CN1057350C - 铜及铜合金的腐蚀保护方法 - Google Patents
铜及铜合金的腐蚀保护方法 Download PDFInfo
- Publication number
- CN1057350C CN1057350C CN95197682A CN95197682A CN1057350C CN 1057350 C CN1057350 C CN 1057350C CN 95197682 A CN95197682 A CN 95197682A CN 95197682 A CN95197682 A CN 95197682A CN 1057350 C CN1057350 C CN 1057350C
- Authority
- CN
- China
- Prior art keywords
- acid
- copper
- well well
- aqueous solution
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 37
- 239000010949 copper Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 28
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 17
- 230000007797 corrosion Effects 0.000 title claims abstract description 7
- 238000005260 corrosion Methods 0.000 title claims abstract description 7
- 150000001875 compounds Chemical class 0.000 claims abstract description 24
- 239000007864 aqueous solution Substances 0.000 claims abstract description 15
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 9
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 9
- 125000003710 aryl alkyl group Chemical group 0.000 claims abstract description 7
- 125000003118 aryl group Chemical group 0.000 claims abstract description 7
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 5
- 150000002367 halogens Chemical class 0.000 claims abstract description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract description 3
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 claims description 22
- 239000002253 acid Substances 0.000 claims description 10
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 7
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- -1 heterocyclic radical Chemical class 0.000 claims description 6
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 5
- 235000019253 formic acid Nutrition 0.000 claims description 5
- 150000007524 organic acids Chemical class 0.000 claims description 5
- 150000003016 phosphoric acids Chemical class 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 4
- 239000011707 mineral Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- GFFGJBXGBJISGV-UHFFFAOYSA-N Adenine Chemical compound NC1=NC=NC2=C1N=CN2 GFFGJBXGBJISGV-UHFFFAOYSA-N 0.000 claims description 3
- 229930024421 Adenine Natural products 0.000 claims description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- 229960000643 adenine Drugs 0.000 claims description 3
- 239000002585 base Substances 0.000 claims description 3
