CN105745575B - 用于压印结构的方法及装置 - Google Patents

用于压印结构的方法及装置 Download PDF

Info

Publication number
CN105745575B
CN105745575B CN201480065137.3A CN201480065137A CN105745575B CN 105745575 B CN105745575 B CN 105745575B CN 201480065137 A CN201480065137 A CN 201480065137A CN 105745575 B CN105745575 B CN 105745575B
Authority
CN
China
Prior art keywords
embossing
mold
carrier substrate
imprinting
gravity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480065137.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN105745575A (zh
Inventor
D.特雷布迈尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ev Group E Solner Co Ltd
Original Assignee
Ev Group E Solner Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51845390&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN105745575(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ev Group E Solner Co Ltd filed Critical Ev Group E Solner Co Ltd
Publication of CN105745575A publication Critical patent/CN105745575A/zh
Application granted granted Critical
Publication of CN105745575B publication Critical patent/CN105745575B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Micromachines (AREA)
CN201480065137.3A 2013-11-29 2014-10-22 用于压印结构的方法及装置 Active CN105745575B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013113241.3A DE102013113241B4 (de) 2013-11-29 2013-11-29 Verfahren zum Prägen von Strukturen
DE102013113241.3 2013-11-29
PCT/EP2014/072638 WO2015078637A1 (de) 2013-11-29 2014-10-22 Verfahren und vorrichtung zum prägen von strukturen

Publications (2)

Publication Number Publication Date
CN105745575A CN105745575A (zh) 2016-07-06
CN105745575B true CN105745575B (zh) 2019-12-17

Family

ID=51845390

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480065137.3A Active CN105745575B (zh) 2013-11-29 2014-10-22 用于压印结构的方法及装置

Country Status (9)

Country Link
US (1) US10088746B2 (enExample)
JP (1) JP6559130B2 (enExample)
KR (2) KR102250979B1 (enExample)
CN (1) CN105745575B (enExample)
AT (2) AT526564B1 (enExample)
DE (1) DE102013113241B4 (enExample)
SG (1) SG11201604314VA (enExample)
TW (2) TWI705884B (enExample)
WO (1) WO2015078637A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106459676B (zh) 2014-06-26 2020-01-10 Ev 集团 E·索尔纳有限责任公司 用于以通过靠近基质来分布连接材料从而结合基质的方法
TWI707766B (zh) * 2018-07-16 2020-10-21 奇景光電股份有限公司 壓印系統、供膠裝置及壓印方法
CN116954019A (zh) * 2023-06-21 2023-10-27 湖北大学 一种基于液态镓的冷冻离心纳米压印方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6916584B2 (en) 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
WO2004086471A1 (en) 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
US20050276919A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method for dispensing a fluid on a substrate
US7281919B2 (en) 2004-12-07 2007-10-16 Molecular Imprints, Inc. System for controlling a volume of material on a mold
US20070228608A1 (en) 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
JP5443103B2 (ja) * 2009-09-10 2014-03-19 株式会社東芝 パターン形成方法
WO2012160769A1 (ja) * 2011-05-24 2012-11-29 コニカミノルタアドバンストレイヤー株式会社 樹脂成形品の製造方法
WO2012169120A1 (ja) * 2011-06-07 2012-12-13 コニカミノルタアドバンストレイヤー株式会社 複合体の製造方法および複合体

Also Published As

Publication number Publication date
DE102013113241B4 (de) 2019-02-21
AT526564B1 (de) 2024-05-15
TW201932279A (zh) 2019-08-16
SG11201604314VA (en) 2016-07-28
AT526564A5 (de) 2024-05-15
TW201532784A (zh) 2015-09-01
KR102361175B1 (ko) 2022-02-10
JP2017500738A (ja) 2017-01-05
CN105745575A (zh) 2016-07-06
KR20160091333A (ko) 2016-08-02
JP6559130B2 (ja) 2019-08-14
DE102013113241A1 (de) 2015-06-03
US20170031242A1 (en) 2017-02-02
US10088746B2 (en) 2018-10-02
WO2015078637A1 (de) 2015-06-04
KR102250979B1 (ko) 2021-05-12
TWI705884B (zh) 2020-10-01
AT526465A1 (de) 2024-02-15
KR20210054597A (ko) 2021-05-13
TWI688467B (zh) 2020-03-21

Similar Documents

Publication Publication Date Title
CN103402908B (zh) 在大面积上生产高度有序的纳米柱或纳米孔结构的方法
CN103048878B (zh) 压印方法、压印装置和设备制造方法
US9323144B2 (en) Method for microcontact printing
KR20120123300A (ko) 임프린트 리소그래피 주형
US20150131034A1 (en) Apparatus and method for manufacturing micro lens array, and micro lens array manufactured using the same
Kodihalli Shivaprakash et al. Fabrication of flexible polymer molds for polymer microstructuring by roll-to-roll hot embossing
CN105745575B (zh) 用于压印结构的方法及装置
Peng et al. Continuous roller nanoimprinting: next generation lithography
CN109797096B (zh) 数字pcr芯片及其制备方法、制备装置、使用方法
US9149958B2 (en) Stamp for microcontact printing
Youn et al. Dynamic mechanical thermal analysis, forming and mold fabrication studies for hot-embossing of a polyimide microfluidic platform
Fujiwara et al. Methodology for the formation of photoresist films with uniform thicknesses of several hundred micrometers
KR20200038863A (ko) 광학 부품의 만곡 표면 상에 (서브)마이크로 구조를 생성하기 위한 방법 및 광학 부품
US20250231478A1 (en) Method and device for producing micro- and/or nanostructures
Gubbi et al. Nanomanufacturing technologies: development strategies and future prospects
CN120858016A (zh) 用于注塑系统的模具镶件、用于这种模具镶件的载体衬底、具有这种模具镶件的注塑系统以及用于注塑成型的方法
Kreindl et al. High throughput parallel micro and nano-scale replication-a low cost alternative for the fabrication of electronic-, optic-and microfluidic devices
KR20200087482A (ko) 마이크로 다공 패턴을 갖는 소수성 탄성체 몰드 및 이의 제조방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant