CN105367129B - 生产模制体的方法及模制体 - Google Patents

生产模制体的方法及模制体 Download PDF

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CN105367129B
CN105367129B CN201510512455.6A CN201510512455A CN105367129B CN 105367129 B CN105367129 B CN 105367129B CN 201510512455 A CN201510512455 A CN 201510512455A CN 105367129 B CN105367129 B CN 105367129B
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molding
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carborundum
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杰里迈亚斯·舍恩菲尔德
罗兰德·韦斯
哥萨德·纳奥迪特
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Schunk Kohlenstofftechnik GmbH
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Abstract

本发明涉及一种生产模制体的方法和一种模制体。该模制体具有碳化硅支撑基质和一体碳结构，其中，基于含有碳化硅或硅以及碳的粉末混合物和粘合剂的基体以衍生法成层构建，且其中粘合剂固化后，基体被热解用于制成该模制体，其中通过热解粘合剂，以及通过上述粉末混合物的碳含量或将碳材料渗透进碳化硅支撑基质，可以调节碳结构的碳含量。

Description

生产模制体的方法及模制体
技术领域
本发明涉及一种生产模制体的方法和一种模制体。
背景技术
基于粉末状或颗粒状材料以及粘合剂而生产模制体的方法通过术语3D打印被人熟知，通过用于3D打印的激光打印装置或所谓的“多喷头成型”装置，例如可以被用来将基于预设的设计数据构建成层模制体。
在这方面，将粘合剂提供至用于构建基体的基材也为人熟知，例如，粘合剂可以为酚醛树脂且用于确保固化后模制体尺寸的稳定性。
发明内容
本发明旨在提出一种模制体的生产方法，该模制体一方面具有高机械稳定性，另一方面，其电气性能或摩擦性能可被调节。
为此，本发明提出一种生产模制体的方法，所述模制体包括碳化硅支撑基质和一体碳结构，其中，基于含有碳化硅或硅以及碳的粉末混合物和粘合剂的基体以衍生法成层构建，且其中所述粘合剂固化后，发生所述基体的热解用于实现所述模制体，其中通过热解所述粘合剂，以及通过所述粉末混合物的碳含量或将碳材料渗透进所述碳化硅支撑基质来调节所述碳结构的碳含量。
根据本发明的方法可以生产出具有碳化硅支撑基质和一体碳结构的模制体，该模制体由于碳化硅支撑基质呈现出高机械稳定性，且由于形成为一体的碳结构，其电气性能或摩擦性能是可调节的。
根据本发明的方法，基于含有碳化硅或硅和碳的粉末混合物和粘合剂，通过衍生法(generative method)初步构建基体，为了实现模制体，该基体在随后的方法步骤中被热解，以使碳结构的碳含量可通过由热解粘合剂生成的高温碳来调节，或通过粉末混合物的碳含量调节，和/或适当时通过另一种碳材料的渗透调节。
在本发明中，术语“碳含量”是指实现碳结构的游离碳的总体含量，即未化合的碳的总体含量。
优选地，粉末混合物的碳含量按重量计在0和30％之间，其中在粉末混合物仅含有较少碳化硅或根本没有碳化硅的情况下，粉末混合物的碳含量更有可能在指示区域的上限区域内。
特别优选的是，粉末混合物的碳含量按重量计在10％和20％之间。