- 229940095064 tartrate Drugs 0.000 claims description 3
- RMFWVOLULURGJI-UHFFFAOYSA-N 2,6-dichloro-7h-purine Chemical compound ClC1=NC(Cl)=C2NC=NC2=N1 RMFWVOLULURGJI-UHFFFAOYSA-N 0.000 claims description 2
- ZKBQDFAWXLTYKS-UHFFFAOYSA-N 6-Chloro-1H-purine Chemical compound ClC1=NC=NC2=C1NC=N2 ZKBQDFAWXLTYKS-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 150000005018 aminopurines Chemical class 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 2
- CUBCNYWQJHBXIY-UHFFFAOYSA-N benzoic acid;2-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC=C1.OC(=O)C1=CC=CC=C1O CUBCNYWQJHBXIY-UHFFFAOYSA-N 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 239000001530 fumaric acid Substances 0.000 claims description 2
- 235000011087 fumaric acid Nutrition 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- 229910017604 nitric acid Inorganic materials 0.000 claims description 2
- 235000006408 oxalic acid Nutrition 0.000 claims description 2
- 235000019260 propionic acid Nutrition 0.000 claims description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 claims description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 claims description 2
- DBXBTMSZEOQQDU-UHFFFAOYSA-N 3-hydroxyisobutyric acid Chemical compound OCC(C)C(O)=O DBXBTMSZEOQQDU-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 125000000623 heterocyclic group Chemical group 0.000 abstract 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 abstract 1
- 125000004953 trihalomethyl group Chemical group 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 29
- 238000000576 coating method Methods 0.000 description 29
- 239000000243 solution Substances 0.000 description 27
- 238000012360 testing method Methods 0.000 description 27
- 238000007669 thermal treatment Methods 0.000 description 13
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 5
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 5
- 238000005494 tarnishing Methods 0.000 description 5
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 239000012964 benzotriazole Substances 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000003446 ligand Substances 0.000 description 4
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 3
- 229910002651 NO3 Inorganic materials 0.000 description 3
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 150000003852 triazoles Chemical class 0.000 description 3
