CN105543920B - 镁合金微弧氧化层表面制备导电涂层的处理方法 - Google Patents
镁合金微弧氧化层表面制备导电涂层的处理方法 Download PDFInfo
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- CN105543920B CN105543920B CN201510903271.2A CN201510903271A CN105543920B CN 105543920 B CN105543920 B CN 105543920B CN 201510903271 A CN201510903271 A CN 201510903271A CN 105543920 B CN105543920 B CN 105543920B
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- solution
- sample
- plating
- arc oxidation
- magnesium alloy
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/30—Anodisation of magnesium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510903271.2A CN105543920B (zh) | 2015-12-10 | 2015-12-10 | 镁合金微弧氧化层表面制备导电涂层的处理方法 |
Applications Claiming Priority (1)
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CN201510903271.2A CN105543920B (zh) | 2015-12-10 | 2015-12-10 | 镁合金微弧氧化层表面制备导电涂层的处理方法 |
Publications (2)
Publication Number | Publication Date |
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CN105543920A CN105543920A (zh) | 2016-05-04 |
CN105543920B true CN105543920B (zh) | 2017-11-28 |
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Family Applications (1)
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CN201510903271.2A Active CN105543920B (zh) | 2015-12-10 | 2015-12-10 | 镁合金微弧氧化层表面制备导电涂层的处理方法 |
Country Status (1)
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CN (1) | CN105543920B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105839153B (zh) * | 2016-05-25 | 2018-10-23 | 上海交通大学 | 镁合金表面高导电率高红外发射率膜层的制备方法 |
CN106884195B (zh) * | 2017-02-20 | 2019-08-02 | 山东省科学院新材料研究所 | 一种镀膜镁及其合金及其制备方法 |
CN107955961B (zh) * | 2017-12-05 | 2019-09-10 | 西安文理学院 | 一种镁合金表面导电防腐涂层的制备方法 |
CN110714219A (zh) * | 2019-11-04 | 2020-01-21 | 吉林大学 | 镁合金微弧氧化表面电镀镍的方法 |
CN112064037A (zh) * | 2020-10-13 | 2020-12-11 | 贵州电网有限责任公司 | 一种耐蚀型镁合金牺牲阳极的制备方法 |
CN113463160A (zh) * | 2021-07-02 | 2021-10-01 | 索罗曼(常州)合金新材料有限公司 | 一种钛合金耐磨涂层实现方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002235182A (ja) * | 2001-02-05 | 2002-08-23 | Taiyo Kagaku Kogyo Kk | マグネシウム主体金属成形材及びその製造方法 |
KR100434968B1 (ko) * | 2001-11-09 | 2004-06-16 | 이지환 | 마그네슘 합금에 양극산화피막을 형성한 후 그 위에동도금층 및 니켈도금층을 전해도금으로 형성하는 방법 |
NZ544373A (en) * | 2005-12-20 | 2008-05-30 | Auckland Uniservices Ltd | Micro-arc plasma assisted electroless nickel plating methods |
CN101298200B (zh) * | 2007-04-30 | 2012-03-28 | 比亚迪股份有限公司 | 一种镁合金复合材料及其制备方法 |
CN101092694B (zh) * | 2007-08-15 | 2010-06-23 | 李克清 | 镁合金的表面处理方法 |
CN101161866B (zh) * | 2007-11-23 | 2011-03-02 | 华南理工大学 | 镁及镁合金表面镀层的制备方法 |
CN101694005B (zh) * | 2009-10-09 | 2012-02-08 | 河海大学常州校区 | 一种镁合金表面微弧氧化陶瓷层表面活化溶液及活化方法 |
CN101760733B (zh) * | 2010-01-28 | 2011-08-10 | 西安理工大学 | 以微弧氧化工艺为前处理的镁合金化学镀镍表面处理方法 |
CN102234802B (zh) * | 2010-04-21 | 2012-12-05 | 中国科学院金属研究所 | 一种镁合金表面多层高耐蚀-耐磨复合防护层的制备方法 |
CN102808168B (zh) * | 2012-07-12 | 2014-07-02 | 西安理工大学 | 一种微弧氧化多孔膜改性镁基表面室温化学镀镍的方法 |
CN104141138A (zh) * | 2013-05-07 | 2014-11-12 | 中国科学院金属研究所 | 一种镁合金表面微弧氧化-复合化学镀镍涂层的制备方法 |
TWI515333B (zh) * | 2014-03-17 | 2016-01-01 | 柯惠蘭 | 在鎂合金表面形成保護披覆層之方法及其保護披覆層 |
CN104152898B (zh) * | 2014-08-01 | 2016-06-29 | 桂林理工大学 | 一种镁合金表面微弧氧化自组装化学镀镍涂层及其制备方法 |
CN104746072B (zh) * | 2015-03-30 | 2017-06-13 | 创金美科技(深圳)有限公司 | 一种镁合金微弧离子镀表面处理方法 |
CN104818481A (zh) * | 2015-04-16 | 2015-08-05 | 柳州豪祥特科技有限公司 | 一种镁合金轮毂表面的预处理方法 |
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2015
- 2015-12-10 CN CN201510903271.2A patent/CN105543920B/zh active Active
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Effective date of registration: 20180508 Address after: A, 29 / F, block B, billion King centre, 1 Hongguang Road, Kowloon Bay, Kowloon, Hongkong, China Patentee after: Jia Rui Products Co., Ltd. Address before: 516000 Dayawan West District, Huizhou, Guangdong Province, lotus tea village Patentee before: KA SHUI TECHNOLOGY (HUIZHOU) CO., LTD. |
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Effective date of registration: 20190910 Address after: Room 515-6, 5th floor, Shanghu Building, Phase II, Hong Kong Science Park, Baishijiao, New Territories, Hong Kong, China Patentee after: Nano and Advanced Materials Institute Limited Address before: A, 29 / F, block B, billion King centre, 1 Hongguang Road, Kowloon Bay, Kowloon, Hongkong, China Patentee before: Jia Rui Products Co., Ltd. |
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