。所述半导体芯片30可以从结构主体20的侧表面20A悬伸，并且在实质x轴的方向上突出。
所述固定导线的膜40可包含支撑层41、形成在所述支撑层41的底表面上的黏着层42、以及形成在所述支撑层41的顶表面上的固定层43。所述黏着层42以及固定层43可以藉由热固的黏着构件来加以建构。
所述固定导线的膜40的黏着层42可以附接到结构主体20的顶表面之上，并且所述半导体芯片30的底表面可以附接到所述固定导线的膜40的固定层43之上。
在一实施例中，由于所述半导体芯片30以及结构主体20是藉由所述固定导线的膜40的媒介来加以附接，因此可以不需要个体黏着构件来附接所述半导体芯片30以及结构主体20。
尽管在以上参考图1至7所述的实施例中是描绘所述各个导线50A、50B、51B及51C的部分被埋入到所述固定层43中，但是如同在图8中所绘，将注意到的是各个导线50可以用所述导线50的部分坐落在所述固定层43的顶表面上的此种方式来加以形成。
根据所述实施例，藉由固定将和被设置在半导体芯片的悬伸部分上的接合焊盘电连接的导线，所述导线可以避免摆荡。因此，由于可以避免发生在所述导线之间归因于导线与相邻的导线由于导线摆荡所造成的接触的短路，因此电性可靠度可加以改善。
上述的半导体封装可以应用到各种的半导体装置及封装模块。
参照图9，根据所述实施例的半导体封装可以应用到一种电子系统710。所述电子系统710可包含一控制器711、一输入/输出单元712、以及一内存713。所述控制器711、输入/输出单元712以及内存713可以通过一提供一数据动作路径的总线715来彼此电连接。
例如，所述控制器711可包含至少一微处理器、至少一数字信号处理器、至少一微控制器、以及能够执行和这些构件相同的功能的逻辑电路中的至少一个。所述内存713可包含根据在此论述的实施例的半导体封装中的至少一个。所述输入/输出单元712可包含在一小型键盘、一键盘、一显示设备、一触控屏幕、等等中所选的至少一个。作为一用于储存数据的装置的内存713可以储存数据或/及将藉由所述控制器711或类似者执行的命令。
所述内存713可包含一例如是DRAM的挥发性内存装置或/及一例如是闪存的非挥发性内存装置。例如，一闪存可被安装到一例如是移动终端或是桌面计算机的信息处理系统。所述闪存可被配置为一固态硬盘(SSD)。在此例中，所述电子系统710可以在一闪存系统中稳定地储存大量的数据。
所述电子系统710可进一步包含一被设定为能够发送且接收数据往返于一通讯网络的接口714。所述接口714可以是有线或无线的类型。例如，所述接口714可包含一天线、一有线的收发器、或是一无线收发器。
所述电子系统710可被理解为一移动系统、一个人计算机、一工业用计算机、或是一执行各种功能的逻辑系统。例如，所述移动系统可以是在一个人数字助理(PDA)、一便携计算机、一平板计算机、一移动电话、一智能型手机、一无线电话、一膝上型计算机、一记忆卡、一数字音乐系统以及一信息发送/接收系统中的任一种。
在其中所述电子系统710是一种能够执行无线通信的装置的情形中，所述电子系统710可被用在一例如是CDMA(码分多址)、GSM(全球移动通讯系统)、NADC(北美数字移动电话)、E-TDMA(强化时分多址)、WCDMA(宽带码分多址)、CDMA2000、LTE(长期演进技术)以及Wibro(无线宽带因特网)的通讯系统中。
参照图10，根据所述实施例的半导体封装可以用一记忆卡800的形式来加以提供。例如，所述记忆卡800可包含一例如是非挥发性内存装置的内存810以及一内存控制器820。所述内存810以及内存控制器820可以储存数据、或是读取所储存的数据。
所述内存810可包含根据所述实施例的半导体封装所应用到的非挥发性内存装置中的至少任何一个，并且所述内存控制器820可以响应于来自一主机830的一读取/写入请求来控制所述内存810，以读取所储存的数据、或是储存数据。
尽管各种的实施例已经在以上加以叙述，但是本领域技术人员将会理解到的是所述实施例只是举例而已。于是，具有一在此所述的悬伸部分的半导体封装都不应该根据所述实施例而受到限制。
【符号说明】
10 基板
11 连接垫
12 电极垫
13 连接电极
20 结构主体
20A 侧表面
30 半导体芯片
31 接合焊盘
31A 接合焊盘
31B 接合焊盘
40 固定导线的膜
40A 端部
41 支撑层
42 黏着层
43 固定层
50 导线
50A 悬伸的导线
50B 导线
51A 第一导线
51B 悬伸的第二导线
51C 第二导线
60 黏着构件
70 模制部件
710 电子系统
711 控制器
712 输入/输出单元
713 内存
714 接口
800 记忆卡
810 内存
820 内存控制器
830 主机
OP 悬伸部分

Claims (21)

1.一种半导体封装，其包括：
基板；
结构主体，其被设置在所述基板之上；
半导体芯片，其被堆叠在所述结构主体之上，并且具有突出超出所述结构主体的侧表面而且从所述结构主体的所述侧表面悬伸的悬伸部分，
一个或多个接合焊盘，其被设置在所述悬伸部分上；
一条或多条导线，其将所述接合焊盘电连接至所述基板；以及
固定导线的膜，其被附接到所述结构主体上，并且突出超出所述结构主体的所述侧表面而且从所述结构主体的所述侧表面悬伸，以固定所述一条或多条导线，
其中，所述半导体芯片以及所述固定导线的膜突出超出所述结构主体的相同的侧表面，并且从所述结构主体的相同的侧表面悬伸。
2.根据权利要求1所述的半导体封装，其中所述固定导线的膜以及所述半导体芯片被基本上水平地设置在所述结构主体之上。
3.根据权利要求2所述的半导体封装，该半导体封装进一步包括：
黏着构件，其形成在所述结构主体以及所述半导体芯片之间，以将所述结构主体以及所述半导体芯片彼此附接。
4.根据权利要求2所述的半导体封装，其中所述固定导线的膜形成在所述半导体芯片的两个相对的侧边上。
5.根据权利要求2所述的半导体封装，其中所述固定导线的膜只形成在所述半导体芯片的一个侧边上。
6.根据权利要求1所述的半导体封装，其中所述固定导线的膜被形成为在所述结构主体的顶表面以及所述半导体芯片的底表面之间延伸，以将所述结构主体以及所述半导体芯片彼此附接。
7.根据权利要求1所述的半导体封装，其中所述结构主体包括半导体芯片以及绝缘体中的至少任何一个。
8.根据权利要求1所述的半导体封装，其中所述固定导线的膜包括：
支撑层；
黏着层，其形成在所述支撑层的底表面上，并且被配置用于将所述支撑层以及所述结构主体彼此附接；以及
固定层，其形成在所述支撑层的顶表面上，并且被配置用于固定所述一条或多条导线。
9.根据权利要求8所述的半导体封装，其中所述一条或多条导线被形成为使得所述一条或多条导线的部分埋入到所述固定层中。
10.根据权利要求8所述的半导体封装，其中所述一条或多条导线被形成为使得所述一条或多条导线的部分坐落在所述固定层上。
11.一种半导体封装，其包括：
基板；
结构主体，其设置在所述基板之上；
半导体芯片，其具有多个接合焊盘，并且被堆叠在所述结构主体之上以使得所述半导体芯片的具有一个或多个接合焊盘的一个端部突出超出所述结构主体的侧表面而且从所述结构主体的所述侧表面悬伸；
固定导线的膜，其被附接到所述结构主体上以使得所述固定导线的膜的一个端部突出超出所述结构主体的所述侧表面而且从所述结构主体的所述侧表面悬伸；以及
导线，其横跨所述固定导线的膜以电连接所述接合焊盘以及所述基板，并且被固定至所述固定导线的膜，
其中，所述半导体芯片以及所述固定导线的膜突出超出所述结构主体的相同的侧表面，并且从所述结构主体的相同的侧表面悬伸。
12.根据权利要求11所述的半导体封装，其中，在所述导线中与被设置在所述半导体芯片的所述一个端部上的所述焊盘电连接的导线在横跨所述固定导线的膜的所述一个端部延伸时，被固定至所述固定导线的膜的所述一个端部。
13.根据权利要求11所述的半导体封装，其中，所述固定导线的膜以及所述半导体芯片被基本上水平地设置在所述结构主体之上。
14.根据权利要求13所述的半导体封装，所述半导体封装还包括：
黏着构件，其形成在所述结构主体以及所述半导体芯片之间，以将所述结构主体以及所述半导体芯片彼此附接。
15.根据权利要求13所述的半导体封装，其中所述固定导线的膜形成在所述半导体芯片的两个相对的侧边上。
16.根据权利要求13所述的半导体封装，其中所述固定导线的膜只形成在所述半导体芯片的一个侧边上。
17.根据权利要求11所述的半导体封装，其中所述固定导线的膜被形成为在所述结构主体的顶表面以及所述半导体芯片的底表面之间延伸，以将所述结构主体以及所述半导体芯片彼此附接。
18.根据权利要求11所述的半导体封装，其中所述结构主体包括半导体芯片以及绝缘体中的至少任何一个。
19.根据权利要求11所述的半导体封装，其中所述固定导线的膜包括：
支撑层；
黏着层，其形成在所述支撑层的底表面上，并且被配置用于将所述支撑层以及所述结构主体彼此附接；以及
固定层，其形成在所述支撑层的顶表面上，并且被配置用于固定所述导线。
20.根据权利要求19所述的半导体封装，其中所述导线被形成为使得各条导线的部分埋入到所述固定层中。
21.根据权利要求19所述的半导体封装，其中所述导线被形成为使得各条导线的部分坐落在所述固定层上。
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