ATE178953T1 - Verfahren zur korrosionshemmung von kupfer- und kupferlegierungen - Google Patents
Verfahren zur korrosionshemmung von kupfer- und kupferlegierungenInfo
- Publication number
- ATE178953T1 ATE178953T1 AT95940369T AT95940369T ATE178953T1 AT E178953 T1 ATE178953 T1 AT E178953T1 AT 95940369 T AT95940369 T AT 95940369T AT 95940369 T AT95940369 T AT 95940369T AT E178953 T1 ATE178953 T1 AT E178953T1
- Authority
- AT
- Austria
- Prior art keywords
- copper
- pct
- corrosion inhibition
- sec
- aryl
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9426087.4A GB9426087D0 (en) | 1994-12-23 | 1994-12-23 | Process for the surface treatment of copper or copper alloys |
GBGB9507419.1A GB9507419D0 (en) | 1995-04-10 | 1995-04-10 | Process for the surface treatment of copper or copper alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE178953T1 true ATE178953T1 (de) | 1999-04-15 |
Family
ID=26306247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT95940369T ATE178953T1 (de) | 1994-12-23 | 1995-12-13 | Verfahren zur korrosionshemmung von kupfer- und kupferlegierungen |
Country Status (12)
Country | Link |
---|---|
US (1) | US6158491A (de) |
EP (1) | EP0799327B1 (de) |
JP (1) | JPH10511431A (de) |
KR (1) | KR100402899B1 (de) |
CN (1) | CN1057350C (de) |
AT (1) | ATE178953T1 (de) |
AU (1) | AU4183896A (de) |
DE (1) | DE69509124T2 (de) |
FI (1) | FI972692A (de) |
HK (1) | HK1002870A1 (de) |
TW (1) | TW304208B (de) |
WO (1) | WO1996020295A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1091173C (zh) * | 1999-09-01 | 2002-09-18 | 中国科学院金属研究所 | 一种清除铜及铜合金表面锈蚀的综合防护处理剂 |
DE10026010A1 (de) * | 2000-05-25 | 2001-11-29 | Basf Ag | Hydraulische Flüssigkeiten mit verbessertem Korrosionsschutz für Buntmetalle |
WO2002000965A1 (fr) * | 2000-06-28 | 2002-01-03 | Koito, Tatsuya | Agent anticorrosion |
MXPA03004546A (es) * | 2000-11-22 | 2003-09-10 | Rxkinetix Inc | Tratamiento de mucositis. |
DE10117647A1 (de) * | 2001-04-09 | 2002-10-17 | Basf Ag | Hydraulische Flüssigkeiten mit verbessertem Korrosionsschutz |
US8349393B2 (en) | 2004-07-29 | 2013-01-08 | Enthone Inc. | Silver plating in electronics manufacture |
KR100668129B1 (ko) | 2005-07-07 | 2007-01-11 | 백양케미칼(주) | 프리플럭스 조성물 |
CN1955341B (zh) * | 2005-10-25 | 2011-09-07 | 李碧洁 | 适用于多次高温无铅焊接的铜面防氧化剂 |
DE102006041292A1 (de) * | 2006-09-01 | 2008-03-06 | Henkel Kgaa | Wasserstoffperoxid-Aktivierung mit N-Heterocyclen |
CN101575704B (zh) * | 2009-06-12 | 2011-01-26 | 林原标 | 铜及铜合金表面处理剂 |
CN101824621A (zh) * | 2010-04-12 | 2010-09-08 | 海宁市科泰克金属表面技术有限公司 | 一种高性能铜、镍保护剂 |
US8961678B2 (en) * | 2012-12-20 | 2015-02-24 | Rohm And Haas Electronic Materials Llc | Organic solderability preservative and method |
CN105247102A (zh) * | 2013-03-16 | 2016-01-13 | Prc-迪索托国际公司 | 作为腐蚀抑制剂的金属络合物 |
US10190222B2 (en) | 2015-05-28 | 2019-01-29 | Ecolab Usa Inc. | Corrosion inhibitors |
BR112017025258B1 (pt) | 2015-05-28 | 2022-03-22 | Ecolab Usa Inc | Método para inibição de corrosão de uma superfície de metal em contato com um sistema aquoso |
AU2016267614B2 (en) | 2015-05-28 | 2021-11-18 | Ecolab Usa Inc. | Purine-based corrosion inhibitors |
WO2016191672A1 (en) | 2015-05-28 | 2016-12-01 | Ecolab Usa Inc. | 2-substituted imidazole and benzimidazole corrosion inhibitors |
KR102334425B1 (ko) * | 2019-11-21 | 2021-12-01 | 엘티씨 (주) | 디스플레이 제조용 포토레지스트 박리액 조성물 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5233583B2 (de) * | 1972-06-15 | 1977-08-29 | ||
JPS537902B2 (de) * | 1972-12-21 | 1978-03-23 | ||
JPS533975B2 (de) * | 1973-10-17 | 1978-02-13 | Tokai Electro Chemical Co | |
US4740320A (en) * | 1985-07-22 | 1988-04-26 | The Dow Chemical Company | Process for preventing corrosion of a metal in contact with a well fluid |
-
1995
- 1995-12-13 JP JP8520274A patent/JPH10511431A/ja active Pending
- 1995-12-13 AT AT95940369T patent/ATE178953T1/de not_active IP Right Cessation
- 1995-12-13 WO PCT/GB1995/002912 patent/WO1996020295A1/en active IP Right Grant
- 1995-12-13 EP EP95940369A patent/EP0799327B1/de not_active Expired - Lifetime
- 1995-12-13 US US08/860,074 patent/US6158491A/en not_active Expired - Lifetime
- 1995-12-13 DE DE69509124T patent/DE69509124T2/de not_active Expired - Fee Related
- 1995-12-13 KR KR1019970704329A patent/KR100402899B1/ko not_active IP Right Cessation
- 1995-12-13 CN CN95197682A patent/CN1057350C/zh not_active Expired - Fee Related
- 1995-12-13 AU AU41838/96A patent/AU4183896A/en not_active Abandoned
- 1995-12-20 TW TW084113640A patent/TW304208B/zh not_active IP Right Cessation
-
1997
- 1997-06-23 FI FI972692A patent/FI972692A/fi unknown
-
1998
- 1998-03-12 HK HK98102036A patent/HK1002870A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1175286A (zh) | 1998-03-04 |
EP0799327B1 (de) | 1999-04-14 |
AU4183896A (en) | 1996-07-19 |
US6158491A (en) | 2000-12-12 |
CN1057350C (zh) | 2000-10-11 |
DE69509124D1 (de) | 1999-05-20 |
HK1002870A1 (en) | 1998-09-25 |
WO1996020295A1 (en) | 1996-07-04 |
FI972692A (fi) | 1997-08-22 |
JPH10511431A (ja) | 1998-11-04 |
FI972692A0 (fi) | 1997-06-23 |
KR100402899B1 (ko) | 2004-06-12 |
EP0799327A1 (de) | 1997-10-08 |
DE69509124T2 (de) | 1999-11-25 |
TW304208B (de) | 1997-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |