CN105609552A - 高电子迁移率晶体管及其制造方法 - Google Patents
高电子迁移率晶体管及其制造方法 Download PDFInfo
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- CN105609552A CN105609552A CN201511031698.4A CN201511031698A CN105609552A CN 105609552 A CN105609552 A CN 105609552A CN 201511031698 A CN201511031698 A CN 201511031698A CN 105609552 A CN105609552 A CN 105609552A
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- barrier layer
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- hemt
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 230000004888 barrier function Effects 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000002161 passivation Methods 0.000 claims abstract description 8
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 35
- 229910002601 GaN Inorganic materials 0.000 claims description 28
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- 239000004411 aluminium Substances 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 229910052594 sapphire Inorganic materials 0.000 claims description 5
- 239000010980 sapphire Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- 229910017083 AlN Inorganic materials 0.000 claims description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 11
- 239000000470 constituent Substances 0.000 abstract 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000010931 gold Substances 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 4
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- CHPZKNULDCNCBW-UHFFFAOYSA-N gallium nitrate Chemical compound [Ga+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O CHPZKNULDCNCBW-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004151 rapid thermal annealing Methods 0.000 description 2
- 230000005533 two-dimensional electron gas Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XKMRRTOUMJRJIA-UHFFFAOYSA-N ammonia nh3 Chemical compound N.N XKMRRTOUMJRJIA-UHFFFAOYSA-N 0.000 description 1
- 229910000238 buergerite Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229940044658 gallium nitrate Drugs 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
- H01L29/1054—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a variation of the composition, e.g. channel with strained layer for increasing the mobility
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201511031698.4A CN105609552B (zh) | 2015-12-31 | 2015-12-31 | 高电子迁移率晶体管及其制造方法 |
PCT/CN2016/074013 WO2017113484A1 (zh) | 2015-12-31 | 2016-02-18 | 高电子迁移率晶体管及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201511031698.4A CN105609552B (zh) | 2015-12-31 | 2015-12-31 | 高电子迁移率晶体管及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105609552A true CN105609552A (zh) | 2016-05-25 |
CN105609552B CN105609552B (zh) | 2017-11-10 |
Family
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Family Applications (1)
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CN201511031698.4A Active CN105609552B (zh) | 2015-12-31 | 2015-12-31 | 高电子迁移率晶体管及其制造方法 |
Country Status (2)
Country | Link |
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CN (1) | CN105609552B (zh) |
WO (1) | WO2017113484A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112017959A (zh) * | 2016-06-14 | 2020-12-01 | 黄知澍 | 镓解理面iii族/氮化物磊晶结构及其主动元件与其制作方法 |
CN112310209A (zh) * | 2019-08-01 | 2021-02-02 | 广东美的白色家电技术创新中心有限公司 | 一种场效应晶体管及其制备方法 |
CN113937155A (zh) * | 2021-09-29 | 2022-01-14 | 西安电子科技大学 | 一种组份渐变复合势垒层hemt器件及其制备方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108649048A (zh) * | 2018-07-10 | 2018-10-12 | 南方科技大学 | 一种单片集成半导体器件及其制备方法 |
CN110690283A (zh) * | 2019-09-24 | 2020-01-14 | 中国电子科技集团公司第十三研究所 | 同质外延氮化镓晶体管器件结构 |
CN113505504B (zh) * | 2021-06-16 | 2023-11-03 | 西安理工大学 | 一种提取GaN HEMT器件热源模型的方法 |
CN113889410A (zh) * | 2021-08-24 | 2022-01-04 | 山东云海国创云计算装备产业创新中心有限公司 | 一种用于制作晶体管的芯片及其制作方法、晶体管 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101017854A (zh) * | 2006-12-31 | 2007-08-15 | 电子科技大学 | 一种氮化镓基高电子迁移率晶体管 |
JP2014041965A (ja) * | 2012-08-23 | 2014-03-06 | Renesas Electronics Corp | 半導体装置 |
CN104201202A (zh) * | 2014-09-17 | 2014-12-10 | 电子科技大学 | 一种具有复合势垒层的氮化镓基异质结场效应管 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120153356A1 (en) * | 2010-12-20 | 2012-06-21 | Triquint Semiconductor, Inc. | High electron mobility transistor with indium gallium nitride layer |
US8896101B2 (en) * | 2012-12-21 | 2014-11-25 | Intel Corporation | Nonplanar III-N transistors with compositionally graded semiconductor channels |
CN104037220B (zh) * | 2014-07-02 | 2017-01-25 | 西安电子科技大学 | 一种基于偶极子层浮栅结构的增强型AlGaN/GaN MISHEMT器件结构及其制作方法 |
-
2015
- 2015-12-31 CN CN201511031698.4A patent/CN105609552B/zh active Active
-
2016
- 2016-02-18 WO PCT/CN2016/074013 patent/WO2017113484A1/zh active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101017854A (zh) * | 2006-12-31 | 2007-08-15 | 电子科技大学 | 一种氮化镓基高电子迁移率晶体管 |
JP2014041965A (ja) * | 2012-08-23 | 2014-03-06 | Renesas Electronics Corp | 半導体装置 |
CN104201202A (zh) * | 2014-09-17 | 2014-12-10 | 电子科技大学 | 一种具有复合势垒层的氮化镓基异质结场效应管 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112017959A (zh) * | 2016-06-14 | 2020-12-01 | 黄知澍 | 镓解理面iii族/氮化物磊晶结构及其主动元件与其制作方法 |
CN112310209A (zh) * | 2019-08-01 | 2021-02-02 | 广东美的白色家电技术创新中心有限公司 | 一种场效应晶体管及其制备方法 |
CN113937155A (zh) * | 2021-09-29 | 2022-01-14 | 西安电子科技大学 | 一种组份渐变复合势垒层hemt器件及其制备方法 |
CN113937155B (zh) * | 2021-09-29 | 2024-01-19 | 西安电子科技大学 | 一种组份渐变复合势垒层hemt器件及其制备方法 |
Also Published As
Publication number | Publication date |
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WO2017113484A1 (zh) | 2017-07-06 |
CN105609552B (zh) | 2017-11-10 |
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Effective date of registration: 20170727 Address after: 518102 Guangdong Province, Baoan District Xixiang street Shenzhen City Tian Yi Lu Chen Tian Bao Industrial District 37 Building 2 floor East Applicant after: SHENZHEN HUAXUN FANGZHOU MICROELECTRONIC SCIENCE & TECHNOLOGY Co.,Ltd. Applicant after: SHENZHEN THZ SCIENCE AND TECHNOLOGY INNOVATION INSTITUTE Address before: 518102 Guangdong Province, Baoan District Xixiang street Shenzhen City Tian Yi Lu Chen Tian Bao Industrial District 37 Building 2 floor East Applicant before: SHENZHEN HUAXUN FANGZHOU MICROELECTRONIC SCIENCE & TECHNOLOGY Co.,Ltd. |
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Inventor after: Ding Qing Inventor after: Wu Guangsheng Inventor after: Huang Yongjiang Inventor after: Li Xiaocong Inventor after: Chen Jiacheng Inventor after: Yao Jianke Inventor before: Chen Jiacheng Inventor before: Yao Jianke Inventor before: Ding Qing |
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Effective date of registration: 20220606 Address after: 518102 room 404, building 37, chentian Industrial Zone, chentian community, Xixiang street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Shenzhen Huaxun ark Photoelectric Technology Co.,Ltd. Address before: 518102 East, 2nd floor, building 37, chentian Industrial Zone, Baotian 1st Road, Xixiang street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HUAXUN FANGZHOU MICROELECTRONIC SCIENCE & TECHNOLOGY Co.,Ltd. Patentee before: SHENZHEN THZ SCIENCE AND TECHNOLOGY INNOVATION INSTITUTE |
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Effective date of registration: 20220802 Address after: 266000 room 610, building 1, No. 333 YINGSHANHONG Road, Binhai street, Huangdao District, Qingdao, Shandong Province Patentee after: Qingdao Junrong Huaxun Terahertz Technology Co.,Ltd. Address before: 518102 room 404, building 37, chentian Industrial Zone, chentian community, Xixiang street, Bao'an District, Shenzhen, Guangdong Province Patentee before: Shenzhen Huaxun ark Photoelectric Technology Co.,Ltd. |