KR102250979B1 - 구조물을 엠보싱하기 위한 방법 및 장치 - Google Patents

구조물을 엠보싱하기 위한 방법 및 장치 Download PDF

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Publication number
KR102250979B1
KR102250979B1 KR1020167013828A KR20167013828A KR102250979B1 KR 102250979 B1 KR102250979 B1 KR 102250979B1 KR 1020167013828 A KR1020167013828 A KR 1020167013828A KR 20167013828 A KR20167013828 A KR 20167013828A KR 102250979 B1 KR102250979 B1 KR 102250979B1
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South Korea
Prior art keywords
embossing
die
embossing material
carrier substrate
lens
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KR1020167013828A
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English (en)
Korean (ko)
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KR20160091333A (ko
Inventor
도미닉 트레이블에이어
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에베 그룹 에. 탈너 게엠베하
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Application filed by 에베 그룹 에. 탈너 게엠베하 filed Critical 에베 그룹 에. 탈너 게엠베하
Priority to KR1020217013477A priority Critical patent/KR102361175B1/ko
Publication of KR20160091333A publication Critical patent/KR20160091333A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Micromachines (AREA)
KR1020167013828A 2013-11-29 2014-10-22 구조물을 엠보싱하기 위한 방법 및 장치 Active KR102250979B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020217013477A KR102361175B1 (ko) 2013-11-29 2014-10-22 구조물을 엠보싱하기 위한 방법 및 장치

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013113241.3A DE102013113241B4 (de) 2013-11-29 2013-11-29 Verfahren zum Prägen von Strukturen
DE102013113241.3 2013-11-29
PCT/EP2014/072638 WO2015078637A1 (de) 2013-11-29 2014-10-22 Verfahren und vorrichtung zum prägen von strukturen

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020217013477A Division KR102361175B1 (ko) 2013-11-29 2014-10-22 구조물을 엠보싱하기 위한 방법 및 장치

Publications (2)

Publication Number Publication Date
KR20160091333A KR20160091333A (ko) 2016-08-02
KR102250979B1 true KR102250979B1 (ko) 2021-05-12

Family

ID=51845390

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020217013477A Active KR102361175B1 (ko) 2013-11-29 2014-10-22 구조물을 엠보싱하기 위한 방법 및 장치
KR1020167013828A Active KR102250979B1 (ko) 2013-11-29 2014-10-22 구조물을 엠보싱하기 위한 방법 및 장치

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020217013477A Active KR102361175B1 (ko) 2013-11-29 2014-10-22 구조물을 엠보싱하기 위한 방법 및 장치

Country Status (9)

Country Link
US (1) US10088746B2 (enExample)
JP (1) JP6559130B2 (enExample)
KR (2) KR102361175B1 (enExample)
CN (1) CN105745575B (enExample)
AT (2) AT526564B1 (enExample)
DE (1) DE102013113241B4 (enExample)
SG (1) SG11201604314VA (enExample)
TW (2) TWI705884B (enExample)
WO (1) WO2015078637A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9929124B2 (en) 2014-06-26 2018-03-27 Ev Group E. Thallner Gmbh Method for bonding substrates
TWI707766B (zh) * 2018-07-16 2020-10-21 奇景光電股份有限公司 壓印系統、供膠裝置及壓印方法
CN116954019A (zh) * 2023-06-21 2023-10-27 湖北大学 一种基于液态镓的冷冻离心纳米压印方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070228608A1 (en) 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
JP2011061001A (ja) 2009-09-10 2011-03-24 Toshiba Corp パターン形成方法
WO2012160769A1 (ja) 2011-05-24 2012-11-29 コニカミノルタアドバンストレイヤー株式会社 樹脂成形品の製造方法
WO2012169120A1 (ja) 2011-06-07 2012-12-13 コニカミノルタアドバンストレイヤー株式会社 複合体の製造方法および複合体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6916584B2 (en) 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
EP1606834B1 (en) 2003-03-27 2013-06-05 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp
US20050276919A1 (en) 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method for dispensing a fluid on a substrate
US7811505B2 (en) 2004-12-07 2010-10-12 Molecular Imprints, Inc. Method for fast filling of templates for imprint lithography using on template dispense

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070228608A1 (en) 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
JP2011061001A (ja) 2009-09-10 2011-03-24 Toshiba Corp パターン形成方法
WO2012160769A1 (ja) 2011-05-24 2012-11-29 コニカミノルタアドバンストレイヤー株式会社 樹脂成形品の製造方法
WO2012169120A1 (ja) 2011-06-07 2012-12-13 コニカミノルタアドバンストレイヤー株式会社 複合体の製造方法および複合体

Also Published As

Publication number Publication date
CN105745575A (zh) 2016-07-06
KR20160091333A (ko) 2016-08-02
AT526564B1 (de) 2024-05-15
CN105745575B (zh) 2019-12-17
WO2015078637A1 (de) 2015-06-04
SG11201604314VA (en) 2016-07-28
DE102013113241B4 (de) 2019-02-21
AT526564A5 (de) 2024-05-15
KR102361175B1 (ko) 2022-02-10
JP6559130B2 (ja) 2019-08-14
US20170031242A1 (en) 2017-02-02
JP2017500738A (ja) 2017-01-05
TW201532784A (zh) 2015-09-01
TWI688467B (zh) 2020-03-21
TW201932279A (zh) 2019-08-16
US10088746B2 (en) 2018-10-02
TWI705884B (zh) 2020-10-01
DE102013113241A1 (de) 2015-06-03
KR20210054597A (ko) 2021-05-13
AT526465A1 (de) 2024-02-15

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