TWI619664B - 剝離起點製作裝置及方法 - Google Patents

剝離起點製作裝置及方法 Download PDF

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Publication number
TWI619664B
TWI619664B TW103122737A TW103122737A TWI619664B TW I619664 B TWI619664 B TW I619664B TW 103122737 A TW103122737 A TW 103122737A TW 103122737 A TW103122737 A TW 103122737A TW I619664 B TWI619664 B TW I619664B
Authority
TW
Taiwan
Prior art keywords
blade
substrate
laminated body
main surface
reinforcing plate
Prior art date
Application number
TW103122737A
Other languages
English (en)
Chinese (zh)
Other versions
TW201505952A (zh
Inventor
Kei Takiuchi
Yasunori Ito
Hiroshi Utsugi
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW201505952A publication Critical patent/TW201505952A/zh
Application granted granted Critical
Publication of TWI619664B publication Critical patent/TWI619664B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
TW103122737A 2013-07-01 2014-07-01 剝離起點製作裝置及方法 TWI619664B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013138223 2013-07-01

Publications (2)

Publication Number Publication Date
TW201505952A TW201505952A (zh) 2015-02-16
TWI619664B true TWI619664B (zh) 2018-04-01

Family

ID=52143609

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103122737A TWI619664B (zh) 2013-07-01 2014-07-01 剝離起點製作裝置及方法

Country Status (5)

Country Link
JP (1) JP6070968B2 (ja)
KR (1) KR102076569B1 (ja)
CN (1) CN105359253B (ja)
TW (1) TWI619664B (ja)
WO (1) WO2015002030A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618131B (zh) * 2013-08-30 2018-03-11 半導體能源研究所股份有限公司 剝離起點形成裝置及形成方法、疊層體製造裝置
JP6436389B2 (ja) * 2015-02-18 2018-12-12 Ａｇｃ株式会社 剥離開始部作成装置、及び剥離開始部作成方法並びに電子デバイスの製造方法
CN105047589B (zh) * 2015-07-08 2018-05-29 浙江中纳晶微电子科技有限公司 晶圆解键合装置
JP6519951B2 (ja) * 2015-07-24 2019-05-29 日本電気硝子株式会社 ガラスフィルムの製造方法、及びガラスフィルムを含む電子デバイスの製造方法
CN109211128A (zh) * 2017-07-03 2019-01-15 东丽先端材料研究开发（中国）有限公司 一种薄膜下垂程度在线测试及电池隔膜
CN111758308B (zh) * 2018-03-22 2021-10-01 株式会社富士 自动加载型供料器的检查装置及电子元件安装机
CN114986250B (zh) * 2022-05-23 2024-05-03 西门子（中国）有限公司 电池极片切割设备的步进控制方法以及步进控制系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006126139A (ja) * 2004-11-01 2006-05-18 Furukawa Alflex Corp 膜密着力測定装置および膜密着力の測定方法
TW200728063A (en) * 2005-09-21 2007-08-01 Fujifilm Corp Apparatus for and method of peeling laminated body
WO2010090147A1 (ja) * 2009-02-06 2010-08-12 旭硝子株式会社 電子デバイスの製造方法およびこれに用いる剥離装置
WO2012157686A1 (ja) * 2011-05-18 2012-11-22 旭硝子株式会社 積層基板の剥離方法
TW201249643A (en) * 2011-04-22 2012-12-16 Asahi Glass Co Ltd Laminate, manufacturing method of the same, display panel with supporting plate, display panel, and display device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2546753B2 (ja) * 1991-08-31 1996-10-23 信越半導体株式会社 Ｓｏｉ基板の製造方法
JPH10309653A (ja) * 1997-05-07 1998-11-24 Toyoda Mach Works Ltd 刃先位置変位検出方法及び刃先位置変位検出機能を備えた工作機械並びに該工作機械用工具ホルダ
JP2003017667A (ja) * 2001-06-29 2003-01-17 Canon Inc 部材の分離方法及び分離装置
JP2004188422A (ja) * 2002-12-06 2004-07-08 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法
JP2010064203A (ja) * 2008-09-11 2010-03-25 Sony Corp 加工装置、および、加工具と被加工物の距離補正方法
JP6053110B2 (ja) * 2011-07-07 2016-12-27 株式会社アルバック 真空蒸着装置
KR101774278B1 (ko) * 2011-07-18 2017-09-04 엘지디스플레이 주식회사 플렉서블 표시장치의 제조방법
JP5993731B2 (ja) * 2012-12-04 2016-09-14 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法
JP6014477B2 (ja) * 2012-12-04 2016-10-25 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006126139A (ja) * 2004-11-01 2006-05-18 Furukawa Alflex Corp 膜密着力測定装置および膜密着力の測定方法
TW200728063A (en) * 2005-09-21 2007-08-01 Fujifilm Corp Apparatus for and method of peeling laminated body
WO2010090147A1 (ja) * 2009-02-06 2010-08-12 旭硝子株式会社 電子デバイスの製造方法およびこれに用いる剥離装置
TW201249643A (en) * 2011-04-22 2012-12-16 Asahi Glass Co Ltd Laminate, manufacturing method of the same, display panel with supporting plate, display panel, and display device
WO2012157686A1 (ja) * 2011-05-18 2012-11-22 旭硝子株式会社 積層基板の剥離方法

Also Published As

Publication number Publication date
KR20160025525A (ko) 2016-03-08
TW201505952A (zh) 2015-02-16
WO2015002030A1 (ja) 2015-01-08
CN105359253A (zh) 2016-02-24
KR102076569B1 (ko) 2020-02-13
JPWO2015002030A1 (ja) 2017-02-23
JP6070968B2 (ja) 2017-02-01
CN105359253B (zh) 2017-08-25

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