CN105359253B - 剥离起点制作装置和剥离起点制作方法 - Google Patents

剥离起点制作装置和剥离起点制作方法 Download PDF

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Publication number
CN105359253B
CN105359253B CN201480037959.0A CN201480037959A CN105359253B CN 105359253 B CN105359253 B CN 105359253B CN 201480037959 A CN201480037959 A CN 201480037959A CN 105359253 B CN105359253 B CN 105359253B
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China
Prior art keywords
knife
substrate
reference plane
layered product
point
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English (en)
Chinese (zh)
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CN105359253A (zh
Inventor
滝内圭
伊藤泰则
宇津木洋
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AGC Inc
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Asahi Glass Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
CN201480037959.0A 2013-07-01 2014-06-24 剥离起点制作装置和剥离起点制作方法 Active CN105359253B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013138223 2013-07-01
JP2013-138223 2013-07-01
PCT/JP2014/066714 WO2015002030A1 (ja) 2013-07-01 2014-06-24 剥離起点作成装置及び方法

Publications (2)

Publication Number Publication Date
CN105359253A CN105359253A (zh) 2016-02-24
CN105359253B true CN105359253B (zh) 2017-08-25

Family

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CN201480037959.0A Active CN105359253B (zh) 2013-07-01 2014-06-24 剥离起点制作装置和剥离起点制作方法

Country Status (5)

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JP (1) JP6070968B2 (ja)
KR (1) KR102076569B1 (ja)
CN (1) CN105359253B (ja)
TW (1) TWI619664B (ja)
WO (1) WO2015002030A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618131B (zh) * 2013-08-30 2018-03-11 半導體能源研究所股份有限公司 剝離起點形成裝置及形成方法、疊層體製造裝置
JP6436389B2 (ja) * 2015-02-18 2018-12-12 Ａｇｃ株式会社 剥離開始部作成装置、及び剥離開始部作成方法並びに電子デバイスの製造方法
CN105047589B (zh) * 2015-07-08 2018-05-29 浙江中纳晶微电子科技有限公司 晶圆解键合装置
JP6519951B2 (ja) * 2015-07-24 2019-05-29 日本電気硝子株式会社 ガラスフィルムの製造方法、及びガラスフィルムを含む電子デバイスの製造方法
CN109211128A (zh) * 2017-07-03 2019-01-15 东丽先端材料研究开发（中国）有限公司 一种薄膜下垂程度在线测试及电池隔膜
CN111758308B (zh) * 2018-03-22 2021-10-01 株式会社富士 自动加载型供料器的检查装置及电子元件安装机
CN114986250B (zh) * 2022-05-23 2024-05-03 西门子（中国）有限公司 电池极片切割设备的步进控制方法以及步进控制系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102171745A (zh) * 2009-02-06 2011-08-31 旭硝子株式会社 电子器件的制造方法及该方法中使用的剥离装置

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JP2546753B2 (ja) * 1991-08-31 1996-10-23 信越半導体株式会社 Ｓｏｉ基板の製造方法
JPH10309653A (ja) * 1997-05-07 1998-11-24 Toyoda Mach Works Ltd 刃先位置変位検出方法及び刃先位置変位検出機能を備えた工作機械並びに該工作機械用工具ホルダ
JP2003017667A (ja) * 2001-06-29 2003-01-17 Canon Inc 部材の分離方法及び分離装置
JP2004188422A (ja) * 2002-12-06 2004-07-08 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法
JP2006126139A (ja) * 2004-11-01 2006-05-18 Furukawa Alflex Corp 膜密着力測定装置および膜密着力の測定方法
JP2007084200A (ja) * 2005-09-21 2007-04-05 Fujifilm Corp 積層体の剥離装置及び剥離方法
JP2010064203A (ja) * 2008-09-11 2010-03-25 Sony Corp 加工装置、および、加工具と被加工物の距離補正方法
KR20140018937A (ko) * 2011-04-22 2014-02-13 아사히 가라스 가부시키가이샤 적층체, 그 제조 방법 및 용도
JP2014157167A (ja) * 2011-05-18 2014-08-28 Asahi Glass Co Ltd 積層基板の剥離方法
JP6053110B2 (ja) * 2011-07-07 2016-12-27 株式会社アルバック 真空蒸着装置
KR101774278B1 (ko) * 2011-07-18 2017-09-04 엘지디스플레이 주식회사 플렉서블 표시장치의 제조방법
JP5993731B2 (ja) * 2012-12-04 2016-09-14 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法
JP6014477B2 (ja) * 2012-12-04 2016-10-25 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102171745A (zh) * 2009-02-06 2011-08-31 旭硝子株式会社 电子器件的制造方法及该方法中使用的剥离装置

Also Published As

Publication number Publication date
KR20160025525A (ko) 2016-03-08
TW201505952A (zh) 2015-02-16
WO2015002030A1 (ja) 2015-01-08
CN105359253A (zh) 2016-02-24
KR102076569B1 (ko) 2020-02-13
JPWO2015002030A1 (ja) 2017-02-23
JP6070968B2 (ja) 2017-02-01
TWI619664B (zh) 2018-04-01

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Address after: Tokyo, Japan, Japan

Patentee after: AGC Corporation

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Patentee before: Asahi Glass Co., Ltd.

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