CN105466463B - 传感器芯片 - Google Patents

传感器芯片 Download PDF

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Publication number
CN105466463B
CN105466463B CN201510621626.9A CN201510621626A CN105466463B CN 105466463 B CN105466463 B CN 105466463B CN 201510621626 A CN201510621626 A CN 201510621626A CN 105466463 B CN105466463 B CN 105466463B
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CN
China
Prior art keywords
stack
opening
substrate
sensing element
sensor chip
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Active
Application number
CN201510621626.9A
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English (en)
Chinese (zh)
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CN105466463A (zh
Inventor
F·梅耶
U·巴特世
M·维因格
M·格拉夫
P·格尔纳
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Sheng Sirui Co Ltd
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Sheng Sirui Co Ltd
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Publication date
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Publication of CN105466463A publication Critical patent/CN105466463A/zh
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/048—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance for determining moisture content of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/128—Microapparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/14—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/223—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity
    • G01N27/225—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity by using hygroscopic materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004—Gaseous mixtures, e.g. polluted air
    • G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
    • G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
    • G01N33/0036—General constructional details of gas analysers, e.g. portable test equipment concerning the detector specially adapted to detect a particular component
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Medicinal Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Measuring Fluid Pressure (AREA)
CN201510621626.9A 2014-09-26 2015-09-25 传感器芯片 Active CN105466463B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP14186534.5 2014-09-26
EP14186534.5A EP3001186B1 (en) 2014-09-26 2014-09-26 Sensor chip

Publications (2)

Publication Number Publication Date
CN105466463A CN105466463A (zh) 2016-04-06
CN105466463B true CN105466463B (zh) 2019-11-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510621626.9A Active CN105466463B (zh) 2014-09-26 2015-09-25 传感器芯片

Country Status (5)

Country Link
US (1) US9506885B2 (https=)
EP (1) EP3001186B1 (https=)
JP (1) JP6713259B2 (https=)
KR (1) KR102361998B1 (https=)
CN (1) CN105466463B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102609714B1 (ko) * 2016-04-27 2023-12-05 엘지전자 주식회사 센서
JP6803579B2 (ja) * 2016-06-08 2020-12-23 Ｎｉｓｓｈａ株式会社 Ｍｅｍｓガスセンサ、ｍｅｍｓガスセンサ実装体、ｍｅｍｓガスセンサ・パッケージ、ｍｅｍｓガスセンサ組立体、及びｍｅｍｓガスセンサの製造方法
EP3139159A1 (en) * 2016-08-23 2017-03-08 Sensirion AG Sensor assembly
JP7081354B2 (ja) * 2017-07-19 2022-06-07 地方独立行政法人東京都立産業技術研究センター センサ保持基板及びセンサモジュール
KR102520038B1 (ko) 2018-01-10 2023-04-12 삼성전자주식회사 가스 센서 패키지 및 이를 포함하는 센싱 장치
US20200150069A1 (en) 2018-11-12 2020-05-14 Ams Sensors Uk Limited Gas sensor
US11674916B2 (en) 2018-11-12 2023-06-13 Sciosense B.V. Gas sensor
JP7445920B2 (ja) * 2020-07-02 2024-03-08 パナソニックＩｐマネジメント株式会社 ガスセンサ装置
US20230105338A1 (en) 2021-10-05 2023-04-06 Globalfoundries U.S. Inc. Contact-free biosensor
US12339247B2 (en) 2022-04-07 2025-06-24 Globalfoundries U.S. Inc. Field effect transistor with buried fluid-based gate and method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1533741A (zh) * 2003-03-31 2004-10-06 ��ʿͨ��ʽ���� 用于指纹识别的半导体装置
CN1193227C (zh) * 2000-07-19 2005-03-16 Lg电子株式会社 绝对湿度传感器
CN1279348C (zh) * 2002-03-20 2006-10-11 株式会社电装 电容型湿度传感器
EP2481703A1 (en) * 2011-01-27 2012-08-01 Sensirion AG Sensor protection
EP2620768A1 (en) * 2012-01-25 2013-07-31 Sensirion AG Portable sensing device
DE202013102632U1 (de) * 2013-06-19 2013-12-20 Sensirion Ag Sensorbaustein
CN103969311A (zh) * 2013-01-31 2014-08-06 盛思锐股份公司 化学传感器及用于制造该化学传感器的方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2880651B2 (ja) 1994-08-12 1999-04-12 東京瓦斯株式会社 熱式マイクロフローセンサ及びその製造方法
DE19928297A1 (de) 1999-06-22 2000-12-28 Bosch Gmbh Robert Verfahren zur Herstellung eines Sensors mit einer Membran
US6384353B1 (en) 2000-02-01 2002-05-07 Motorola, Inc. Micro-electromechanical system device
JP2004518119A (ja) 2001-01-10 2004-06-17 ゼンジリオン アクチエンゲゼルシャフト 伸張性コーティングを有するマイクロメカニカルフローセンサ
US6528875B1 (en) 2001-04-20 2003-03-04 Amkor Technology, Inc. Vacuum sealed package for semiconductor chip
US20030037590A1 (en) 2001-08-27 2003-02-27 Stark Kevin C. Method of self-testing a semiconductor chemical gas sensor including an embedded temperature sensor
US6841883B1 (en) 2003-03-31 2005-01-11 Micron Technology, Inc. Multi-dice chip scale semiconductor components and wafer level methods of fabrication
JP2005109221A (ja) 2003-09-30 2005-04-21 Toshiba Corp ウェーハレベルパッケージ及びその製造方法
US6936918B2 (en) 2003-12-15 2005-08-30 Analog Devices, Inc. MEMS device with conductive path through substrate
JP2006226743A (ja) 2005-02-16 2006-08-31 Mitsubishi Electric Corp 加速度センサ
DE102008025599B4 (de) 2007-05-14 2013-02-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gehäuste aktive Mikrostrukturen mit Direktkontaktierung zu einem Substrat
JP5137059B2 (ja) 2007-06-20 2013-02-06 新光電気工業株式会社 電子部品用パッケージ及びその製造方法と電子部品装置
JP5031492B2 (ja) 2007-09-06 2012-09-19 キヤノン株式会社 インクジェットヘッド基板の製造方法
JP5237607B2 (ja) 2007-10-25 2013-07-17 新光電気工業株式会社 基板の製造方法
KR100942439B1 (ko) 2007-12-28 2010-02-17 전자부품연구원 마이크로 가스센서 및 제조방법
US20090212397A1 (en) 2008-02-22 2009-08-27 Mark Ewing Tuttle Ultrathin integrated circuit and method of manufacturing an ultrathin integrated circuit
EP2154713B1 (en) 2008-08-11 2013-01-02 Sensirion AG Method for manufacturing a sensor device with a stress relief layer
JP2010212297A (ja) 2009-03-06 2010-09-24 Toshiba Corp 半導体装置および半導体装置の製造方法
JP2011064509A (ja) * 2009-09-15 2011-03-31 Alps Electric Co Ltd 湿度センサパッケージ及びその製造方法
US8736002B2 (en) 2009-11-18 2014-05-27 Sensirion Ag Sensor mounted in flip-chip technology at a substrate edge
EP2502066B1 (en) 2009-11-18 2017-09-27 Sensirion AG Sensor mounted in flip-chip technology on a substrate and its manufacture
US20110138882A1 (en) 2009-12-11 2011-06-16 Electronics And Telecommunications Research Institute Semiconductor gas sensor having low power consumption
EP2348292A1 (en) 2010-01-13 2011-07-27 Sensirion AG Sensor device
JP5403695B2 (ja) * 2010-09-30 2014-01-29 フィガロ技研株式会社 ガスセンサ
JP5595230B2 (ja) * 2010-11-05 2014-09-24 フィガロ技研株式会社 ガスセンサ
US8354729B2 (en) * 2010-12-27 2013-01-15 Industrial Technology Research Institute Gas sensor and manufacturing method thereof
EP2482310B1 (en) 2011-01-27 2020-09-23 Sensirion AG Through vias in a sensor chip
JP5849836B2 (ja) * 2012-04-10 2016-02-03 株式会社デンソー 湿度センサ
US8907433B2 (en) 2012-09-28 2014-12-09 Agilent Technologies, Inc. Thin film with improved temperature range
US9379081B2 (en) * 2014-03-24 2016-06-28 King Dragon Nternational Inc. Semiconductor device package and method of the same
EP2765410B1 (en) * 2014-06-06 2023-02-22 Sensirion AG Gas sensor package

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1193227C (zh) * 2000-07-19 2005-03-16 Lg电子株式会社 绝对湿度传感器
CN1279348C (zh) * 2002-03-20 2006-10-11 株式会社电装 电容型湿度传感器
CN1533741A (zh) * 2003-03-31 2004-10-06 ��ʿͨ��ʽ���� 用于指纹识别的半导体装置
EP2481703A1 (en) * 2011-01-27 2012-08-01 Sensirion AG Sensor protection
EP2620768A1 (en) * 2012-01-25 2013-07-31 Sensirion AG Portable sensing device
CN103969311A (zh) * 2013-01-31 2014-08-06 盛思锐股份公司 化学传感器及用于制造该化学传感器的方法
DE202013102632U1 (de) * 2013-06-19 2013-12-20 Sensirion Ag Sensorbaustein

Also Published As

Publication number Publication date
KR20160037119A (ko) 2016-04-05
US9506885B2 (en) 2016-11-29
JP6713259B2 (ja) 2020-06-24
EP3001186A1 (en) 2016-03-30
CN105466463A (zh) 2016-04-06
KR102361998B1 (ko) 2022-02-10
US20160091446A1 (en) 2016-03-31
EP3001186B1 (en) 2018-06-06
JP2016070931A (ja) 2016-05-09

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