JP2011524820A - 改良された研削／研磨装置 - Google Patents

改良された研削／研磨装置 Download PDF

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Publication number
JP2011524820A
JP2011524820A JP2011514677A JP2011514677A JP2011524820A JP 2011524820 A JP2011524820 A JP 2011524820A JP 2011514677 A JP2011514677 A JP 2011514677A JP 2011514677 A JP2011514677 A JP 2011514677A JP 2011524820 A JP2011524820 A JP 2011524820A
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JP
Japan
Prior art keywords
platen
grinding
sample holder
polishing apparatus
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2011514677A
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English (en)
Japanese (ja)
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JP2011524820A5 (enExample
Inventor
イー． シウェイ，チャールズ
エー． ケッコウスキー，ダグラス
エフ． ハート，マイケル
Original Assignee
イリノイ トゥール ワークス インコーポレイティド
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Application filed by イリノイ トゥール ワークス インコーポレイティド filed Critical イリノイ トゥール ワークス インコーポレイティド
Publication of JP2011524820A publication Critical patent/JP2011524820A/ja
Publication of JP2011524820A5 publication Critical patent/JP2011524820A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32—Polishing; Etching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G01N2001/2866—Grinding or homogeneising

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2011514677A 2008-06-20 2009-06-04 改良された研削／研磨装置 Pending JP2011524820A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US7445508P 2008-06-20 2008-06-20
US61/074,455 2008-06-20
US12/470,757 2009-05-22
US12/470,757 US8574028B2 (en) 2008-06-20 2009-05-22 Grinder/polisher
PCT/US2009/046190 WO2009155137A2 (en) 2008-06-20 2009-06-04 Improved grinder/polisher

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014001960U Continuation JP3191524U (ja) 2008-06-20 2014-04-15 改良された研削／研磨装置

Publications (2)

Publication Number Publication Date
JP2011524820A true JP2011524820A (ja) 2011-09-08
JP2011524820A5 JP2011524820A5 (enExample) 2012-07-19

Family

ID=41431727

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011514677A Pending JP2011524820A (ja) 2008-06-20 2009-06-04 改良された研削／研磨装置
JP2014001960U Expired - Lifetime JP3191524U (ja) 2008-06-20 2014-04-15 改良された研削／研磨装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014001960U Expired - Lifetime JP3191524U (ja) 2008-06-20 2014-04-15 改良された研削／研磨装置

Country Status (6)

Country Link
US (2) US8574028B2 (enExample)
EP (1) EP2300199B1 (enExample)
JP (2) JP2011524820A (enExample)
CN (3) CN108081116B (enExample)
DK (1) DK2300199T3 (enExample)
WO (1) WO2009155137A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017533834A (ja) * 2014-11-12 2017-11-16 イリノイ トゥール ワークス インコーポレイティド 平面研削盤
JP2019005897A (ja) * 2017-06-23 2019-01-17 ロッキード マーティン コーポレイションＬｏｃｋｈｅｅｄ Ｍａｒｔｉｎ Ｃｏｒｐｏｒａｔｉｏｎ 複数のナットプレートの回転研磨ツール
JP2021534008A (ja) * 2018-08-14 2021-12-09 イリノイ トゥール ワークス インコーポレイティド 研削機／研磨機のスプラッシュガード、及びスプラッシュガードを有する研削機／研磨機

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JP6277075B2 (ja) * 2014-07-16 2018-02-07 株式会社ミツトヨ 硬さ試験機
WO2016146557A1 (en) * 2015-03-13 2016-09-22 Struers A/S A specimen mover and a method of placing specimens in a specimen mover
CN104875103A (zh) * 2015-06-17 2015-09-02 高金建 一种简易防尘抛光机
JP6523872B2 (ja) * 2015-08-27 2019-06-05 株式会社ディスコ 研削装置
CN105299047A (zh) * 2015-11-16 2016-02-03 耒阳新达微科技有限公司 一种新型轴承加工设备
CN105904336B (zh) * 2016-06-29 2020-08-11 东北大学 金相研磨试样压力调节装置、金相磨抛设备及磨抛方法
US10206682B2 (en) * 2017-01-30 2019-02-19 Ethicon Llc Magnetic tissue compression device with backup mechanical latch
CN106863100A (zh) * 2017-02-23 2017-06-20 中山市森美模型科技有限公司 一种用于不规则形状树脂模型的抛光设备
US11397139B2 (en) 2017-02-27 2022-07-26 Leco Corporation Metallographic grinder and components thereof
US11148175B2 (en) * 2017-06-23 2021-10-19 Lockheed Martin Corporation Nutplate rotary abrasion tool
US11787007B2 (en) 2018-06-21 2023-10-17 Illinois Tool Works Inc. Methods and apparatus to control a fluid dispenser on a metallurgical specimen preparation machine
CN110202480B (zh) * 2019-07-09 2023-09-05 辽宁翔舜科技有限公司 一种全自动快速煤焦光片表面处理机系统及处理方法
CN110455572B (zh) * 2019-08-28 2022-03-29 广东风华高新科技股份有限公司 一种陶瓷电子元件金相切片及其制备方法
US12194589B2 (en) * 2020-03-31 2025-01-14 Illinois Tool Works Inc. Grinding/polishing devices with recall
CN111408995A (zh) * 2020-04-26 2020-07-14 佘小梅 一种红酒杯口打磨装置
CN112223067A (zh) * 2020-07-29 2021-01-15 莱州市蔚仪试验器械制造有限公司 增加试样磨削量控制的多用途磨抛机
US20220126418A1 (en) * 2020-10-26 2022-04-28 Illinois Tool Works Inc. Grinding/polishing systems and methods having proximity sensors
WO2022192344A1 (en) * 2021-03-11 2022-09-15 Board Of Trustees Of Michigan State University Polishing apparatus for smoothing diamonds
CN113001386A (zh) * 2021-03-12 2021-06-22 湖州刻强制版有限公司 一种便于进行碎屑处理的防飞溅印刷版辊抛光装置
US11756814B1 (en) * 2021-05-27 2023-09-12 Meta Platforms, Inc. Vertical polishing system with multiple degrees of freedom
CN114952434B (zh) * 2022-04-22 2024-05-31 揭阳市奇达餐具有限公司 一种高良品率的机床打磨控制方法
DE102022125705A1 (de) * 2022-10-05 2024-04-11 Atm Qness Gmbh Teller-Schleif-/Poliergerät
US20240189958A1 (en) * 2022-12-07 2024-06-13 Illinois Tool Works Inc. Systems and methods to detect rotation of a vibratory polisher

Citations (1)

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JPH01321162A (ja) * 1988-06-01 1989-12-27 Buehler Ltd 研磨装置

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US3233370A (en) * 1963-07-19 1966-02-08 Falk Production of parallel lapped surfaces
US4020600A (en) * 1976-08-13 1977-05-03 Spitfire Tool & Machine Co., Inc. Polishing fixture
US4459785A (en) * 1982-11-08 1984-07-17 Buehler Ltd. Chuck for vertically hung specimen holder
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
CN1005251B (zh) * 1987-04-10 1989-09-27 河北农业大学 金相试样抛光机
CN2181367Y (zh) * 1993-10-06 1994-11-02 贾培清 连续抛丸清理机
US5582534A (en) * 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5800254A (en) 1996-04-01 1998-09-01 Buehler Ltd. Automatic apparatus for grinding and polishing samples
US5816899A (en) * 1996-07-22 1998-10-06 Buehler, Ltd. Micro precise polishing apparatus
US6224474B1 (en) 1999-01-06 2001-05-01 Buehler, Ltd. Magnetic disc system for grinding or polishing specimens
CN2379281Y (zh) * 1999-05-28 2000-05-24 曹苏 石材磨抛机的机头架行走导向机构
JP4408334B2 (ja) * 2001-03-08 2010-02-03 株式会社日立グローバルストレージテクノロジーズ 磁気ヘッド素子の研磨装置
US7070067B1 (en) 2001-11-02 2006-07-04 Buehler, Ltd. Modular fluid-dispensing system
CN1248827C (zh) * 2003-06-27 2006-04-05 沈阳科晶设备制造有限公司 全自控无级调压双无级变速高精度研磨抛光机
USD509837S1 (en) * 2004-10-12 2005-09-20 Sesona Albert J Electric grinder

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JPH01321162A (ja) * 1988-06-01 1989-12-27 Buehler Ltd 研磨装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017533834A (ja) * 2014-11-12 2017-11-16 イリノイ トゥール ワークス インコーポレイティド 平面研削盤
JP2019005897A (ja) * 2017-06-23 2019-01-17 ロッキード マーティン コーポレイションＬｏｃｋｈｅｅｄ Ｍａｒｔｉｎ Ｃｏｒｐｏｒａｔｉｏｎ 複数のナットプレートの回転研磨ツール
JP7369515B2 (ja) 2017-06-23 2023-10-26 ロッキード マーティン コーポレーション 複数のナットプレートの回転研磨ツール
JP2021534008A (ja) * 2018-08-14 2021-12-09 イリノイ トゥール ワークス インコーポレイティド 研削機／研磨機のスプラッシュガード、及びスプラッシュガードを有する研削機／研磨機
JP7344278B2 (ja) 2018-08-14 2023-09-13 イリノイ トゥール ワークス インコーポレイティド 研削機／研磨機のスプラッシュガード、及びスプラッシュガードを有する研削機／研磨機

Also Published As

Publication number Publication date
CN108081116B (zh) 2020-05-26
US9180571B2 (en) 2015-11-10
US20090318059A1 (en) 2009-12-24
EP2300199A2 (en) 2011-03-30
JP3191524U (ja) 2014-06-26
CN102066052A (zh) 2011-05-18
US20140030967A1 (en) 2014-01-30
WO2009155137A3 (en) 2010-03-25
US8574028B2 (en) 2013-11-05
EP2300199B1 (en) 2012-09-19
CN108081116A (zh) 2018-05-29
DK2300199T3 (da) 2013-01-07
CN105522474A (zh) 2016-04-27
CN102066052B (zh) 2016-03-02
CN105522474B (zh) 2018-06-08
WO2009155137A2 (en) 2009-12-23

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