TWI705884B - 使用壓印模壓印具有至少一個微結構或奈米結構之方法 - Google Patents

使用壓印模壓印具有至少一個微結構或奈米結構之方法 Download PDF

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Publication number
TWI705884B
TWI705884B TW108116265A TW108116265A TWI705884B TW I705884 B TWI705884 B TW I705884B TW 108116265 A TW108116265 A TW 108116265A TW 108116265 A TW108116265 A TW 108116265A TW I705884 B TWI705884 B TW I705884B
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TW
Taiwan
Prior art keywords
imprinting
embossing
mold
present
imprint
Prior art date
Application number
TW108116265A
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English (en)
Chinese (zh)
Other versions
TW201932279A (zh
Inventor
多明尼克 傳柏梅爾
Original Assignee
奧地利商Ev集團E塔那有限公司
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51845390&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI705884(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW108116265A 2013-11-29 2014-10-30 使用壓印模壓印具有至少一個微結構或奈米結構之方法 TWI705884B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013113241.3A DE102013113241B4 (de) 2013-11-29 2013-11-29 Verfahren zum Prägen von Strukturen
??102013113241.3 2013-11-29
DE102013113241.3 2013-11-29

Publications (2)

Publication Number Publication Date
TW201932279A TW201932279A (zh) 2019-08-16
TWI705884B true TWI705884B (zh) 2020-10-01

Family

ID=51845390

Family Applications (2)

Application Number Title Priority Date Filing Date
TW108116265A TWI705884B (zh) 2013-11-29 2014-10-30 使用壓印模壓印具有至少一個微結構或奈米結構之方法
TW103137651A TWI688467B (zh) 2013-11-29 2014-10-30 壓印具有至少一個微結構或奈米結構之透鏡在載體基板上之方法及用於壓印至少一個微結構或奈米結構之裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103137651A TWI688467B (zh) 2013-11-29 2014-10-30 壓印具有至少一個微結構或奈米結構之透鏡在載體基板上之方法及用於壓印至少一個微結構或奈米結構之裝置

Country Status (9)

Country Link
US (1) US10088746B2 (enExample)
JP (1) JP6559130B2 (enExample)
KR (2) KR102250979B1 (enExample)
CN (1) CN105745575B (enExample)
AT (2) AT526564B1 (enExample)
DE (1) DE102013113241B4 (enExample)
SG (1) SG11201604314VA (enExample)
TW (2) TWI705884B (enExample)
WO (1) WO2015078637A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102311945B1 (ko) 2014-06-26 2021-10-13 에베 그룹 에. 탈너 게엠베하 기질들을 서로 모이게 하여 연결 재료를 분포시키는 동안 기질들을 결합시키기 위한 방법
TWI707766B (zh) * 2018-07-16 2020-10-21 奇景光電股份有限公司 壓印系統、供膠裝置及壓印方法
CN116954019A (zh) * 2023-06-21 2023-10-27 湖北大学 一种基于液态镓的冷冻离心纳米压印方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6916584B2 (en) * 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US20050276919A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method for dispensing a fluid on a substrate
US20070228608A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
US7811505B2 (en) * 2004-12-07 2010-10-12 Molecular Imprints, Inc. Method for fast filling of templates for imprint lithography using on template dispense
WO2012160769A1 (ja) * 2011-05-24 2012-11-29 コニカミノルタアドバンストレイヤー株式会社 樹脂成形品の製造方法
JP5443103B2 (ja) * 2009-09-10 2014-03-19 株式会社東芝 パターン形成方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1606834B1 (en) 2003-03-27 2013-06-05 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp
WO2012169120A1 (ja) 2011-06-07 2012-12-13 コニカミノルタアドバンストレイヤー株式会社 複合体の製造方法および複合体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6916584B2 (en) * 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US20050276919A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method for dispensing a fluid on a substrate
US7811505B2 (en) * 2004-12-07 2010-10-12 Molecular Imprints, Inc. Method for fast filling of templates for imprint lithography using on template dispense
US20070228608A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
JP5443103B2 (ja) * 2009-09-10 2014-03-19 株式会社東芝 パターン形成方法
WO2012160769A1 (ja) * 2011-05-24 2012-11-29 コニカミノルタアドバンストレイヤー株式会社 樹脂成形品の製造方法

Also Published As

Publication number Publication date
AT526564B1 (de) 2024-05-15
KR102250979B1 (ko) 2021-05-12
KR20160091333A (ko) 2016-08-02
JP2017500738A (ja) 2017-01-05
DE102013113241B4 (de) 2019-02-21
KR20210054597A (ko) 2021-05-13
JP6559130B2 (ja) 2019-08-14
AT526465A1 (de) 2024-02-15
TW201932279A (zh) 2019-08-16
CN105745575A (zh) 2016-07-06
WO2015078637A1 (de) 2015-06-04
DE102013113241A1 (de) 2015-06-03
AT526564A5 (de) 2024-05-15
US20170031242A1 (en) 2017-02-02
CN105745575B (zh) 2019-12-17
KR102361175B1 (ko) 2022-02-10
TWI688467B (zh) 2020-03-21
US10088746B2 (en) 2018-10-02
TW201532784A (zh) 2015-09-01
SG11201604314VA (en) 2016-07-28

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