CN1054469C - 形成半导体器件的方法 - Google Patents
形成半导体器件的方法 Download PDFInfo
- Publication number
- CN1054469C CN1054469C CN93105438A CN93105438A CN1054469C CN 1054469 C CN1054469 C CN 1054469C CN 93105438 A CN93105438 A CN 93105438A CN 93105438 A CN93105438 A CN 93105438A CN 1054469 C CN1054469 C CN 1054469C
- Authority
- CN
- China
- Prior art keywords
- gate electrode
- insulating film
- film
- semiconductor
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
- H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/60—Impurity distributions or concentrations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/021—Manufacture or treatment using multiple gate spacer layers, e.g. bilayered sidewall spacers
Landscapes
- Thin Film Transistor (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP115503/92 | 1992-04-07 | ||
| JP4115503A JP3071940B2 (ja) | 1992-04-07 | 1992-04-07 | 絶縁ゲイト型半導体装置の作製方法 |
| JP115503/1992 | 1992-04-07 | ||
| JP5089117A JPH06275646A (ja) | 1993-03-24 | 1993-03-24 | 薄膜トランジスタの作製方法 |
| JP089117/1992 | 1993-03-24 | ||
| JP089117/92 | 1993-03-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1078068A CN1078068A (zh) | 1993-11-03 |
| CN1054469C true CN1054469C (zh) | 2000-07-12 |
Family
ID=26430549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN93105438A Expired - Fee Related CN1054469C (zh) | 1992-04-07 | 1993-04-07 | 形成半导体器件的方法 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR970003917B1 (cg-RX-API-DMAC10.html) |
| CN (1) | CN1054469C (cg-RX-API-DMAC10.html) |
| TW (1) | TW223703B (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105637646A (zh) * | 2013-10-28 | 2016-06-01 | 富士电机株式会社 | 碳化硅半导体装置及其制造方法 |
| CN107799605A (zh) * | 2017-10-27 | 2018-03-13 | 合肥鑫晟光电科技有限公司 | 一种薄膜晶体管及其制备方法、阵列基板、显示装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3469337B2 (ja) * | 1994-12-16 | 2003-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN102569053B (zh) * | 2012-01-18 | 2014-12-24 | 上海华力微电子有限公司 | 一种形成高介电常数金属栅的方法 |
| CN105977306A (zh) * | 2016-06-21 | 2016-09-28 | 北京大学深圳研究生院 | 一种自对准薄膜晶体管及其制备方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0451968A1 (en) * | 1990-04-11 | 1991-10-16 | THE GENERAL ELECTRIC COMPANY, p.l.c. | Process for manufacturing thin film transistor |
-
1993
- 1993-04-06 KR KR93005710A patent/KR970003917B1/ko not_active Expired - Fee Related
- 1993-04-07 CN CN93105438A patent/CN1054469C/zh not_active Expired - Fee Related
- 1993-04-08 TW TW082102610A patent/TW223703B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0451968A1 (en) * | 1990-04-11 | 1991-10-16 | THE GENERAL ELECTRIC COMPANY, p.l.c. | Process for manufacturing thin film transistor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105637646A (zh) * | 2013-10-28 | 2016-06-01 | 富士电机株式会社 | 碳化硅半导体装置及其制造方法 |
| CN107799605A (zh) * | 2017-10-27 | 2018-03-13 | 合肥鑫晟光电科技有限公司 | 一种薄膜晶体管及其制备方法、阵列基板、显示装置 |
| US10615051B2 (en) | 2017-10-27 | 2020-04-07 | Boe Technology Group Co., Ltd. | Thin-film transistor and method of manufacturing the same, array substrate, and display apparatus |
| CN107799605B (zh) * | 2017-10-27 | 2020-07-31 | 合肥鑫晟光电科技有限公司 | 一种薄膜晶体管及其制备方法、阵列基板、显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1078068A (zh) | 1993-11-03 |
| KR930022600A (ko) | 1993-11-24 |
| KR970003917B1 (en) | 1997-03-22 |
| TW223703B (cg-RX-API-DMAC10.html) | 1994-05-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20000712 Termination date: 20100407 |