TWI688467B - 壓印具有至少一個微結構或奈米結構之透鏡在載體基板上之方法及用於壓印至少一個微結構或奈米結構之裝置 - Google Patents

壓印具有至少一個微結構或奈米結構之透鏡在載體基板上之方法及用於壓印至少一個微結構或奈米結構之裝置 Download PDF

Info

Publication number
TWI688467B
TWI688467B TW103137651A TW103137651A TWI688467B TW I688467 B TWI688467 B TW I688467B TW 103137651 A TW103137651 A TW 103137651A TW 103137651 A TW103137651 A TW 103137651A TW I688467 B TWI688467 B TW I688467B
Authority
TW
Taiwan
Prior art keywords
embossing
imprinting
carrier substrate
metering
dispensing
Prior art date
Application number
TW103137651A
Other languages
English (en)
Chinese (zh)
Other versions
TW201532784A (zh
Inventor
多明尼克 傳柏梅爾
Original Assignee
奧地利商Ev集團E塔那有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51845390&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI688467(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 奧地利商Ev集團E塔那有限公司 filed Critical 奧地利商Ev集團E塔那有限公司
Publication of TW201532784A publication Critical patent/TW201532784A/zh
Application granted granted Critical
Publication of TWI688467B publication Critical patent/TWI688467B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Micromachines (AREA)
TW103137651A 2013-11-29 2014-10-30 壓印具有至少一個微結構或奈米結構之透鏡在載體基板上之方法及用於壓印至少一個微結構或奈米結構之裝置 TWI688467B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013113241.3A DE102013113241B4 (de) 2013-11-29 2013-11-29 Verfahren zum Prägen von Strukturen
DE102013113241.3 2013-11-29

Publications (2)

Publication Number Publication Date
TW201532784A TW201532784A (zh) 2015-09-01
TWI688467B true TWI688467B (zh) 2020-03-21

Family

ID=51845390

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103137651A TWI688467B (zh) 2013-11-29 2014-10-30 壓印具有至少一個微結構或奈米結構之透鏡在載體基板上之方法及用於壓印至少一個微結構或奈米結構之裝置
TW108116265A TWI705884B (zh) 2013-11-29 2014-10-30 使用壓印模壓印具有至少一個微結構或奈米結構之方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW108116265A TWI705884B (zh) 2013-11-29 2014-10-30 使用壓印模壓印具有至少一個微結構或奈米結構之方法

Country Status (9)

Country Link
US (1) US10088746B2 (enExample)
JP (1) JP6559130B2 (enExample)
KR (2) KR102361175B1 (enExample)
CN (1) CN105745575B (enExample)
AT (2) AT526465A1 (enExample)
DE (2) DE102013022563A1 (enExample)
SG (1) SG11201604314VA (enExample)
TW (2) TWI688467B (enExample)
WO (1) WO2015078637A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT523072B1 (de) 2014-06-26 2021-05-15 Ev Group E Thallner Gmbh Verfahren zum Bonden von Substraten
TWI707766B (zh) * 2018-07-16 2020-10-21 奇景光電股份有限公司 壓印系統、供膠裝置及壓印方法
EP4062231B1 (de) * 2019-11-19 2024-01-24 EV Group E. Thallner GmbH Vorrichtung und verfahren zum prägen von mikro- und/oder nanostrukturen
CN116954019A (zh) * 2023-06-21 2023-10-27 湖北大学 一种基于液态镓的冷冻离心纳米压印方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040192041A1 (en) * 2003-03-27 2004-09-30 Jun-Ho Jeong UV nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
US6916584B2 (en) * 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US20070228608A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
US7811505B2 (en) * 2004-12-07 2010-10-12 Molecular Imprints, Inc. Method for fast filling of templates for imprint lithography using on template dispense

