CN105518950B - 激光组件和组装激光组件的方法 - Google Patents
激光组件和组装激光组件的方法 Download PDFInfo
- Publication number
- CN105518950B CN105518950B CN201580001570.5A CN201580001570A CN105518950B CN 105518950 B CN105518950 B CN 105518950B CN 201580001570 A CN201580001570 A CN 201580001570A CN 105518950 B CN105518950 B CN 105518950B
- Authority
- CN
- China
- Prior art keywords
- brazing material
- region
- laser module
- capacitor
- metal pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 41
- 239000000463 material Substances 0.000 claims abstract description 76
- 238000005219 brazing Methods 0.000 claims abstract description 68
- 239000003990 capacitor Substances 0.000 claims abstract description 45
- 238000009434 installation Methods 0.000 claims abstract description 33
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims description 68
- 229910052751 metal Inorganic materials 0.000 claims description 68
- 230000008569 process Effects 0.000 claims description 29
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 4
- 229910006913 SnSb Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910017083 AlN Inorganic materials 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000005476 soldering Methods 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 230000001427 coherent effect Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 238000006263 metalation reaction Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0261—Non-optical elements, e.g. laser driver components, heaters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0265—Intensity modulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
- H01S5/0625—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes in multi-section lasers
- H01S5/06255—Controlling the frequency of the radiation
- H01S5/06256—Controlling the frequency of the radiation with DBR-structure
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014162643A JP6542514B2 (ja) | 2014-08-08 | 2014-08-08 | 半導体レーザ装置 |
| JP2014-162643 | 2014-08-08 | ||
| PCT/JP2015/003966 WO2016021203A1 (en) | 2014-08-08 | 2015-08-06 | Laser assembly and method to assemble laser assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105518950A CN105518950A (zh) | 2016-04-20 |
| CN105518950B true CN105518950B (zh) | 2018-12-07 |
Family
ID=55263494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580001570.5A Active CN105518950B (zh) | 2014-08-08 | 2015-08-06 | 激光组件和组装激光组件的方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6542514B2 (enrdf_load_stackoverflow) |
| CN (1) | CN105518950B (enrdf_load_stackoverflow) |
| WO (1) | WO2016021203A1 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6794140B2 (ja) * | 2016-05-23 | 2020-12-02 | オプト エレクトロニクス ソリューションズ | 光送信機及びこれを含む光モジュール |
| DE102017108050B4 (de) * | 2017-04-13 | 2022-01-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterstrahlungsquelle |
| JP7097169B2 (ja) * | 2017-10-27 | 2022-07-07 | 古河電気工業株式会社 | 光素子モジュール及び光素子モジュールの評価方法 |
| JP2019087656A (ja) * | 2017-11-08 | 2019-06-06 | 三菱電機株式会社 | 光モジュールおよびその製造方法 |
| CN112467513B (zh) * | 2019-08-22 | 2025-02-18 | 住友电工光电子器件创新株式会社 | 光学半导体装置和载体 |
| CN114556724B (zh) * | 2019-10-25 | 2024-04-02 | 三菱电机株式会社 | 光半导体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1902763A (zh) * | 2004-01-15 | 2007-01-24 | 松下电器产业株式会社 | 光学收发器模组和光学收发器 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4547063B2 (ja) * | 2000-02-24 | 2010-09-22 | シチズン電子株式会社 | レーザダイオード用マウント構造及びその実装方法 |
| JP3889933B2 (ja) * | 2001-03-02 | 2007-03-07 | シャープ株式会社 | 半導体発光装置 |
| JP4349552B2 (ja) * | 2001-12-26 | 2009-10-21 | 株式会社Ｋｅｌｋ | ペルチェ素子熱電変換モジュール、ペルチェ素子熱電変換モジュールの製造方法および光通信モジュール |
| US7426225B2 (en) * | 2004-02-19 | 2008-09-16 | Sumitomo Electric Industries, Ltd. | Optical sub-assembly having a thermo-electric cooler and an optical transceiver using the optical sub-assembly |
| JP4772560B2 (ja) * | 2006-03-31 | 2011-09-14 | 住友電工デバイス・イノベーション株式会社 | 光半導体装置、およびその制御方法 |
| JP4994173B2 (ja) * | 2007-09-27 | 2012-08-08 | 京セラ株式会社 | 電子部品 |
| JP2012119637A (ja) * | 2010-12-03 | 2012-06-21 | Sumitomo Electric Device Innovations Inc | 光半導体装置の製造方法 |
| US8821042B2 (en) * | 2011-07-04 | 2014-09-02 | Sumitomo Electic Industries, Ltd. | Optical module with lens assembly directly mounted on carrier by soldering and laser diode indirectly mounted on carrier through sub-mount |
| JP2013074187A (ja) * | 2011-09-28 | 2013-04-22 | Oki Electric Ind Co Ltd | モード同期半導体レーザ装置及びモード同期半導体レーザ装置の制御方法 |
-
2014
- 2014-08-08 JP JP2014162643A patent/JP6542514B2/ja active Active
-
2015
- 2015-08-06 CN CN201580001570.5A patent/CN105518950B/zh active Active
- 2015-08-06 WO PCT/JP2015/003966 patent/WO2016021203A1/en active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1902763A (zh) * | 2004-01-15 | 2007-01-24 | 松下电器产业株式会社 | 光学收发器模组和光学收发器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6542514B2 (ja) | 2019-07-10 |
| CN105518950A (zh) | 2016-04-20 |
| JP2016039304A (ja) | 2016-03-22 |
| WO2016021203A1 (en) | 2016-02-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |