DK2300199T3 - Forbedret slibe-/poleremaskine - Google Patents

Forbedret slibe-/poleremaskine

Info

Publication number
DK2300199T3
DK2300199T3 DK09767448.5T DK09767448T DK2300199T3 DK 2300199 T3 DK2300199 T3 DK 2300199T3 DK 09767448 T DK09767448 T DK 09767448T DK 2300199 T3 DK2300199 T3 DK 2300199T3
Authority
DK
Denmark
Prior art keywords
polishing machine
improved grinding
grinding
improved
polishing
Prior art date
Application number
DK09767448.5T
Other languages
English (en)
Inventor
Charles E Shewey
Douglas A Ceckowski
Michael F Hart
Original Assignee
Illinois Tool Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works filed Critical Illinois Tool Works
Application granted granted Critical
Publication of DK2300199T3 publication Critical patent/DK2300199T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32—Polishing; Etching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G01N2001/2866—Grinding or homogeneising

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
DK09767448.5T 2008-06-20 2009-06-04 Forbedret slibe-/poleremaskine DK2300199T3 (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7445508P 2008-06-20 2008-06-20
US12/470,757 US8574028B2 (en) 2008-06-20 2009-05-22 Grinder/polisher
PCT/US2009/046190 WO2009155137A2 (en) 2008-06-20 2009-06-04 Improved grinder/polisher

Publications (1)

Publication Number Publication Date
DK2300199T3 true DK2300199T3 (da) 2013-01-07

Family

ID=41431727

Family Applications (1)

Application Number Title Priority Date Filing Date
DK09767448.5T DK2300199T3 (da) 2008-06-20 2009-06-04 Forbedret slibe-/poleremaskine

Country Status (6)

Country Link
US (2) US8574028B2 (da)
EP (1) EP2300199B1 (da)
JP (2) JP2011524820A (da)
CN (3) CN102066052B (da)
DK (1) DK2300199T3 (da)
WO (1) WO2009155137A2 (da)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6277075B2 (ja) * 2014-07-16 2018-02-07 株式会社ミツトヨ 硬さ試験機
CN113290500A (zh) * 2014-11-12 2021-08-24 伊利诺斯工具制品有限公司 平面研磨机
US10335919B2 (en) 2015-03-13 2019-07-02 Struers ApS Specimen mover and a method of placing specimens in a specimen mover
CN104875103A (zh) * 2015-06-17 2015-09-02 高金建 一种简易防尘抛光机
JP6523872B2 (ja) * 2015-08-27 2019-06-05 株式会社ディスコ 研削装置
CN105299047A (zh) * 2015-11-16 2016-02-03 耒阳新达微科技有限公司 一种新型轴承加工设备
CN105904336B (zh) * 2016-06-29 2020-08-11 东北大学 金相研磨试样压力调节装置、金相磨抛设备及磨抛方法
US10206682B2 (en) * 2017-01-30 2019-02-19 Ethicon Llc Magnetic tissue compression device with backup mechanical latch
CN106863100A (zh) * 2017-02-23 2017-06-20 中山市森美模型科技有限公司 一种用于不规则形状树脂模型的抛光设备
US11397139B2 (en) 2017-02-27 2022-07-26 Leco Corporation Metallographic grinder and components thereof
US11148175B2 (en) * 2017-06-23 2021-10-19 Lockheed Martin Corporation Nutplate rotary abrasion tool
US11149778B2 (en) * 2017-06-23 2021-10-19 Lockheed Martin Corporation Multiple nutplate rotary abrasion tool
US11787007B2 (en) 2018-06-21 2023-10-17 Illinois Tool Works Inc. Methods and apparatus to control a fluid dispenser on a metallurgical specimen preparation machine
US11491611B2 (en) * 2018-08-14 2022-11-08 Illinois Tool Works Inc. Splash guards for grinder/polisher machines and grinder/polisher machines having splash guards
CN110202480B (zh) * 2019-07-09 2023-09-05 辽宁翔舜科技有限公司 一种全自动快速煤焦光片表面处理机系统及处理方法
CN110455572B (zh) * 2019-08-28 2022-03-29 广东风华高新科技股份有限公司 一种陶瓷电子元件金相切片及其制备方法
US20210299815A1 (en) * 2020-03-31 2021-09-30 Illinois Tool Works Inc. Grinding/polishing devices with recall
CN111408995A (zh) * 2020-04-26 2020-07-14 佘小梅 一种红酒杯口打磨装置
CN112223067A (zh) * 2020-07-29 2021-01-15 莱州市蔚仪试验器械制造有限公司 增加试样磨削量控制的多用途磨抛机
US20220126418A1 (en) * 2020-10-26 2022-04-28 Illinois Tool Works Inc. Grinding/polishing systems and methods having proximity sensors
WO2022192344A1 (en) * 2021-03-11 2022-09-15 Board Of Trustees Of Michigan State University Polishing apparatus for smoothing diamonds
CN113001386A (zh) * 2021-03-12 2021-06-22 湖州刻强制版有限公司 一种便于进行碎屑处理的防飞溅印刷版辊抛光装置
US11756814B1 (en) * 2021-05-27 2023-09-12 Meta Platforms, Inc. Vertical polishing system with multiple degrees of freedom
CN114952434B (zh) * 2022-04-22 2024-05-31 揭阳市奇达餐具有限公司 一种高良品率的机床打磨控制方法
DE102022125705A1 (de) * 2022-10-05 2024-04-11 Atm Qness Gmbh Teller-Schleif-/Poliergerät
US20240189958A1 (en) * 2022-12-07 2024-06-13 Illinois Tool Works Inc. Systems and methods to detect rotation of a vibratory polisher

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
US3233370A (en) * 1963-07-19 1966-02-08 Falk Production of parallel lapped surfaces
US4020600A (en) * 1976-08-13 1977-05-03 Spitfire Tool & Machine Co., Inc. Polishing fixture
US4459785A (en) * 1982-11-08 1984-07-17 Buehler Ltd. Chuck for vertically hung specimen holder
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
CN1005251B (zh) * 1987-04-10 1989-09-27 河北农业大学 金相试样抛光机
US4873792A (en) 1988-06-01 1989-10-17 Buehler, Ltd. Polishing apparatus
CN2181367Y (zh) * 1993-10-06 1994-11-02 贾培清 连续抛丸清理机
US5582534A (en) * 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5800254A (en) 1996-04-01 1998-09-01 Buehler Ltd. Automatic apparatus for grinding and polishing samples
US5816899A (en) * 1996-07-22 1998-10-06 Buehler, Ltd. Micro precise polishing apparatus
US6224474B1 (en) 1999-01-06 2001-05-01 Buehler, Ltd. Magnetic disc system for grinding or polishing specimens
CN2379281Y (zh) * 1999-05-28 2000-05-24 曹苏 石材磨抛机的机头架行走导向机构
JP4408334B2 (ja) * 2001-03-08 2010-02-03 株式会社日立グローバルストレージテクノロジーズ 磁気ヘッド素子の研磨装置
US7070067B1 (en) 2001-11-02 2006-07-04 Buehler, Ltd. Modular fluid-dispensing system
CN1248827C (zh) * 2003-06-27 2006-04-05 沈阳科晶设备制造有限公司 全自控无级调压双无级变速高精度研磨抛光机
USD509837S1 (en) * 2004-10-12 2005-09-20 Sesona Albert J Electric grinder

Also Published As

Publication number Publication date
WO2009155137A2 (en) 2009-12-23
US20090318059A1 (en) 2009-12-24
EP2300199A2 (en) 2011-03-30
JP3191524U (ja) 2014-06-26
US9180571B2 (en) 2015-11-10
US8574028B2 (en) 2013-11-05
EP2300199B1 (en) 2012-09-19
US20140030967A1 (en) 2014-01-30
WO2009155137A3 (en) 2010-03-25
CN108081116A (zh) 2018-05-29
CN108081116B (zh) 2020-05-26
CN102066052A (zh) 2011-05-18
CN105522474A (zh) 2016-04-27
CN102066052B (zh) 2016-03-02
CN105522474B (zh) 2018-06-08
JP2011524820A (ja) 2011-09-08

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