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical compound C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229960000583 acetic acid Drugs 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000004087 circulation Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 description 1
- 125000006283 4-chlorobenzyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1Cl)C([H])([H])* 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- GMQRPNHFOPMWOP-UHFFFAOYSA-N azane;7h-purine Chemical compound N.C1=NC=C2NC=NC2=N1 GMQRPNHFOPMWOP-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- NWFNSTOSIVLCJA-UHFFFAOYSA-L copper;diacetate;hydrate Chemical compound O.[Cu+2].CC([O-])=O.CC([O-])=O NWFNSTOSIVLCJA-UHFFFAOYSA-L 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 125000002425 furfuryl group Chemical group C(C1=CC=CO1)* 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- 150000002816 nickel compounds Chemical class 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- JDLYKQWJXAQNNS-UHFFFAOYSA-L zinc;dibenzoate Chemical compound [Zn+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 JDLYKQWJXAQNNS-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
- ing And Chemical Polishing (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
一种铜及铜合金的腐蚀保护方法。该方法包括把表面和一种通式(I)的至少一种化合物的水溶液相接触，其中X是N，Y是CR而Z是N或X是N，Y是N而Z是N或CR或X是CR，Y是N而Z是N，式中R是一个氢原子或R1，而R1是一个烷基，芳基，芳烷基，卤素，三卤素甲基，氨基，杂环基，NHR2，NR3R4，CN，COOH，COOR5，OH或OR6基，式中每个R2至R6独立地代表一个烷基，芳基或芳烷基。
Description
本发明涉及一种铜及铜合金的腐蚀保护方法，特别是一种对铜及铜合金的腐蚀保护并提供热和湿的保护方法。
预涂覆层是用于保护硬软两种印刷电路板(PCBs)。以前的技术描述了各种预涂覆层。起初，苯并三唑用做预涂覆层，但现在工业的预涂处理是以咪唑或苯并咪唑为基础。
EP-A-0364132公开了用含有一种能生成铜和锌离子的化合物和一种在2-位有C5-21烷基的咪唑的水溶液预涂处理铜的方法。
EP-A-0428383公开了在2-位上有一个至少3个碳原子的烷基的苯并咪唑化合物和一种有机酸的预涂覆层的应用。
JP-A-06002158公开了各种2-(苯基烷基-苯并咪唑，如2(对氯苄基)-苯并咪唑做为预涂处理剂的应用。
先有技术的预涂覆层没有一个可以认为是完全令人满意的，因为这些系统给出的热和/或湿保护是有限的。
我们已开发了一种预涂处理铜或铜合金的方法，特别是保护硬和软的铜或铜合金的印刷电路板，这种方法提供了改进的保护并克服了先有技术方法的缺点。
本发明提供了铜或铜合金的腐蚀保护的方法。本方法包括使表面和通式如下的至少一种化合物的水溶液相接触：
其中 X是N， Y是CR而Z是N，或 X是N， Y是N而Z是N或CR，或 X是CR， Y是N而Z是N，在这里R是一个氢原子或R1，而R1是一个烷基，芳基，芳烷基，卤素，
三卤素甲基，氨基，杂环基，NHR2，NR3R4，CN，COOH，
COOR5，OH或OR6基，在这里每一个R2至R6独立地代表一
个烷基，芳基或芳烷基。
在上述提到的取代基的定义中，烷基优选地有1至20个碳原子，更优选地1至6个碳原子；芳基优选地是苯基或萘基；芳烷基优选地是被一个或更多的含1至20个碳原子的烷基所取代的苯基或萘基；而杂环基优选地是糠基，苯并三唑基，咪唑基和苯并咪唑基。
本发明的水溶液处理能在铜或铜合金的表面上形成了一层在贮存时保护铜或铜合金表面的配位体涂层。配位体涂层特别适用于在其上安装部件的表面，因为它是可以焊接的，即它能被一种合适的焊剂除去并被焊料所浸湿，并且具有极优的抗热性和长期贮存的安全性。
用于本发明的特别优选的式I化合物是三唑吡啶，其式为：
和嘌呤，6-氨基嘌呤，6-氯代嘌呤，2，6-二氯代嘌呤，6-甲氧基嘌呤，6-组氨基嘌呤和6-糠基氨基嘌呤。
