CN105493276B - 冷却器 - Google Patents

冷却器 Download PDF

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Publication number
CN105493276B
CN105493276B CN201480047079.1A CN201480047079A CN105493276B CN 105493276 B CN105493276 B CN 105493276B CN 201480047079 A CN201480047079 A CN 201480047079A CN 105493276 B CN105493276 B CN 105493276B
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CN
China
Prior art keywords
mentioned
flow path
refrigerant
pair
refrigerant flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480047079.1A
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English (en)
Chinese (zh)
Other versions
CN105493276A (zh
Inventor
水野安浩
岛津智宽
铃木祐有纪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of CN105493276A publication Critical patent/CN105493276A/zh
Application granted granted Critical
Publication of CN105493276B publication Critical patent/CN105493276B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
    • F28D1/0325—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/22—Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
    • F28F2009/222—Particular guide plates, baffles or deflectors, e.g. having particular orientation relative to an elongated casing or conduit
    • F28F2009/224—Longitudinal partitions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201480047079.1A 2013-08-30 2014-08-25 冷却器 Active CN105493276B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013179332A JP5983565B2 (ja) 2013-08-30 2013-08-30 冷却器
JP2013-179332 2013-08-30
PCT/JP2014/004351 WO2015029411A1 (ja) 2013-08-30 2014-08-25 冷却器

Publications (2)

Publication Number Publication Date
CN105493276A CN105493276A (zh) 2016-04-13
CN105493276B true CN105493276B (zh) 2018-05-15

Family

ID=52586001

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480047079.1A Active CN105493276B (zh) 2013-08-30 2014-08-25 冷却器

Country Status (4)

Country Link
US (1) US9818673B2 (enExample)
JP (1) JP5983565B2 (enExample)
CN (1) CN105493276B (enExample)
WO (1) WO2015029411A1 (enExample)

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Publication number Priority date Publication date Assignee Title
CN102812321B (zh) * 2010-04-09 2015-09-30 英格索尔-兰德公司 成型的微通道热交换器
US9960100B2 (en) * 2014-03-20 2018-05-01 Fuji Electric Co., Ltd Cooler and semiconductor module using same
JP6327271B2 (ja) * 2015-04-17 2018-05-23 株式会社デンソー 熱交換器
JP6447449B2 (ja) * 2015-10-08 2019-01-09 株式会社デンソー 熱交換チューブ
JP6555159B2 (ja) * 2016-03-08 2019-08-07 株式会社デンソー 冷却チューブ
JP6627720B2 (ja) * 2016-11-04 2020-01-08 株式会社デンソー 積層型熱交換器
JP2018093115A (ja) * 2016-12-06 2018-06-14 株式会社デンソー 冷却器
JP6674538B2 (ja) * 2017-03-16 2020-04-01 三菱電機株式会社 冷却システム
JP6972645B2 (ja) * 2017-05-10 2021-11-24 株式会社デンソー 電力変換装置
TWI626417B (zh) * 2017-07-11 2018-06-11 健策精密工業股份有限公司 散熱裝置以及功率模組
JP6717326B2 (ja) * 2017-07-18 2020-07-01 株式会社デンソー 熱交換器
JP2019021872A (ja) * 2017-07-21 2019-02-07 株式会社デンソー 積層型熱交換器
JP7000777B2 (ja) * 2017-09-28 2022-02-10 株式会社デンソー 熱交換器
CN109982543B (zh) * 2017-12-27 2020-07-28 蜂巢电驱动科技河北有限公司 液冷散热器
CN110402062B (zh) * 2018-04-25 2020-12-01 日本电产株式会社 逆变器控制装置
CN108682660B (zh) * 2018-05-18 2020-03-27 中国电子科技集团公司第二十九研究所 一种微型冷却单元及其集成方法和装置
WO2020013348A1 (ko) * 2018-07-09 2020-01-16 엘지전자 주식회사 냉각 장치
JP7087850B2 (ja) * 2018-09-05 2022-06-21 株式会社デンソー 半導体装置
CN109121368B (zh) * 2018-09-21 2020-04-17 贵州永红换热冷却技术有限公司 一种薄壁液冷冷板
WO2020100276A1 (ja) * 2018-11-16 2020-05-22 三菱電機株式会社 プレート式熱交換器、ヒートポンプ装置およびヒートポンプ式冷暖房給湯システム
US11778779B2 (en) * 2018-11-22 2023-10-03 Denso Corporation Electronic component cooling device
KR102651940B1 (ko) * 2018-11-22 2024-03-27 현대자동차주식회사 수냉각 장치 및 이를 포함하는 수냉각식 파워 모듈 어셈블리
JP2020109781A (ja) * 2018-12-28 2020-07-16 日本電産株式会社 冷却装置
US11502349B2 (en) * 2020-08-31 2022-11-15 Borgwarner, Inc. Cooling manifold assembly
US11525638B2 (en) * 2020-10-19 2022-12-13 Dana Canada Corporation High-performance heat exchanger with calibrated bypass
US20240255233A1 (en) * 2021-07-21 2024-08-01 Hitachi Astemo, Ltd. Heat exchanger, power conversion device including heat exchanger, and method for manufacturing inner fin for heat exchanger
EP4350274A1 (en) * 2022-10-05 2024-04-10 Borgwarner Emissions Systems Spain, S.L.U. Heat exchanger
DE102023203656A1 (de) * 2023-04-20 2024-10-24 Robert Bosch Gesellschaft mit beschränkter Haftung Leistungselektronikkühler
US12526961B2 (en) 2023-06-07 2026-01-13 BorgWarner US Technologies LLC Systems for cooling module assembly for inverter for electric vehicle
US12528329B2 (en) * 2023-06-07 2026-01-20 BorgWarner US Technologies LLC Systems for cooling module assembly for inverter for electric vehicle

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1849051A (zh) * 2005-04-11 2006-10-18 三星电子株式会社 用于电子装置的散热器设备
JP2008004667A (ja) * 2006-06-21 2008-01-10 Nec Corp 冷却構造及び冷却構造の製造方法
JP2009182313A (ja) * 2008-02-01 2009-08-13 Denso Corp 部品冷却構造
JP2010010418A (ja) * 2008-06-27 2010-01-14 Denso Corp 積層型冷却器

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US3473210A (en) * 1967-01-19 1969-10-21 United Aircraft Prod Method of making a heat exchanger
JPH0674677A (ja) * 1992-08-27 1994-03-18 Mitsubishi Heavy Ind Ltd 積層型熱交換器の製造方法
JP3823584B2 (ja) * 1999-02-15 2006-09-20 日産自動車株式会社 熱交換器
DE102004057526B4 (de) 2003-12-03 2020-08-20 Denso Corporation Stapelkühler
JP4265509B2 (ja) 2003-12-03 2009-05-20 株式会社デンソー 積層型冷却器
US20060219396A1 (en) * 2005-04-04 2006-10-05 Denso Corporation Lamination-type cooler
JP2007051804A (ja) * 2005-08-17 2007-03-01 T Rad Co Ltd プレート型熱交換器
JP4857074B2 (ja) * 2006-10-24 2012-01-18 カルソニックカンセイ株式会社 プレート型熱交換器
DE102008045845A1 (de) * 2008-09-05 2010-03-11 Behr Gmbh & Co. Kg Strömungsleitelement und Wärmetauscher
JP5316470B2 (ja) 2010-04-22 2013-10-16 株式会社デンソー 積層型熱交換器
JP5545260B2 (ja) 2010-05-21 2014-07-09 株式会社デンソー 熱交換器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1849051A (zh) * 2005-04-11 2006-10-18 三星电子株式会社 用于电子装置的散热器设备
JP2008004667A (ja) * 2006-06-21 2008-01-10 Nec Corp 冷却構造及び冷却構造の製造方法
JP2009182313A (ja) * 2008-02-01 2009-08-13 Denso Corp 部品冷却構造
JP2010010418A (ja) * 2008-06-27 2010-01-14 Denso Corp 積層型冷却器

Also Published As

Publication number Publication date
JP5983565B2 (ja) 2016-08-31
WO2015029411A1 (ja) 2015-03-05
CN105493276A (zh) 2016-04-13
JP2015050232A (ja) 2015-03-16
US9818673B2 (en) 2017-11-14
US20160211192A1 (en) 2016-07-21

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