JP6559130B2 - 構造体を型押しする方法および装置 - Google Patents

構造体を型押しする方法および装置 Download PDF

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Publication number
JP6559130B2
JP6559130B2 JP2016534902A JP2016534902A JP6559130B2 JP 6559130 B2 JP6559130 B2 JP 6559130B2 JP 2016534902 A JP2016534902 A JP 2016534902A JP 2016534902 A JP2016534902 A JP 2016534902A JP 6559130 B2 JP6559130 B2 JP 6559130B2
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Japan
Prior art keywords
embossing
paste
stamp
stamping
support substrate
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Japanese (ja)
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JP2017500738A (ja
JP2017500738A5 (enExample
Inventor
トライブルマイア ドミニク
トライブルマイア ドミニク
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エーファウ・グループ・エー・タルナー・ゲーエムベーハー
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2016534902A 2013-11-29 2014-10-22 構造体を型押しする方法および装置 Active JP6559130B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013113241.3A DE102013113241B4 (de) 2013-11-29 2013-11-29 Verfahren zum Prägen von Strukturen
DE102013113241.3 2013-11-29
PCT/EP2014/072638 WO2015078637A1 (de) 2013-11-29 2014-10-22 Verfahren und vorrichtung zum prägen von strukturen

Publications (3)

Publication Number Publication Date
JP2017500738A JP2017500738A (ja) 2017-01-05
JP2017500738A5 JP2017500738A5 (enExample) 2017-11-24
JP6559130B2 true JP6559130B2 (ja) 2019-08-14

Family

ID=51845390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016534902A Active JP6559130B2 (ja) 2013-11-29 2014-10-22 構造体を型押しする方法および装置

Country Status (9)

Country Link
US (1) US10088746B2 (enExample)
JP (1) JP6559130B2 (enExample)
KR (2) KR102250979B1 (enExample)
CN (1) CN105745575B (enExample)
AT (2) AT526564B1 (enExample)
DE (1) DE102013113241B4 (enExample)
SG (1) SG11201604314VA (enExample)
TW (2) TWI705884B (enExample)
WO (1) WO2015078637A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102311945B1 (ko) 2014-06-26 2021-10-13 에베 그룹 에. 탈너 게엠베하 기질들을 서로 모이게 하여 연결 재료를 분포시키는 동안 기질들을 결합시키기 위한 방법
TWI707766B (zh) * 2018-07-16 2020-10-21 奇景光電股份有限公司 壓印系統、供膠裝置及壓印方法
CN116954019A (zh) * 2023-06-21 2023-10-27 湖北大学 一种基于液态镓的冷冻离心纳米压印方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6916584B2 (en) 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
EP1606834B1 (en) 2003-03-27 2013-06-05 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp
US20050276919A1 (en) 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method for dispensing a fluid on a substrate
US7281919B2 (en) 2004-12-07 2007-10-16 Molecular Imprints, Inc. System for controlling a volume of material on a mold
US20070228608A1 (en) 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
JP5443103B2 (ja) 2009-09-10 2014-03-19 株式会社東芝 パターン形成方法
WO2012160769A1 (ja) 2011-05-24 2012-11-29 コニカミノルタアドバンストレイヤー株式会社 樹脂成形品の製造方法
WO2012169120A1 (ja) 2011-06-07 2012-12-13 コニカミノルタアドバンストレイヤー株式会社 複合体の製造方法および複合体

Also Published As

Publication number Publication date
AT526564B1 (de) 2024-05-15
KR102250979B1 (ko) 2021-05-12
KR20160091333A (ko) 2016-08-02
JP2017500738A (ja) 2017-01-05
DE102013113241B4 (de) 2019-02-21
KR20210054597A (ko) 2021-05-13
AT526465A1 (de) 2024-02-15
TW201932279A (zh) 2019-08-16
CN105745575A (zh) 2016-07-06
WO2015078637A1 (de) 2015-06-04
DE102013113241A1 (de) 2015-06-03
AT526564A5 (de) 2024-05-15
TWI705884B (zh) 2020-10-01
US20170031242A1 (en) 2017-02-02
CN105745575B (zh) 2019-12-17
KR102361175B1 (ko) 2022-02-10
TWI688467B (zh) 2020-03-21
US10088746B2 (en) 2018-10-02
TW201532784A (zh) 2015-09-01
SG11201604314VA (en) 2016-07-28

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