CN105683272B - 电绝缘且导热的聚合物组合物 - Google Patents

电绝缘且导热的聚合物组合物 Download PDF

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Publication number
CN105683272B
CN105683272B CN201480059617.9A CN201480059617A CN105683272B CN 105683272 B CN105683272 B CN 105683272B CN 201480059617 A CN201480059617 A CN 201480059617A CN 105683272 B CN105683272 B CN 105683272B
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volume
polymer composition
coated
polymer
metal
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Expired - Fee Related
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CN201480059617.9A
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English (en)
Chinese (zh)
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CN105683272A (zh
Inventor
Y.萨加
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/025—Polyesters derived from dicarboxylic acids and dihydroxy compounds containing polyether sequences
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201480059617.9A 2013-08-29 2014-08-28 电绝缘且导热的聚合物组合物 Expired - Fee Related CN105683272B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013177724A JP6316556B2 (ja) 2013-08-29 2013-08-29 電気絶縁性および熱伝導性のポリマー組成物
JP2013-177724 2013-08-29
PCT/US2014/053081 WO2015031573A1 (en) 2013-08-29 2014-08-28 Electrically insulating and thermally conductive polymer compositions

Publications (2)

Publication Number Publication Date
CN105683272A CN105683272A (zh) 2016-06-15
CN105683272B true CN105683272B (zh) 2019-02-12

Family

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CN201480059617.9A Expired - Fee Related CN105683272B (zh) 2013-08-29 2014-08-28 电绝缘且导热的聚合物组合物

Country Status (4)

Country Link
EP (1) EP3039066B1 (enExample)
JP (1) JP6316556B2 (enExample)
CN (1) CN105683272B (enExample)
WO (1) WO2015031573A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6580851B2 (ja) * 2015-03-31 2019-10-02 国立大学法人広島大学 高熱伝導性電気絶縁組成物
US10633535B2 (en) 2017-02-06 2020-04-28 Ticona Llc Polyester polymer compositions
EP3580765B1 (en) 2017-02-13 2023-08-23 DSM IP Assets B.V. Method for preparing composition suitable for electrostatic painting
WO2018194418A1 (ko) * 2017-04-20 2018-10-25 주식회사 아모그린텍 그라파이트 조성물, 이를 포함하는 마스터배치 및 이를 통해 구현된 그라파이트 복합재
US11384238B2 (en) 2018-02-08 2022-07-12 Celanese Sales Germany Gmbh Polymer composite containing recycled carbon fibers
CN109294173A (zh) * 2018-09-10 2019-02-01 东莞市松研智达工业设计有限公司 一种导热绝缘pet复合材料及其制备方法
CN111320868B (zh) * 2018-12-17 2023-02-28 杜邦聚合物有限公司 具有高介电常数和低介电损耗的聚合物组合物
JP7561130B2 (ja) * 2019-01-11 2024-10-03 デュポン ポリマーズ インコーポレイテッド 電気絶縁及び熱伝導性ポリマー組成物
FR3098817A1 (fr) * 2019-07-16 2021-01-22 Ppg Industries Ohio, Inc. Compositions contenant des charges thermiquement conductrices
WO2022230970A1 (ja) * 2021-04-28 2022-11-03 パナソニックＩｐマネジメント株式会社 熱伝導性組成物及び熱伝導性材料
JPWO2023182395A1 (enExample) * 2022-03-25 2023-09-28

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998035360A1 (en) * 1997-02-07 1998-08-13 Loctite Corporation Conductive, resin-based compositions
CN101861353A (zh) * 2007-11-16 2010-10-13 纳幕尔杜邦公司 导热树脂组合物
CN102604371A (zh) * 2012-02-17 2012-07-25 南京聚隆科技股份有限公司 一种高性价比绝缘导热聚酰胺复合材料及其制备方法
CN103044904A (zh) * 2012-12-27 2013-04-17 安徽科聚新材料有限公司 一种led灯座专用导热绝缘材料及其制备方法
CN103270099A (zh) * 2010-12-20 2013-08-28 纳幕尔杜邦公司 包含导热聚合物的模塑热塑性制品

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620497B2 (en) * 2000-01-11 2003-09-16 Cool Options, Inc. Polymer composition with boron nitride coated carbon flakes
US6503964B2 (en) * 2000-01-11 2003-01-07 Cool Options, Inc. Polymer composition with metal coated carbon flakes
JP5166689B2 (ja) * 2005-10-17 2013-03-21 昭和電工株式会社 シリカ被覆炭素繊維の製造方法
JP5229462B2 (ja) * 2008-07-24 2013-07-03 三菱瓦斯化学株式会社 絶縁性高熱伝導率樹脂複合材料
JP2011016936A (ja) * 2009-07-09 2011-01-27 Mitsubishi Engineering Plastics Corp 高熱伝導絶縁性樹脂組成物及び成形体
US20130202882A1 (en) * 2010-10-13 2013-08-08 Kaneka Corporation Highly thermally conductive resin molded article, and manufacturing method for same
US8741998B2 (en) * 2011-02-25 2014-06-03 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
US9346991B2 (en) * 2011-04-14 2016-05-24 Ada Technologies, Inc. Thermal interface materials and systems and devices containing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998035360A1 (en) * 1997-02-07 1998-08-13 Loctite Corporation Conductive, resin-based compositions
CN101861353A (zh) * 2007-11-16 2010-10-13 纳幕尔杜邦公司 导热树脂组合物
CN103270099A (zh) * 2010-12-20 2013-08-28 纳幕尔杜邦公司 包含导热聚合物的模塑热塑性制品
CN102604371A (zh) * 2012-02-17 2012-07-25 南京聚隆科技股份有限公司 一种高性价比绝缘导热聚酰胺复合材料及其制备方法
CN103044904A (zh) * 2012-12-27 2013-04-17 安徽科聚新材料有限公司 一种led灯座专用导热绝缘材料及其制备方法

Also Published As

Publication number Publication date
JP6316556B2 (ja) 2018-04-25
JP2015044953A (ja) 2015-03-12
EP3039066A1 (en) 2016-07-06
CN105683272A (zh) 2016-06-15
WO2015031573A1 (en) 2015-03-05
EP3039066B1 (en) 2019-02-27
EP3039066A4 (en) 2017-05-03

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