如果粉末混合物的碳化硅颗粒部分具有平均粒径DS50在0.5μm和100μm之间的颗粒，那么可以获得特别充分混合的粉末混合物。另外，模制体所需的物理性质可被容易调节。
如果平均粒径DS50在2μm和60μm之间，可以达到特别好的结果。
如果为了调节模制体的碳含量，那么在热解基体之后，碳化硅支撑基质被实现为聚合物的碳材料渗透，该碳材料通过随后的热解转变成碳，任何留存在碳化硅支撑基质中的游离硅可同时转变成用于增强该支撑基质的碳化硅，而且任何多余的高温碳可被用来实现碳结构。
可选地，当然也有另一种可能，即将碳作为烟尘悬浮液，或通过碳的气相沉积引入基体，由此用碳渗透该基体。
以这种方式被引入的碳可以部分地用来在与碳化硅支撑基质内含有的游离硅反应烧制中增强碳化硅支撑基质，且部分地用于构建碳结构。
优选地，含硅或含碳化硅的聚合物可用作上述聚合物，诸如，硅氧烷、硅氮烷、碳硅氧烷、碳硅氮烷或碳硅烷。
可选地，或结合上面提到的聚合物，也可使用预聚合物，例如聚酰亚胺和氰酸酯树脂。
如果酚醛树脂、呋喃树脂和氰酸酯树脂被用作聚合物，有可能将这些聚合物同时用作粘合剂来构建基体。
根据本方法的另一个有利变型，如果在热解之后，用硅来渗透碳化硅支撑基质，那么在碳化硅支撑基质中可能形成的任何游离碳可通过随后的反应烧制至少部分地转变成碳化硅，以获得具有所需游离碳含量的碳结构。
优选地，通过碳化硅的气相沉积，碳化硅支撑基质被碳化硅渗透，其中，尤其是根据所需的渗透深度，可以利用化学气相渗透(CVI)方法或化学气相沉积(CVD)方法。
在热解之后实行的，用硅或碳化硅对碳化硅支撑基质的进一步渗透允许封装碳结构以防止被腐蚀，且用作机械保护，其中尤其是，用硅对支撑基质的渗透可通过将模制体浸润在液态硅中或通过应用“液体硅渗透”法而实现。
作为硅渗透的替换项，或除了硅渗透之外，用碳化硅对支撑基质的渗透可优选地通过碳化硅的气相沉积而实现。根据要求，接下来的碳化硅封装可通过CVI或CVD方法实现，以使在使用CVI方法的情况下，尤其是碳化硅可较深地渗透进支撑基质，然而CVD方法的应用更允许构建封装模制体的外轮廓的碳化硅层。
根据本发明的模制体具有碳化硅支撑基质和一体碳结构，包括基于含有碳化硅或硅以及碳的粉末混合物和粘合剂以衍生法成层构建的基体，其中所述模制体的碳含量按重量计在10％至30％范围内。
根据本发明，该模制体包括碳化硅支撑基质和一体碳结构，具有基于含有碳化硅或硅和碳的粉末混合物与粘合剂通过衍生法构建成层的基体，其中模制体的碳含量按重量计在10％至30％范围内。
根据本发明的模制体由于碳化硅支撑基质呈现出高机械稳定性，且其电气性能或摩擦性能通过其碳含量被限定。在此，尤其是通过调节碳含量，也就是模制体中用于实现一体碳结构的游离碳的比例，模制体的导电性可被调节。同样地，模制体的固体润滑性能会受到碳含量的影响。
优选地，用于实现模制体的材料的比电阻在150μOhm和800μOhm之间。
特别优选的是用于实现模制体的材料的比电阻在300μOhm和600μOhm之间。
在特别优选的实施例中，模制体被构造成壳状，以使模制体的构造可以适应技术用途，也就是例如支承壳体构造，或可被电加热的套筒式加热元件的构造。
如果模制体被实现为网格结构，那么多孔但仍极其稳定的设计是有可能的。
根据本发明的模制体的特点在于具有特别多的用途，以使根据本发明的模制体可有利地被实现且用作电阻加热元件或静态混合器，静态混合器尤其可使在流通轴(flow-through axis)的方向上流动穿过静态混合器的介质均质化。这种静态混合器可用作例如多孔燃烧器中的燃烧区，或用于产生合成气体。
模制体的有利的应用领域也包括用作轴承体，其中利用了碳结构的固体润滑性能。
附图说明
下面将结合附图具体阐述该方法的优选变型以及利用该方法生产的模制体的多种实施例。在附图中：
图1至图3示出了实现为电阻加热元件的模制体；
图2是图1所示的电阻加热元件的结构的示意图；
图3示出了碳化硅支撑基质；
图4示出了图3所示的结构，聚合物实现为酚醛树脂且渗透进支撑基质；
图5示出了在为了将聚合物转变成热解碳而实行热解之后，图4所示的结构；
图6示出了实现为静态混合器的模制体；
图7示出了模制体的网格结构；
图8示出了生产模制体的方法的示意图。
具体实施方式
图1示出了电阻加热元件，该电阻加热元件被实现为“隧道式加热器”，且形成为管状，以具有圆形横截面。该电阻加热元件包括具有薄管壁11的模制体22，管壁11包括形式为两个狭缝12和13的孔。狭缝12和13设在电阻加热元件10的下端14的区域内，并在其纵向上呈直线状，以此形成两个连接面15和16用于将电阻加热元件10连接至连接设备(此处未更详细示出)的连接触点。
在模制体22的中心区域17内，每种情况下的狭缝12和13在纵向上沿着管壁11的周缘成螺旋形地延伸至电阻加热元件的上端18。以这种方式，狭缝12和13形成两个加热线圈19和20，这两个线圈在环形部32内在其各自的上端处相互连接。电阻加热元件在操作过程中，大体在加热线圈19和20的区域内被加热。电阻加热元件实现为一件式且大体由碳化硅和碳组成。
图2示出了图1所示模制体22的结构截面的一部分的放大示意图。该结构呈现了碳化硅支撑基质21，其中碳结构23被结合在碳化硅支撑基质21内。内壁表面24和外壁表面25都备有碳化硅涂层26或27。
在图3至图5中，利用结构说明，用于生产图2所示的模制体22的结构的连续的方法步骤将通过示例阐明。
图3示出了包括碳化硅颗粒28的基体的结构，碳化硅颗粒28通过粘合剂颗粒29相互连接。该基体通过固化粘合剂颗粒29获得其尺寸稳定性。
图4示出了具有聚合物颗粒30的结构，聚合物颗粒30被结合在基体的碳化硅支撑基质21内，且由例如酚醛树脂形成。
图5示出了聚合物颗粒30，聚合物颗粒30在热解步骤后转变为碳颗粒31，且在碳化硅支撑基质21内实现碳结构23。
最后，带有碳化硅颗粒28的涂层通过CVD方法实现，用于实现图2所示的在内壁表面24上的碳化硅涂层26，且用于实现电阻加热元件10的外壁表面25上的碳化硅涂层27。
图6示出了模制体40，该模制体40实现为静态混合器，且备有在相对于流通轴41的每个轴向端42、43处的电连接单元44，在该实施例中，该单元44由石墨材料形成，且用于将电流输进或输出模制体40。
实现为静态混合器的模制体40具有三维网格结构45，该结构由模制体40的交错的材料横片(crosspiece)46、47形成。在此，尤其是如图7所示的没有任何连接单元44的模制体40中，材料横片46、47在相互贯穿的横片面48、49中延伸。由于衍生法(例如3D打印方法)成层构建的网格结构45，材料横片46、47一体式相互连接。
通过示例，图8示出了生产如图1、图6和图7所示的模制体22、40的方法，通过示例，这些模制体被构造成电阻加热元件(如图1所示)或静态混合器(如图6所示)。
图8所示的方法从生产粉末混合物50开始，该混合物50可包括不同比例的碳化硅或硅和碳，或碳化硅、硅和碳，而且作为粘合剂51的含碳的合成树脂(例如，酚醛树脂)可加入该混合物50，使得在随后的均质化阶段52中生成均质混合物53，该均质混合物53被提供给3D打印单元54且在层构建过程中转变成基体55，该基体在工作炉种固化后又经历热解56。由于热解，粘合剂51转变成碳，且粉末混合物50中任何比例的碳和硅同样通过反应烧制被转变成碳化硅。
热解的成果是得到机械结构稳定的模制体20、44，该模制体中用于实现碳结构的游离碳的比例是由粉末混合物50的组成决定的，或由硅和碳反应烧制后剩余的游离碳的残留比例决定的。
可能留存在模制体22、40表面处，或在碳化硅支撑基质中不以封装形式存在的任何游离碳可在用硅渗透之后，在另一工作炉内进行的随后的反应烧制中转变成碳化硅。
为了防止在反应烧制后，在碳化硅支撑基质中或在模制体表面存在任何游离碳，在另一工作炉中，游离碳可在真空气氛中蒸发掉。

Claims (24)

1.一种生产模制体(22，40)的方法，所述模制体包括碳化硅支撑基质(21)和一体碳结构(23)，其中，基于含有碳化硅和碳的粉末混合物(50)或含有硅和碳的粉末混合物(50)和粘合剂(51)的基体以衍生法成层构建，
且其中所述粘合剂固化后，发生所述基体的热解(56)用于实现所述模制体，
其中所述碳结构的碳含量由游离碳的总体含量定义，通过热解所述粘合剂，以及通过所述粉末混合物的碳含量或将碳材料渗透进所述碳化硅支撑基质来调节所述碳结构的碳含量。
2.根据权利要求1所述的方法，其特征在于，所述粉末混合物(50)的碳含量按重量计在0和30％之间。
3.根据权利要求2所述的方法，其特征在于，所述粉末混合物(50)的碳含量按重量计在10％和20％之间。
4.根据权利要求1至3中的任一项所述的方法，其特征在于，所述粉末混合物(50)的碳化硅颗粒部分包括平均粒径DS50在0.5μm和100μm之间的颗粒。
5.根据权利要求4所述的方法，其特征在于，所述平均粒径DS50在2μm和60μm之间。
6.根据权利要求5所述的方法，其特征在于，所述平均粒径DS50在3μm和10μm之间。
7.根据权利要求1至3中的任一项所述的方法，其特征在于，为了调节所述模制体(22，40)的碳含量，在所述基体热解(56)之后，所述碳化硅支撑基质(21)被聚合物渗透，所述聚合物通过随后的热解转变成碳。
8.根据权利要求7所述的方法，其特征在于，含硅或含碳化硅的聚合物被用作所述聚合物。
9.根据权利要求8所述的方法，其特征在于，所述含硅或含碳化硅的聚合物选自硅氧烷、硅氮烷、碳硅氧烷、碳硅氮烷或碳硅烷。
10.根据权利要求7所述的方法，其特征在于，预聚物被用作所述聚合物。
11.根据权利要求10所述的方法，其特征在于，所述预聚物为聚酰亚胺和氰酸酯树脂。
12.根据权利要求7所述的方法，其特征在于，酚醛树脂、呋喃树脂和氰酸酯树脂被用作所述聚合物。
13.根据权利要求1至3中的任一项所述的方法，其特征在于，在所述基体热解(56)之后，用硅渗透所述碳化硅支撑基质(21)。
14.根据权利要求1至3中任一项所述的方法，其特征在于，在所述基体热解(56)之后，用碳化硅渗透所述碳化硅支撑基质(21)。
15.根据权利要求14所述的方法，其特征在于，通过碳化硅的气相沉积，所述碳化硅支撑基质(21)被碳化硅渗透。
16.根据权利要求15所述的方法，其特征在于，通过化学气相渗透方法和/或化学气相沉积方法实现碳化硅的气相沉积。
17.一种模制体(22，40)，具有碳化硅支撑基质(21)和一体碳结构(23)，包括基于含有碳化硅和碳的粉末混合物(50)或含有硅和碳的粉末混合物(50)和粘合剂(51)以衍生法成层构建的基体，其中所述模制体是所述粉末混合物的热解的结果并且所述模制体的碳含量按重量计在10％至30％范围内，其中所述碳结构的碳含量由游离碳的总体含量定义。
18.根据权利要求17所述的模制体，其特征在于，用于实现所述模制体(22，40)的材料的比电阻在150μOhm和800μOhm之间。
19.根据权利要求17所述的模制体，其特征在于，用于实现所述模制体(22，40)的材料的比电阻在300μOhm和600μOhm之间。
20.根据权利要求17至19中任一项所述的模制体，其特征在于，所述模制体被实现为壳状。
21.根据权利要求17至19中任一项所述的模制体，其特征在于，所述模制体被实现为网格结构(45)。
22.根据权利要求17至19中任一项所述的模制体，其特征在于，所述模制体被用作电阻加热元件。
23.根据权利要求17至19中任一项所述的模制体，其特征在于，所述模制体被用作静态混合器。
24.根据权利要求17至19中任一项所述的模制体，其特征在于，所述模制体被用作轴承体。
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JP2016044122A (ja) 2016-04-04
CN105367129A (zh) 2016-03-02
US20160052829A1 (en) 2016-02-25
DE102014216433A1 (de) 2016-02-25

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