用于本发明的式I的化合物是所有都含四或五个杂环氮原子的化合物。这样，三唑吡啶比苯并三唑多一个氮原子而嘌呤比相应的苯并咪唑多两个氮原子。三唑吡啶和嘌呤通常比相应的苯并三唑和苯并咪唑有更高的熔点，并且相信这和在铜或铜合金表面形成的配合物的热安定性相关。也相信在这些化合物中比已有技术化合物中额外多出的氮原子能给出更多的与金属表面和金属离子结合的部位。
式(I)的化合物可以用于混合物中，也可以和以前建议用于铜或铜合金预涂处理的化合物混合使用。
某些式I化合物的水溶性不大，因此可以用一种有机酸或无机酸把这种化合物配成水溶液。可以用于这个目的的有机酸有醋酸，丙烯酸，己二酸，苯甲酸，柠檬酸，二羟甲基丙酸，甲酸，富马酸，马来酸，草酸，丙酸，水杨酸，琥珀酸或酒石酸，而无机酸的例子有盐酸，硝酸，磷酸或硫酸。
甚至当式(I)的化合物溶于水时，涂层水溶液中除了上述的酸外，为了缓冲还优选地加入氨，氢氧化四烃基铵，胺类，碱金属氢氧化物，磷酸盐或硼酸盐。式(I)化合物的水溶液可以配成pH范围由2至14。
式(I)化合物的水溶液可以用浸渍，喷涂或其它的涂覆技术施加在铜或铜合金的表面上。
也可以向水溶液中加入一种或更多的含钛，钒，铬，锰，铁，钴，镍，铜或锌的化合物，所加入的量为式(I)化合物重量的0.01至10％(重量)。这些盐或是加速涂覆的速度和/或改进涂层的抗热和抗湿性能。此外，镍和锌能在铜的表面上形成它们相应的金属一配位体涂层。
可以采用的铜化合物包括醋酸铜，铜的溴化物，氯化物，氢氧化物，硝酸盐，磷酸盐或硫酸盐。可以采用的镍化合物有醋酸镍，镍的溴化物，氯化物，氢氧化物，硝酸盐，磷酸盐或硫酸盐。可以采用的锌化合物则有醋酸锌，苯甲酸锌，锌的溴化物，氯化物，柠檬酸盐，甲酸盐，硝酸盐，氧化物，草酸盐，磷酸盐，水杨酸盐或酒石酸盐。
优选的处理铜或铜合金的条件是，保持式(I)化合物的水溶液在20至60℃的温度下，使溶液和要处理的表面接触1秒至5分钟，优选地由30秒至2分钟。
本发明的方法可用于保护任何铜或铜合金制品的表面，但是特别有价值的是处理硬的和软的印刷电路板。
这样，本发明在其范围内包括按照本发明的方法涂覆过的硬或软的印刷电路板。
本发明将参考非限制性的实例进一步加以叙述。
现将各实例中的通用步骤详述如下。1.铜试件的制备
铜试件(镀铜层压板，铜厚度20微米)用异丙醇脱脂，并在室温下用以下溶液浸蚀两分钟：
过一硫酸钾 6.0％重/重
硫酸铜 0.5％重/重
硫酸 0.5％重/重
去离子水 余量
已浸渍的试件用水漂洗，然后用硫酸，最后再用水洗。样品最后用异丙醇洗并在暖空气中干燥。2.涂覆溶液
涂覆溶液的配制是用配位体(0.5％)溶解在水中(99.5％)或形成悬浮液。溶液的pH用冰醋酸调节至2.5。然后用氢氧化钠(20％重/重)把溶液的pH调节至各种，最高为pH11。
浸渍的铜试件在40℃下用涂覆溶液涂覆2分钟。从涂覆溶液取出后，样品用去离子水漂洗，在暖空气中干燥。
涂层的存在可以把样品由涂覆溶液中取出漂洗出现去湿作用时，或进行一个银点滴试验而得知。在进行热处理以及湿老化/热处理试验之前试件老化约18小时。3.热处理试验
已涂覆的铜试件在炉中和220℃下加热。试件温度达到200℃10秒钟后取出。样品经过五次这样的循环。样品相对于裸露的铜评估其抗热失泽性能。涂层的定级如下：
低劣 -涂覆的样品比裸露的铜更易失去光泽
满意 -样品失去光泽与裸露的铜相比差别不大
良好 -比裸露的铜有提高了的抗失泽性能4.湿老化/热处理试验
已涂覆的镀铜薄片的铜试件在潮湿箱中40℃/95％相对湿度下贮存了72小时。样品抗潮湿失泽的性能和相对于裸露的铜进行评估。涂层的定级如下：
低劣，满意或良好如上所述。
湿老化的镀铜层压件的涂覆试件在炉内和22℃下加热。当样品的温度达到200℃，10秒钟后即将它们取出。样品经过五次这样的循环。样品抗热失泽的性能相对于裸露的铜进行评估。涂层的定级如下：
低劣，满意或良好如上所述。5.可焊性
样品的可焊性用Alpha NR 300F焊剂做浸焊试验来判定。
实例1
下式的化合物：
即1H-1，2，3-三唑〔4，5-c〕吡啶按以上的详述进行试验，所得的结果详细列于表1中：
表1
| 试验步骤 | 涂覆溶液的pH范围 | |||||
| pH3 | pH4 | pH4.5 | pH5 | pH6.0 | pH6.5 | |
| 1.热处理 | 满意 | 良好 | 良好 | 良好 | 良好 | 良好 |
| 2.可焊性 | - | 良好 | 良好 | 良好 | 良好 | 良好 |
| 3.潮湿试验 | - | 低劣 | 满意/低劣 | 满意/低劣 | 低劣 | 低劣 |
实例2下式的化合物：
即1H-1，2，3-三唑〔4，5-b〕吡啶按以上的详述进行试验，所得的结果详细列于表2中：
表2
| 试验步骤 | 涂覆溶液的pH范围 | |||
| pH3 | pH4 | pH7 | pH11 | |
| 1.热处理 | 良好 | 良好 | 良好 | 良好 |
| 2.可焊性 | 良好 | 良好 | 良好 | 良好 |
实例3嘌呤按以上的详述进行试验，所得的结果详细列于表3中：
表3
| 试验步骤 | 涂覆溶液的pH范围 | ||||||
| pH2.5 | pH4.5 | pH6 | pH8 | pH9 | pH10 | pH10.5 | |
| 1.热处理 | 满意 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 |
| 2.可焊性 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 |
| 3.潮湿试验 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 |
| 4.(3)的热处理 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 |
| 5.(4)的可焊性 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 |
实例4
6-氨基嘌呤按以上的详述进行试验，所得的结果详细列于表4申：
表4
| 试验步骤 | 涂覆溶液的pH范围 | ||||||
| pH2.5 | pH3.5 | pH4 | pH5 | pH6 | pH8 | pH11 | |
| 1.热处理 | 满意 | 满意 | 良好 | 良好 | 良好 | 良好 | 良好 |
| 2.可焊性 | 满意 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 |
实例56-氯嘌呤按以上的详述进行试验，所得的结果详细列于表5中：
表5
| 试验步骤 | 涂覆溶液的pH范围 | |||
| pH2.5 | pH4.5 | pH8 | pH11 | |
| 1.热处理 | 不溶 | 满意/良好 | 满意/良好 | 低劣 |
| 2.可焊性 | 满意/良好 | 满意/良好 | 低劣 | |
实例6
2，6-二氯嘌呤按以上的详述进行试验，所得的结果详细列于表6中：
表6
| 试验步骤 | 涂覆溶液的pH范围 | |||
| pH2.5 | pH4.5 | pH7 | pH11 | |
| 1.热处理 | 不溶 | 满意/良好 | 满意/良好 | 满意/良好 |
| 2.可焊性 | 满意/良好 | 满意/良好 | 良好 | |
实例7
用嘌呤溶解或形成嘌呤(0.5％)在水(99.5％)中的悬浮液而制成一种涂覆溶液。溶液的pH用甲酸调节成2.5，然后用氨溶液再调节至期望的pH。
该溶液按以上详述的通用步骤进行试验，得到以下的结果。
| 试验步骤 | 涂覆溶液的pH范围 | ||
| pH7 | pH8 | pH9 | |
| 1.热处理 | 良好 | 良好 | 良好 |
| 2.可焊性 | 良好 | 良好 | 良好 |
| 3.潮湿试验 | 良好 | 良好 | 良好 |
| 4.(3)的热处理 | 良好 | 良好 | 良好 |
| 5.(4)的可焊性 | 良好 | 良好 | 良好 |
实例8
用6-甲氧基嘌呤溶解或形成6-甲氧基嘌呤(0.5％)在水(99.5％)中的悬浮液，而制成一种涂覆溶液。溶液的pH用甲酸调节成2.5，然后用氨溶液再调节至期望的pH。
该溶液按以上详述的通用步骤进行试验，得到以下的结果。
| 试验步骤 | 涂覆溶液的pH范围 | ||
| pH8 | pH8.5 | pH9 | |
| 1.热处理 | 良好 | 良好 | 良好 |
| 2.可焊性 | 良好 | 良好 | 良好 |
| 3.潮湿试验 | 良好 | 良好 | 良好 |
| 4.(3)的热处理 | 良好 | 良好 | 良好 |
| 5.(4)的可焊性 | 良好 | 良好 | 良好 |
实例9
溶解6-组氨嘌呤(0.5％)于水(99.5％)中制成一种涂覆溶液。溶液的pH用甲酸调节成2.5，然后用氨溶液再调节至所期望的pH。
该溶液按以上详述的通用步骤进行试验，得到以下的结果。
| 试验步骤 | 涂覆溶液的pH范围 | |||||||
| pH3 | pH4 | pH4.5 | pH5 | pH6 | pH6.5 | pH7 | pH8 | |
| 1.热处理 | 低劣 | 低劣 | 低劣 | 满意 | 满意 | 满意 | 优秀 | 优秀 |
| 2.可焊性 | 低劣 | 低劣 | 低劣 | 满意 | 满意 | 满意 | 优秀 | 优秀 |
| 3.潮湿试验 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | 优秀 | 优秀 |
| 4.可焊性 | 良好 | 良好 | 良好 | 良好 | 良好 | 良好 | 优秀 | 优秀 |
| 5.(3)的热处理 | 低劣 | 低劣 | 低劣 | 满意 | 满意 | 满意 | 优秀 | 优秀 |
| 6.(5)的可焊性 | 低劣 | 低劣 | 低劣 | 满意 | 满意 | 满意 | 优秀 | 优秀 |
Claims (11)
1、一种铜及铜合金的腐蚀保护方法，该方法包括把表面和一种通式(I)的至少一种化合物的水溶液相接触：
其中 X是N， Y是CR而Z是N，或 X是N， Y是N而Z是N或CR，或 X是CR， Y是N而Z是N，在这里R是一个氢原子或R1，而R1是一个烷基，芳基，芳烷基，卤素，
三卤素甲基，氨基，杂环基，NHR2，NR3R4，CN，COOH，
COOR5，OH或OR6基，在这里每一个R2至R6独立地代表一
个烷基，芳基或芳烷基。
2、根据权利要求1的方法，其中式(I)的化合物是
3、根据权利要求1的方法，其中通式(I)的化合物是嘌呤，6-氨基嘌呤，6-氯嘌呤，2，6-二氯嘌呤，6-甲氧基嘌呤，6-组氨基嘌呤和6-糠基氨基嘌呤。
4、根据权利要求1的方法，其中水溶液含一种有机酸或无机酸。
5、根据权利要求4的方法，其中有机酸是醋酸，丙烯酸，己二酸，苯甲酸，柠檬酸，2-羟甲基丙酸，甲酸，富马酸，马来酸，草酸，丙酸，水杨酸，琥珀酸或酒石酸。
6、根据权利要求4的方法，其中无机酸是盐酸，硝酸，磷酸或硫酸。
7、根据以上权利要求中的任一项的方法，水溶液用加入氨，胺，氢氧化四烃基铵，碱金属氢氧化物，磷酸盐或硼酸盐而缓冲。
8、根据以上权利要求中的任一项的方法，其中的水溶液是用浸渍或喷涂的方法施加在铜或铜合金的表面上。
9、根据以上权利要求中的任一项的方法，其中的水溶液还含有钛，钒，铬，锰，铁，钴，镍或锌的盐，其量由0.01至10％(重量)。