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050276919A1 (en) 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method for dispensing a fluid on a substrate
JP5443103B2 (ja) * 2009-09-10 2014-03-19 株式会社東芝 パターン形成方法
WO2012160769A1 (ja) * 2011-05-24 2012-11-29 コニカミノルタアドバンストレイヤー株式会社 樹脂成形品の製造方法
WO2012169120A1 (ja) * 2011-06-07 2012-12-13 コニカミノルタアドバンストレイヤー株式会社 複合体の製造方法および複合体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6916584B2 (en) * 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US20040192041A1 (en) * 2003-03-27 2004-09-30 Jun-Ho Jeong UV nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
US7811505B2 (en) * 2004-12-07 2010-10-12 Molecular Imprints, Inc. Method for fast filling of templates for imprint lithography using on template dispense
US20070228608A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping

Also Published As

Publication number Publication date
AT526564B1 (de) 2024-05-15
DE102013113241B4 (de) 2019-02-21
KR20210054597A (ko) 2021-05-13
DE102013113241A1 (de) 2015-06-03
JP2017500738A (ja) 2017-01-05
DE102013022563A1 (enExample) 2015-06-03
AT526564A5 (de) 2024-05-15
TW201532784A (zh) 2015-09-01
CN105745575A (zh) 2016-07-06
TWI705884B (zh) 2020-10-01
AT526465A1 (de) 2024-02-15
CN105745575B (zh) 2019-12-17
KR102361175B1 (ko) 2022-02-10
US10088746B2 (en) 2018-10-02
KR102250979B1 (ko) 2021-05-12
WO2015078637A1 (de) 2015-06-04
JP6559130B2 (ja) 2019-08-14
US20170031242A1 (en) 2017-02-02
KR20160091333A (ko) 2016-08-02
SG11201604314VA (en) 2016-07-28
TW201932279A (zh) 2019-08-16

Similar Documents

Publication Publication Date Title
CN106030756B (zh) 用于局部区域压印的非对称模板形状调节
US20100096764A1 (en) Gas Environment for Imprint Lithography
US20140346713A1 (en) Method and device for forming fine patterns
KR102353875B1 (ko) 잉크제트 좌표계에 대한 기판 좌표계의 정밀 정렬
TWI688467B (zh) 壓印具有至少一個微結構或奈米結構之透鏡在載體基板上之方法及用於壓印至少一個微結構或奈米結構之裝置
TWI665513B (zh) 用於經改良重疊校正之低接觸壓印微影樣板卡盤系統
US20150131034A1 (en) Apparatus and method for manufacturing micro lens array, and micro lens array manufactured using the same
KR20120123300A (ko) 임프린트 리소그래피 주형
US20210101316A1 (en) Nanoimprinting by using soft mold and resist spreading
JP2011528506A (ja) ナノ−インプリント・リソグラフィのための内部空洞システム
JP6994911B2 (ja) テンプレート複製
Peng et al. Continuous roller nanoimprinting: next generation lithography
KR101346063B1 (ko) 관통홀을 가지는 프리스탠딩한 고분자 멤브레인 및 그 제조방법
Lai et al. Fabrication of microlens array on silicon surface using electrochemical wet stamping technique
US9149958B2 (en) Stamp for microcontact printing
TWI909877B (zh) 分離一壓印器之方法及裝置
KR102289836B1 (ko) 광학 부품의 만곡 표면 상에 (서브)마이크로 구조를 생성하기 위한 방법 및 광학 부품
Pedersen et al. A compact system for large-area thermal nanoimprint lithography using smart stamps
Wang et al. Fabrication of Au micropatterns on vertical Si sidewalls using flexible PDMS shadow masks
US20150108673A1 (en) Imprinting apparatus and method for imprinting
JP2023538717A (ja) マイクロ構造および／またはナノ構造を作製する方法および装置
CN120858016A (zh) 用于注塑系统的模具镶件、用于这种模具镶件的载体衬底、具有这种模具镶件的注塑系统以及用于注塑成型的方法