CN105522474B - 改进的研磨抛光机 - Google Patents

改进的研磨抛光机 Download PDF

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Publication number
CN105522474B
CN105522474B CN201610035016.5A CN201610035016A CN105522474B CN 105522474 B CN105522474 B CN 105522474B CN 201610035016 A CN201610035016 A CN 201610035016A CN 105522474 B CN105522474 B CN 105522474B
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CN
China
Prior art keywords
head
platen
sample
sample holder
driving
Prior art date
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Application number
CN201610035016.5A
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English (en)
Chinese (zh)
Other versions
CN105522474A (zh
Inventor
查尔斯·E·休伊
道格拉斯·A·希克考斯基
迈克尔·F·哈特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
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Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Publication of CN105522474A publication Critical patent/CN105522474A/zh
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Publication of CN105522474B publication Critical patent/CN105522474B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32—Polishing; Etching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G01N2001/2866—Grinding or homogeneising

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN201610035016.5A 2008-06-20 2009-06-04 改进的研磨抛光机 Active CN105522474B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US7445508P 2008-06-20 2008-06-20
US61/074,455 2008-06-20
US12/470,757 US8574028B2 (en) 2008-06-20 2009-05-22 Grinder/polisher
US12/470,757 2009-05-22
CN200980123745.4A CN102066052B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN200980123745.4A Division CN102066052B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机

Publications (2)

Publication Number Publication Date
CN105522474A CN105522474A (zh) 2016-04-27
CN105522474B true CN105522474B (zh) 2018-06-08

Family

ID=41431727

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201610035016.5A Active CN105522474B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机
CN201711115608.9A Active CN108081116B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机
CN200980123745.4A Active CN102066052B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201711115608.9A Active CN108081116B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机
CN200980123745.4A Active CN102066052B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机

Country Status (6)

Country Link
US (2) US8574028B2 (enExample)
EP (1) EP2300199B1 (enExample)
JP (2) JP2011524820A (enExample)
CN (3) CN105522474B (enExample)
DK (1) DK2300199T3 (enExample)
WO (1) WO2009155137A2 (enExample)

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* Cited by examiner, † Cited by third party
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JP6277075B2 (ja) * 2014-07-16 2018-02-07 株式会社ミツトヨ 硬さ試験機
CN107206566B (zh) * 2014-11-12 2021-05-18 伊利诺斯工具制品有限公司 平面研磨机
US10335919B2 (en) 2015-03-13 2019-07-02 Struers ApS Specimen mover and a method of placing specimens in a specimen mover
CN104875103A (zh) * 2015-06-17 2015-09-02 高金建 一种简易防尘抛光机
JP6523872B2 (ja) * 2015-08-27 2019-06-05 株式会社ディスコ 研削装置
CN105299047A (zh) * 2015-11-16 2016-02-03 耒阳新达微科技有限公司 一种新型轴承加工设备
CN105904336B (zh) * 2016-06-29 2020-08-11 东北大学 金相研磨试样压力调节装置、金相磨抛设备及磨抛方法
US10206682B2 (en) * 2017-01-30 2019-02-19 Ethicon Llc Magnetic tissue compression device with backup mechanical latch
CN106863100A (zh) * 2017-02-23 2017-06-20 中山市森美模型科技有限公司 一种用于不规则形状树脂模型的抛光设备
US11397139B2 (en) 2017-02-27 2022-07-26 Leco Corporation Metallographic grinder and components thereof
US11148175B2 (en) * 2017-06-23 2021-10-19 Lockheed Martin Corporation Nutplate rotary abrasion tool
US11149778B2 (en) * 2017-06-23 2021-10-19 Lockheed Martin Corporation Multiple nutplate rotary abrasion tool
US11787007B2 (en) 2018-06-21 2023-10-17 Illinois Tool Works Inc. Methods and apparatus to control a fluid dispenser on a metallurgical specimen preparation machine
US11491611B2 (en) * 2018-08-14 2022-11-08 Illinois Tool Works Inc. Splash guards for grinder/polisher machines and grinder/polisher machines having splash guards
CN110202480B (zh) * 2019-07-09 2023-09-05 辽宁翔舜科技有限公司 一种全自动快速煤焦光片表面处理机系统及处理方法
CN110455572B (zh) * 2019-08-28 2022-03-29 广东风华高新科技股份有限公司 一种陶瓷电子元件金相切片及其制备方法
US12194589B2 (en) * 2020-03-31 2025-01-14 Illinois Tool Works Inc. Grinding/polishing devices with recall
CN111408995A (zh) * 2020-04-26 2020-07-14 佘小梅 一种红酒杯口打磨装置
CN112223067A (zh) * 2020-07-29 2021-01-15 莱州市蔚仪试验器械制造有限公司 增加试样磨削量控制的多用途磨抛机
US20220126418A1 (en) * 2020-10-26 2022-04-28 Illinois Tool Works Inc. Grinding/polishing systems and methods having proximity sensors
US11897087B2 (en) * 2021-03-11 2024-02-13 Board Of Trustees Of Michigan State University Polishing apparatus for smoothing diamonds
CN113001386A (zh) * 2021-03-12 2021-06-22 湖州刻强制版有限公司 一种便于进行碎屑处理的防飞溅印刷版辊抛光装置
US11756814B1 (en) * 2021-05-27 2023-09-12 Meta Platforms, Inc. Vertical polishing system with multiple degrees of freedom
CN114952434B (zh) * 2022-04-22 2024-05-31 揭阳市奇达餐具有限公司 一种高良品率的机床打磨控制方法
DE102022125705A1 (de) * 2022-10-05 2024-04-11 Atm Qness Gmbh Teller-Schleif-/Poliergerät
US20240189958A1 (en) * 2022-12-07 2024-06-13 Illinois Tool Works Inc. Systems and methods to detect rotation of a vibratory polisher

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Publication number Priority date Publication date Assignee Title
US3233370A (en) * 1963-07-19 1966-02-08 Falk Production of parallel lapped surfaces
US4020600A (en) * 1976-08-13 1977-05-03 Spitfire Tool & Machine Co., Inc. Polishing fixture
US4459785A (en) * 1982-11-08 1984-07-17 Buehler Ltd. Chuck for vertically hung specimen holder
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
CN1005251B (zh) * 1987-04-10 1989-09-27 河北农业大学 金相试样抛光机
US4873792A (en) 1988-06-01 1989-10-17 Buehler, Ltd. Polishing apparatus
CN2181367Y (zh) * 1993-10-06 1994-11-02 贾培清 连续抛丸清理机
US5582534A (en) * 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5800254A (en) 1996-04-01 1998-09-01 Buehler Ltd. Automatic apparatus for grinding and polishing samples
US5816899A (en) * 1996-07-22 1998-10-06 Buehler, Ltd. Micro precise polishing apparatus
US6224474B1 (en) 1999-01-06 2001-05-01 Buehler, Ltd. Magnetic disc system for grinding or polishing specimens
CN2379281Y (zh) * 1999-05-28 2000-05-24 曹苏 石材磨抛机的机头架行走导向机构
JP4408334B2 (ja) * 2001-03-08 2010-02-03 株式会社日立グローバルストレージテクノロジーズ 磁気ヘッド素子の研磨装置
US7070067B1 (en) 2001-11-02 2006-07-04 Buehler, Ltd. Modular fluid-dispensing system
CN1248827C (zh) * 2003-06-27 2006-04-05 沈阳科晶设备制造有限公司 全自控无级调压双无级变速高精度研磨抛光机
USD509837S1 (en) * 2004-10-12 2005-09-20 Sesona Albert J Electric grinder

Also Published As

Publication number Publication date
CN108081116A (zh) 2018-05-29
CN102066052B (zh) 2016-03-02
JP3191524U (ja) 2014-06-26
CN108081116B (zh) 2020-05-26
US8574028B2 (en) 2013-11-05
EP2300199B1 (en) 2012-09-19
WO2009155137A3 (en) 2010-03-25
DK2300199T3 (da) 2013-01-07
US9180571B2 (en) 2015-11-10
CN102066052A (zh) 2011-05-18
CN105522474A (zh) 2016-04-27
US20140030967A1 (en) 2014-01-30
US20090318059A1 (en) 2009-12-24
JP2011524820A (ja) 2011-09-08
EP2300199A2 (en) 2011-03-30
WO2009155137A2 (en) 2009-12-23

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