CN105366623A - 物理量传感器、压力传感器、高度计、电子设备及移动体 - Google Patents
物理量传感器、压力传感器、高度计、电子设备及移动体 Download PDFInfo
- Publication number
- CN105366623A CN105366623A CN201510487846.7A CN201510487846A CN105366623A CN 105366623 A CN105366623 A CN 105366623A CN 201510487846 A CN201510487846 A CN 201510487846A CN 105366623 A CN105366623 A CN 105366623A
- Authority
- CN
- China
- Prior art keywords
- physical quantity
- substrate
- quantity sensor
- layer
- quantity transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 126
- 229910052710 silicon Inorganic materials 0.000 description 27
- 239000010703 silicon Substances 0.000 description 27
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 26
- 239000004065 semiconductor Substances 0.000 description 20
- 238000005530 etching Methods 0.000 description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 239000011229 interlayer Substances 0.000 description 14
- 229910052814 silicon oxide Inorganic materials 0.000 description 14
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 229910052796 boron Inorganic materials 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
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- 229960002050 hydrofluoric acid Drugs 0.000 description 4
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- 150000002739 metals Chemical class 0.000 description 3
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000033558 biomineral tissue development Effects 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
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- 238000002347 injection Methods 0.000 description 1
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
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- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C5/00—Measuring height; Measuring distances transverse to line of sight; Levelling between separated points; Surveyors' levels
- G01C5/06—Measuring height; Measuring distances transverse to line of sight; Levelling between separated points; Surveyors' levels by using barometric means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014164066A JP6340985B2 (ja) | 2014-08-12 | 2014-08-12 | 物理量センサー、圧力センサー、高度計、電子機器および移動体 |
| JP2014-164066 | 2014-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105366623A true CN105366623A (zh) | 2016-03-02 |
Family
ID=55301967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510487846.7A Pending CN105366623A (zh) | 2014-08-12 | 2015-08-10 | 物理量传感器、压力传感器、高度计、电子设备及移动体 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9645027B2 (https=) |
| JP (1) | JP6340985B2 (https=) |
| CN (1) | CN105366623A (https=) |
| TW (1) | TW201610405A (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6340985B2 (ja) * | 2014-08-12 | 2018-06-13 | セイコーエプソン株式会社 | 物理量センサー、圧力センサー、高度計、電子機器および移動体 |
| CN105698754A (zh) * | 2016-03-14 | 2016-06-22 | 上海电力学院 | 基于变电站沉降测量的光纤光栅传感器 |
| US10685944B2 (en) * | 2016-10-25 | 2020-06-16 | James Jen-Ho Wang | Film sensors array and method |
| JP6874463B2 (ja) | 2017-03-27 | 2021-05-19 | セイコーエプソン株式会社 | 圧電素子、圧電アクチュエーター、超音波探触子、超音波装置、電子機器、液体噴射ヘッド、及び液体噴射装置 |
| US11408734B2 (en) | 2019-01-03 | 2022-08-09 | Lam Research Corporation | Distance measurement between gas distribution device and substrate support at high temperatures |
| WO2022266811A1 (zh) * | 2021-06-21 | 2022-12-29 | 鹏鼎控股(深圳)股份有限公司 | 感压电路板及感压电路板的制作方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2881224B1 (fr) * | 2005-01-21 | 2007-11-23 | Auxitrol Sa Sa | Ensemble de detection de la pression absolue d'un fluide |
| US20080105951A1 (en) * | 2006-11-08 | 2008-05-08 | Seiko Epson Corporation | Electronic Device and Method for Manufacturing Thereof |
| CN101551284A (zh) * | 2009-04-22 | 2009-10-07 | 江苏英特神斯科技有限公司 | 基于硅硅直接键合的压力传感器及其制造方法 |
| CN101960276A (zh) * | 2007-10-30 | 2011-01-26 | 株式会社山武 | 压力传感器及其制造方法 |
| WO2011010571A1 (ja) * | 2009-07-24 | 2011-01-27 | ローム株式会社 | 半導体圧力センサ、圧力センサ装置、電子機器、および半導体圧力センサの製造方法 |
| CN103837289A (zh) * | 2013-11-22 | 2014-06-04 | 中航（重庆）微电子有限公司 | 压力传感器件及其制作方法 |
| US20140157892A1 (en) * | 2012-12-11 | 2014-06-12 | Seiko Epson Corporation | Mems element, electronic device, altimeter, electronic apparatus, and moving object |
| CN103864001A (zh) * | 2012-12-11 | 2014-06-18 | 精工爱普生株式会社 | 微机电系统元件、电子装置、高度计、电子设备及移动体 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0714017B1 (de) | 1994-11-24 | 2000-07-12 | Siemens Aktiengesellschaft | Kapazitiver Drucksensor |
| JPH09329516A (ja) * | 1996-06-06 | 1997-12-22 | Hitachi Ltd | 半導体圧力センサ及びこれを用いた複合伝送器 |
| JP2004325361A (ja) | 2003-04-25 | 2004-11-18 | Fujikura Ltd | 静電容量型圧力センサ及びその製造方法 |
| JP2005037309A (ja) | 2003-07-18 | 2005-02-10 | Yokogawa Electric Corp | 振動式トランスデューサ |
| KR20080005854A (ko) | 2006-07-10 | 2008-01-15 | 야마하 가부시키가이샤 | 압력 센서 및 그의 제조 방법 |
| JP4215076B2 (ja) | 2006-07-10 | 2009-01-28 | ヤマハ株式会社 | コンデンサマイクロホン及びその製造方法 |
| JP2010030020A (ja) * | 2008-07-31 | 2010-02-12 | Seiko Epson Corp | 電子装置 |
| JP5838156B2 (ja) * | 2010-05-25 | 2015-12-24 | ローム株式会社 | 圧力センサおよび圧力センサの製造方法 |
| WO2012040211A2 (en) * | 2010-09-20 | 2012-03-29 | Fairchild Semiconductor Corporation | Microelectromechanical pressure sensor including reference capacitor |
| JP2015184100A (ja) * | 2014-03-24 | 2015-10-22 | セイコーエプソン株式会社 | 物理量センサー、物理量センサーの製造方法、圧力センサー、高度計、電子機器および移動体 |
| US9427967B2 (en) * | 2014-07-28 | 2016-08-30 | Rohm Co., Ltd. | Piezoelectric membrane, piezoelectric device, and inkjet head |
| CN105314586A (zh) * | 2014-07-29 | 2016-02-10 | 精工爱普生株式会社 | 物理量传感器、压力传感器、高度计、电子设备以及移动体 |
| JP6340985B2 (ja) * | 2014-08-12 | 2018-06-13 | セイコーエプソン株式会社 | 物理量センサー、圧力センサー、高度計、電子機器および移動体 |
| JP2016095284A (ja) * | 2014-11-17 | 2016-05-26 | セイコーエプソン株式会社 | 電子デバイス、物理量センサー、圧力センサー、高度計、電子機器および移動体 |
| JP2016095267A (ja) * | 2014-11-17 | 2016-05-26 | セイコーエプソン株式会社 | 電子デバイス、物理量センサー、圧力センサー、高度計、電子機器および移動体 |
| JP2016099114A (ja) * | 2014-11-18 | 2016-05-30 | セイコーエプソン株式会社 | 電子デバイス、物理量センサー、圧力センサー、高度計、電子機器および移動体 |
| US20160209285A1 (en) * | 2015-01-20 | 2016-07-21 | Seiko Epson Corporation | Pressure sensor, method of manufacturing pressure sensor, altimeter, electronic apparatus, and moving object |
-
2014
- 2014-08-12 JP JP2014164066A patent/JP6340985B2/ja not_active Expired - Fee Related
-
2015
- 2015-08-07 TW TW104125832A patent/TW201610405A/zh unknown
- 2015-08-07 US US14/820,716 patent/US9645027B2/en active Active
- 2015-08-10 CN CN201510487846.7A patent/CN105366623A/zh active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2881224B1 (fr) * | 2005-01-21 | 2007-11-23 | Auxitrol Sa Sa | Ensemble de detection de la pression absolue d'un fluide |
| US20080105951A1 (en) * | 2006-11-08 | 2008-05-08 | Seiko Epson Corporation | Electronic Device and Method for Manufacturing Thereof |
| CN101960276A (zh) * | 2007-10-30 | 2011-01-26 | 株式会社山武 | 压力传感器及其制造方法 |
| CN101551284A (zh) * | 2009-04-22 | 2009-10-07 | 江苏英特神斯科技有限公司 | 基于硅硅直接键合的压力传感器及其制造方法 |
| WO2011010571A1 (ja) * | 2009-07-24 | 2011-01-27 | ローム株式会社 | 半導体圧力センサ、圧力センサ装置、電子機器、および半導体圧力センサの製造方法 |
| US20140157892A1 (en) * | 2012-12-11 | 2014-06-12 | Seiko Epson Corporation | Mems element, electronic device, altimeter, electronic apparatus, and moving object |
| CN103864001A (zh) * | 2012-12-11 | 2014-06-18 | 精工爱普生株式会社 | 微机电系统元件、电子装置、高度计、电子设备及移动体 |
| CN103837289A (zh) * | 2013-11-22 | 2014-06-04 | 中航（重庆）微电子有限公司 | 压力传感器件及其制作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016040521A (ja) | 2016-03-24 |
| US20160047704A1 (en) | 2016-02-18 |
| JP6340985B2 (ja) | 2018-06-13 |
| TW201610405A (zh) | 2016-03-16 |
| US9645027B2 (en) | 2017-05-09 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160302 |