CN105493276B - 冷却器 - Google Patents

冷却器 Download PDF

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Publication number
CN105493276B
CN105493276B CN201480047079.1A CN201480047079A CN105493276B CN 105493276 B CN105493276 B CN 105493276B CN 201480047079 A CN201480047079 A CN 201480047079A CN 105493276 B CN105493276 B CN 105493276B
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CN
China
Prior art keywords
mentioned
flow path
refrigerant
pair
refrigerant flow
Prior art date
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Application number
CN201480047079.1A
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English (en)
Chinese (zh)
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CN105493276A (zh
Inventor
水野安浩
岛津智宽
铃木祐有纪
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Denso Corp
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Denso Corp
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Publication date
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Publication of CN105493276A publication Critical patent/CN105493276A/zh
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Publication of CN105493276B publication Critical patent/CN105493276B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
    • F28D1/0325—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/22—Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
    • F28F2009/222—Particular guide plates, baffles or deflectors, e.g. having particular orientation relative to an elongated casing or conduit
    • F28F2009/224—Longitudinal partitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201480047079.1A 2013-08-30 2014-08-25 冷却器 Active CN105493276B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-179332 2013-08-30
JP2013179332A JP5983565B2 (ja) 2013-08-30 2013-08-30 冷却器
PCT/JP2014/004351 WO2015029411A1 (ja) 2013-08-30 2014-08-25 冷却器

Publications (2)

Publication Number Publication Date
CN105493276A CN105493276A (zh) 2016-04-13
CN105493276B true CN105493276B (zh) 2018-05-15

Family

ID=52586001

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480047079.1A Active CN105493276B (zh) 2013-08-30 2014-08-25 冷却器

Country Status (4)

Country Link
US (1) US9818673B2 (enExample)
JP (1) JP5983565B2 (enExample)
CN (1) CN105493276B (enExample)
WO (1) WO2015029411A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102812321B (zh) * 2010-04-09 2015-09-30 英格索尔-兰德公司 成型的微通道热交换器
US9960100B2 (en) * 2014-03-20 2018-05-01 Fuji Electric Co., Ltd Cooler and semiconductor module using same
JP6327271B2 (ja) * 2015-04-17 2018-05-23 株式会社デンソー 熱交換器
JP6447449B2 (ja) * 2015-10-08 2019-01-09 株式会社デンソー 熱交換チューブ
JP6555159B2 (ja) * 2016-03-08 2019-08-07 株式会社デンソー 冷却チューブ
JP6627720B2 (ja) * 2016-11-04 2020-01-08 株式会社デンソー 積層型熱交換器
JP2018093115A (ja) * 2016-12-06 2018-06-14 株式会社デンソー 冷却器
WO2018168088A1 (ja) * 2017-03-16 2018-09-20 三菱電機株式会社 冷却システム
JP6972645B2 (ja) * 2017-05-10 2021-11-24 株式会社デンソー 電力変換装置
TWI626417B (zh) * 2017-07-11 2018-06-11 健策精密工業股份有限公司 散熱裝置以及功率模組
JP6717326B2 (ja) * 2017-07-18 2020-07-01 株式会社デンソー 熱交換器
JP2019021872A (ja) * 2017-07-21 2019-02-07 株式会社デンソー 積層型熱交換器
JP7000777B2 (ja) * 2017-09-28 2022-02-10 株式会社デンソー 熱交換器
CN109982543B (zh) * 2017-12-27 2020-07-28 蜂巢电驱动科技河北有限公司 液冷散热器
DE102019205964A1 (de) * 2018-04-25 2019-10-31 Nidec Corporation Invertersteuervorrichtung
CN108682660B (zh) * 2018-05-18 2020-03-27 中国电子科技集团公司第二十九研究所 一种微型冷却单元及其集成方法和装置
WO2020013348A1 (ko) * 2018-07-09 2020-01-16 엘지전자 주식회사 냉각 장치
JP7087850B2 (ja) * 2018-09-05 2022-06-21 株式会社デンソー 半導体装置
CN109121368B (zh) * 2018-09-21 2020-04-17 贵州永红换热冷却技术有限公司 一种薄壁液冷冷板
WO2020100276A1 (ja) * 2018-11-16 2020-05-22 三菱電機株式会社 プレート式熱交換器、ヒートポンプ装置およびヒートポンプ式冷暖房給湯システム
KR102651940B1 (ko) * 2018-11-22 2024-03-27 현대자동차주식회사 수냉각 장치 및 이를 포함하는 수냉각식 파워 모듈 어셈블리
US11778779B2 (en) * 2018-11-22 2023-10-03 Denso Corporation Electronic component cooling device
JP2020109781A (ja) * 2018-12-28 2020-07-16 日本電産株式会社 冷却装置
US11502349B2 (en) * 2020-08-31 2022-11-15 Borgwarner, Inc. Cooling manifold assembly
US11525638B2 (en) * 2020-10-19 2022-12-13 Dana Canada Corporation High-performance heat exchanger with calibrated bypass
WO2023002628A1 (ja) * 2021-07-21 2023-01-26 日立Astemo株式会社 熱交換器および熱交換器を備えた電力変換装置、熱交換機用インナーフィンの製造方法
EP4350274A1 (en) * 2022-10-05 2024-04-10 Borgwarner Emissions Systems Spain, S.L.U. Heat exchanger
DE102023203656A1 (de) * 2023-04-20 2024-10-24 Robert Bosch Gesellschaft mit beschränkter Haftung Leistungselektronikkühler
US20240408936A1 (en) * 2023-06-07 2024-12-12 Delphi Technologies Ip Limited Systems for cooling module assembly for inverter for electric vehicle

Citations (4)

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CN1849051A (zh) * 2005-04-11 2006-10-18 三星电子株式会社 用于电子装置的散热器设备
JP2008004667A (ja) * 2006-06-21 2008-01-10 Nec Corp 冷却構造及び冷却構造の製造方法
JP2009182313A (ja) * 2008-02-01 2009-08-13 Denso Corp 部品冷却構造
JP2010010418A (ja) * 2008-06-27 2010-01-14 Denso Corp 積層型冷却器

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US3473210A (en) * 1967-01-19 1969-10-21 United Aircraft Prod Method of making a heat exchanger
JPH0674677A (ja) * 1992-08-27 1994-03-18 Mitsubishi Heavy Ind Ltd 積層型熱交換器の製造方法
JP3823584B2 (ja) * 1999-02-15 2006-09-20 日産自動車株式会社 熱交換器
JP4265509B2 (ja) 2003-12-03 2009-05-20 株式会社デンソー 積層型冷却器
DE102004057526B4 (de) * 2003-12-03 2020-08-20 Denso Corporation Stapelkühler
US20060219396A1 (en) * 2005-04-04 2006-10-05 Denso Corporation Lamination-type cooler
JP2007051804A (ja) * 2005-08-17 2007-03-01 T Rad Co Ltd プレート型熱交換器
JP4857074B2 (ja) * 2006-10-24 2012-01-18 カルソニックカンセイ株式会社 プレート型熱交換器
DE102008045845A1 (de) * 2008-09-05 2010-03-11 Behr Gmbh & Co. Kg Strömungsleitelement und Wärmetauscher
JP5316470B2 (ja) 2010-04-22 2013-10-16 株式会社デンソー 積層型熱交換器
JP5545260B2 (ja) 2010-05-21 2014-07-09 株式会社デンソー 熱交換器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1849051A (zh) * 2005-04-11 2006-10-18 三星电子株式会社 用于电子装置的散热器设备
JP2008004667A (ja) * 2006-06-21 2008-01-10 Nec Corp 冷却構造及び冷却構造の製造方法
JP2009182313A (ja) * 2008-02-01 2009-08-13 Denso Corp 部品冷却構造
JP2010010418A (ja) * 2008-06-27 2010-01-14 Denso Corp 積層型冷却器

Also Published As

Publication number Publication date
CN105493276A (zh) 2016-04-13
JP2015050232A (ja) 2015-03-16
US9818673B2 (en) 2017-11-14
WO2015029411A1 (ja) 2015-03-05
JP5983565B2 (ja) 2016-08-31
US20160211192A1 (en) 2016-07-21

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