10、根据以上权利要求中的任一项的方法，其中要处理的表面是一种硬的或软的印刷电路板的表面。
11、一种硬的或软印刷电路板，它曾根据以上任何一项权利要求的方法进行过预涂溶剂的处理。
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9426087.4 | 1994-12-23 | ||
| GBGB9426087.4A GB9426087D0 (en) | 1994-12-23 | 1994-12-23 | Process for the surface treatment of copper or copper alloys |
| GBGB9507419.1A GB9507419D0 (en) | 1995-04-10 | 1995-04-10 | Process for the surface treatment of copper or copper alloys |
| GB9507419.1 | 1995-04-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1175286A CN1175286A (zh) | 1998-03-04 |
| CN1057350C true CN1057350C (zh) | 2000-10-11 |
Family
ID=26306247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95197682A Expired - Fee Related CN1057350C (zh) | 1994-12-23 | 1995-12-13 | 铜及铜合金的腐蚀保护方法 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US6158491A (zh) |
| EP (1) | EP0799327B1 (zh) |
| JP (1) | JPH10511431A (zh) |
| KR (1) | KR100402899B1 (zh) |
| CN (1) | CN1057350C (zh) |
| AT (1) | ATE178953T1 (zh) |
| AU (1) | AU4183896A (zh) |
| DE (1) | DE69509124T2 (zh) |
| FI (1) | FI972692A (zh) |
| HK (1) | HK1002870A1 (zh) |
| TW (1) | TW304208B (zh) |
| WO (1) | WO1996020295A1 (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101824621A (zh) * | 2010-04-12 | 2010-09-08 | 海宁市科泰克金属表面技术有限公司 | 一种高性能铜、镍保护剂 |
| CN107667188A (zh) * | 2015-05-28 | 2018-02-06 | 艺康美国股份有限公司 | 基于嘌呤的腐蚀抑制剂 |
| US11306400B2 (en) | 2015-05-28 | 2022-04-19 | Ecolab Usa Inc. | 2-substituted imidazole and benzimidazole corrosion inhibitors |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1091173C (zh) * | 1999-09-01 | 2002-09-18 | 中国科学院金属研究所 | 一种清除铜及铜合金表面锈蚀的综合防护处理剂 |
| DE10026010A1 (de) * | 2000-05-25 | 2001-11-29 | Basf Ag | Hydraulische Flüssigkeiten mit verbessertem Korrosionsschutz für Buntmetalle |
| WO2002000965A1 (fr) * | 2000-06-28 | 2002-01-03 | Koito, Tatsuya | Agent anticorrosion |
| ATE316786T1 (de) * | 2000-11-22 | 2006-02-15 | Rxkinetix Inc | Behandlung von mukositis |
| DE10117647A1 (de) * | 2001-04-09 | 2002-10-17 | Basf Ag | Hydraulische Flüssigkeiten mit verbessertem Korrosionsschutz |
| US8349393B2 (en) * | 2004-07-29 | 2013-01-08 | Enthone Inc. | Silver plating in electronics manufacture |
| KR100668129B1 (ko) * | 2005-07-07 | 2007-01-11 | 백양케미칼(주) | 프리플럭스 조성물 |
| CN1955341B (zh) * | 2005-10-25 | 2011-09-07 | 李碧洁 | 适用于多次高温无铅焊接的铜面防氧化剂 |
| DE102006041292A1 (de) * | 2006-09-01 | 2008-03-06 | Henkel Kgaa | Wasserstoffperoxid-Aktivierung mit N-Heterocyclen |
| CN101575704B (zh) * | 2009-06-12 | 2011-01-26 | 林原标 | 铜及铜合金表面处理剂 |
| US8961678B2 (en) * | 2012-12-20 | 2015-02-24 | Rohm And Haas Electronic Materials Llc | Organic solderability preservative and method |
| KR20180129983A (ko) * | 2013-03-16 | 2018-12-05 | 피알시-데소토 인터내쇼날, 인코포레이티드 | 부식 억제제로서의 금속 착화제 |
| BR112017025246B1 (pt) | 2015-05-28 | 2022-02-01 | Ecolab Usa Inc | Composto, e, método para a inibição da corrosão de uma superfície de metal em contato com um sistema aquoso |
| US10519116B2 (en) | 2015-05-28 | 2019-12-31 | Ecolab Usa Inc. | Water-soluble pyrazole derivatives as corrosion inhibitors |
| KR102334425B1 (ko) * | 2019-11-21 | 2021-12-01 | 엘티씨 (주) | 디스플레이 제조용 포토레지스트 박리액 조성물 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2189538A1 (zh) * | 1972-06-15 | 1974-01-25 | Otsuka Kagaku Yakuhin | |
| JPS4984933A (zh) * | 1972-12-21 | 1974-08-15 | ||
| FR2248329A1 (zh) * | 1973-10-17 | 1975-05-16 | Tokai Electro Chemical Co | |
| US4740320A (en) * | 1985-07-22 | 1988-04-26 | The Dow Chemical Company | Process for preventing corrosion of a metal in contact with a well fluid |
-
1995
- 1995-12-13 KR KR1019970704329A patent/KR100402899B1/ko not_active IP Right Cessation
- 1995-12-13 AU AU41838/96A patent/AU4183896A/en not_active Abandoned
- 1995-12-13 WO PCT/GB1995/002912 patent/WO1996020295A1/en active IP Right Grant
- 1995-12-13 JP JP8520274A patent/JPH10511431A/ja active Pending
- 1995-12-13 EP EP95940369A patent/EP0799327B1/en not_active Expired - Lifetime
- 1995-12-13 US US08/860,074 patent/US6158491A/en not_active Expired - Lifetime
- 1995-12-13 DE DE69509124T patent/DE69509124T2/de not_active Expired - Fee Related
- 1995-12-13 AT AT95940369T patent/ATE178953T1/de not_active IP Right Cessation
- 1995-12-13 CN CN95197682A patent/CN1057350C/zh not_active Expired - Fee Related
- 1995-12-20 TW TW084113640A patent/TW304208B/zh not_active IP Right Cessation
-
1997
- 1997-06-23 FI FI972692A patent/FI972692A/fi unknown
-
1998
- 1998-03-12 HK HK98102036A patent/HK1002870A1/xx not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2189538A1 (zh) * | 1972-06-15 | 1974-01-25 | Otsuka Kagaku Yakuhin | |
| JPS4984933A (zh) * | 1972-12-21 | 1974-08-15 | ||
| FR2248329A1 (zh) * | 1973-10-17 | 1975-05-16 | Tokai Electro Chemical Co | |
| US4740320A (en) * | 1985-07-22 | 1988-04-26 | The Dow Chemical Company | Process for preventing corrosion of a metal in contact with a well fluid |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101824621A (zh) * | 2010-04-12 | 2010-09-08 | 海宁市科泰克金属表面技术有限公司 | 一种高性能铜、镍保护剂 |
| CN107667188A (zh) * | 2015-05-28 | 2018-02-06 | 艺康美国股份有限公司 | 基于嘌呤的腐蚀抑制剂 |
| US11306400B2 (en) | 2015-05-28 | 2022-04-19 | Ecolab Usa Inc. | 2-substituted imidazole and benzimidazole corrosion inhibitors |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0799327A1 (en) | 1997-10-08 |
| US6158491A (en) | 2000-12-12 |
| FI972692A0 (fi) | 1997-06-23 |
| WO1996020295A1 (en) | 1996-07-04 |
| DE69509124T2 (de) | 1999-11-25 |
| KR100402899B1 (ko) | 2004-06-12 |
| EP0799327B1 (en) | 1999-04-14 |
| FI972692A (fi) | 1997-08-22 |
| ATE178953T1 (de) | 1999-04-15 |
| DE69509124D1 (de) | 1999-05-20 |
| JPH10511431A (ja) | 1998-11-04 |
| TW304208B (zh) | 1997-05-01 |
| HK1002870A1 (en) | 1998-09-25 |
| AU4183896A (en) | 1996-07-19 |
| CN1175286A (zh) | 1998-03-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1057350C (zh) | 铜及铜合金的腐蚀保护方法 | |
| US9072203B2 (en) | Solderability enhancement by silver immersion printed circuit board manufacture | |
| CN1240873C (zh) | 铜底基的选择性沉积方法 | |
| USRE45297E1 (en) | Method for enhancing the solderability of a surface | |
| EP1613440B1 (en) | Improved coating for silver plated circuits | |
| US6200451B1 (en) | Method for enhancing the solderability of a surface | |
| USRE45881E1 (en) | Method for enhancing the solderability of a surface | |
| EP0428383A1 (en) | Process for surface treatment of copper and copper alloy | |
| CN102037157A (zh) | 用多官能化合物促进金属对层压板的粘合力 | |
| CN101259572A (zh) | Osp防氧化有机预焊剂 | |
| EP3181730B1 (en) | Method for forming organic coating on nickel surface | |
| JP2009530846A (ja) | 有機系はんだ付け保護形成用下塗り組成物 | |
| JP2012506488A (ja) | 金属又は金属合金表面の耐食性を増加させるための後処理組成物 | |
| JPH09293954A (ja) | 銅または銅合金表面の処理剤 | |
| JP5480277B2 (ja) | 表面のはんだ付け性を向上させる方法 | |
| EP1029944B1 (en) | Method for enhancing the solderability of a surface | |
| US7267259B2 (en) | Method for enhancing the solderability of a surface | |
| CN112126876B (zh) | 一种助镀液及其使用这种助镀液的热镀锌工艺 | |
| USRE45842E1 (en) | Method for enhancing the solderability of a surface | |
| CN115341202B (zh) | 一种铝合金化学镀镍前用活化液及前处理方法 | |
| CN116810216A (zh) | 水溶性预焊剂及表面处理方法 | |
| JP2849216B2 (ja) | 銅及び銅合金の表面処理方法 | |
| JP2022145633A (ja) | 水溶性プリフラックス、および表面処理方法 | |
| KR19990014550A (ko) | 동 및 동합금의 표면처리 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |