CN105304583A - 封装结构及其制法 - Google Patents

封装结构及其制法 Download PDF

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CN105304583A
CN105304583A CN201410421447.6A CN201410421447A CN105304583A CN 105304583 A CN105304583 A CN 105304583A CN 201410421447 A CN201410421447 A CN 201410421447A CN 105304583 A CN105304583 A CN 105304583A
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conducting element
circuit
dielectric layer
packing colloid
encapsulating structure
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CN105304583B (zh
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陈彦亨
詹慕萱
纪杰元
林畯棠
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Siliconware Precision Industries Co Ltd
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Abstract

一种封装结构及其制法，该封装结构包括电子元件、封装胶体、多个导电元件与线路重布层，该电子元件具有相对的作用面与非作用面，该封装胶体包覆该电子元件，且具有外露该作用面的第一表面及相对该第一表面的第二表面，该导电元件贯穿该封装胶体的第一表面与第二表面，该导电元件为金属球，该线路重布层形成于该第一表面与作用面上，且电性连接于该些电子元件与导电元件，本发明不需进行激光制程以形成电性连接用的开口，藉此简化制程而能有效降低成本，提升产品可靠度。

Description

封装结构及其制法
技术领域
本发明涉及一种半导体封装结构及其制法，尤指一种可减少制程的半导体封装结构及其制法。
背景技术
随着电子产业的发达，现今的电子产品已趋向轻薄短小与功能多样化的方向设计，半导体封装技术也随之开发出不同的封装型态。为满足半导体装置在功能上性能、功率及速度等需求，以及在型态上微型化与半导体装置整合等需求，遂发展出堆迭式封装结构(Packageonpackage，POP)的技术。
图1A至图1B为现有用于堆迭式封装结构的封装结构的制法的剖视示意图。
如图1A所示，提供一具有多个电性接触垫101与导电盲孔102的承载件10，将具有多个电极垫110的电子元件11以其电极垫110电性连接于该导电盲孔102，形成封装胶体12以包覆该电子元件11及该些电性接触垫101，进行研磨制程使该电子元件11的表面外露于该封装胶体12。
如图1B所示，以激光制程形成供该些电性接触垫101外露的开口121，后续将于该开口121中填充导电元件(未图示)，供后续堆迭的另一封装件电性连接该电性接触垫101，以完成一堆迭式封装结构。
然而，由于上述现有的封装结构的该些电性接触垫101被包覆于无法透光的封装胶体12内，而无法确认该些电性接触垫101的位置，致使无法或精确形成该开口121，而产生该开口121的位置误差现象。
此外，以激光制程形成该开口121，不仅造成于该开口121附近产生残渣，又由于一般开口121数量很多(I/O数量多)且激光仅能逐一形成该开口121，激光制程时间长，且激光设备昂贵，所以藉由激光烧灼方式形成该开口121的制法的成本较高，并需以清洗制程去除残渣才可接着形成导电盲孔，遂而导致制程增加，而使制造成本随之提高，此外，由于清洗制程后使该开口121侧壁凹凸不平，而于外接导电元件时容易于该开口121处产生剥离(peeling)现象，导致封装结构的可靠度降低。
因此，如何克服上述现有技术的种种问题，实已成为目前业界亟待克服的难题。
发明内容
鉴于上述现有技术的种种缺失，本发明的目的为提供一种，藉此简化制程而能有效降低成本，提升产品可靠度。
本发明的封装结构包括：电子元件，其具有相对的作用面与非作用面，且该作用面具有多个电极垫；封装胶体，其包覆该电子元件，且具有外露该作用面的第一表面及相对该第一表面的第二表面；多个导电元件，其贯穿该封装胶体的第一表面与第二表面，该导电元件为金属球；以及线路重布层，其形成于该第一表面与作用面上，且电性连接于该些电极垫与导电元件。
本发明还提供一种封装结构的制法，包括：于该第一承载板的一表面上依序形成金属层与具有多个开孔的介电层，该开孔外露该金属层，并将具有相对的作用面与非作用面的电子元件以该作用面接置于该介电层上，且该作用面具有多个电极垫，并于该介电层的开孔中的金属层上接置多个导电元件，该导电元件为金属球；于该介电层上形成封装胶体，以包覆该电子元件与导电元件，该封装胶体具有外露该作用面的第一表面及相对该第一表面的第二表面；移除该第一承载板；以及将该金属层图案化为第一线路，并于该介电层上形成第二线路，该第二线路电性连接于该些电极垫与第一线路。
由上可知，藉由先接置多个导电元件、再形成封装胶体，并外露该导电元件于封装胶体的相对两表面，而不需以激光制程逐一形成多个封装胶体开口及无需于该封装胶体开口中形成导电元件，且无需进行激光后的开口清洗制程，并无需具备激光设备，故本发明的制法能减少制程步骤，且缩短制程时间，并降低制造成本。此外，还能避免因激光所形成的侧壁凹凸不平的该开口而产生导电元件剥离(peeling)的问题，进而提升封装结构的可靠度及良率。
附图说明
图1A至图1B为现有用于堆迭式封装结构的封装结构的制法的剖视示意图。
图2A至图2J为本发明的封装结构的制法的剖视示意图，其中，图2C’为图2C的另一实施例，图2F’为图2F的另一实施例，图2I’为图2I的另一实施例。
图3为本发明的堆迭式封装结构的剖视示意图。
符号说明
10承载件
101电性接触垫
102,270导电盲孔
11电子元件
12,25封装胶体
121,281开口
110,2401电极垫
2,3封装结构
2’封装件
20第一承载板
20’粘着层
21金属层
22介电层
221开孔
220孔隙
222盲孔
23第一导电元件
24电子元件
240作用面
241非作用面
25a第一表面
25b第二表面
26第二承载板
260离形层
21a第一线路
27第二线路
28绝缘保护层
29第二导电元件
4线路重布层。
具体实施方式
以下藉由特定的具体实施例说明本发明的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。
须知，本说明书所附图式所绘示的结构、比例、大小等，均仅用于配合说明书所揭示的内容，以供本领域技术人员的了解与阅读，并非用于限定本发明可实施的限定条件，故不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时，本说明书中所引用的如“上”、“第一”、“第二”、及“一”等用语，也仅为便于叙述的明了，而非用于限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当也视为本发明可实施的范畴。又，本说明书中所记载的“上”可包含该物件上或其上方之意。
图2A至图2J为本发明的封装结构2的制法的剖视示意图，其中，图2C’为图2C的另一实施例，图2F’为图2F的另一实施例，图2I’为图2I的另一实施例。
如图2A所示，提供一第一承载板20，并于该第一承载板20的一表面上形成金属层21，该第一承载板20的表面可视需要具有用于连接该金属层21的粘着层20’，形成该粘着层20’的材质可为耐热胶。
于本实施例中，形成该金属层21的材质为铜。
如图2B所示，以图案化制程形成具有多个供该金属层21外露的开孔221的介电层22。
如图2C所示，于该开孔221中的金属层21上设置多个第一导电元件23，使该些第一导电元件23电性连接于该金属层21，举例而言，该第一导电元件23为事先预制好的金属球(例如焊球)，且加热该第一导电元件23以接合至该金属层21的表面，该第一导电元件23与开孔221之间存在有孔隙220，或者，该第一导电元件23填满该开孔221，如图2C’所示。
如图2D所示，设置电子元件24于该介电层22上。
于本实施例中，该电子元件24为主动元件、被动元件或其组合者，且该主动元件例如晶片，而该被动元件例如电阻、电容及电感。
此外，该电子元件24具有相对的作用面240与非作用面241，该作用面240具有多个电极垫2401，其中，该电子元件24以该作用面240设置于该介电层22上。
如图2E所示，于该介电层22上形成封装胶体25，以包覆该些第一导电元件23及该电子元件24，该封装胶体25具有外露该作用面240的第一表面25a及相对该第一表面25a的第二表面25b。
于本实施例中，形成该封装胶体25以模封(molding)方式制作，但形成方式可依需求选择不同方式，并不限于上述。
此外，形成该封装胶体25的材质可为干膜型(DryFilmType)环氧树脂(Epoxy)、流体状环氧树脂、或有机材质，如ABF(AjinomotoBuild-upFilm)树脂，但不限于上述。
如图2F所示，从该第二表面25b侧以研磨制程移除部分厚度的该封装胶体25，以令该些第一导电元件23与该电子元件24的非作用面241外露于该封装胶体25的第二表面25b，且该非作用面241可与该封装胶体25的第二表面25b齐平。
于另一实施例中，如图2F’所示，于移除部分厚度的该封装胶体25之后，该电子元件24的非作用面241未外露于该封装胶体25的第二表面25b。
如图2G所示，延续自图2F，设置具有离形层260的第二承载板26于该封装胶体25的第二表面25b上，并移除该第一承载板20，以外露该金属层21。
如图2H所示，图案化该金属层21以形成第一线路21a，并图案化该介电层22以形成供该电子元件24的该些电极垫2401外露的盲孔222。
如图2I所示，于该盲孔222中形成导电盲孔270，于该介电层22上形成电性连接该导电盲孔270的第二线路27，该导电盲孔270、第二线路27、介电层22与第一线路21a构成一线路重布层4，该第一线路21a与第二线路27构成一线路层(未标元件符号)，并以图案化制程形成具有供部分该第一线路21a与第二线路27外露的开口281的绝缘保护层28，接着，形成多个例如含有焊锡材料的焊线、锡球或凸块的第二导电元件29于该开口281，以电性连接于该些第二线路27与第一线路21a，该第二线路27还延伸并迭置于该第一线路21a上，或者，该第二线路27以其侧表面电性连接该第一线路21a，如图2I’所示。
如图2J所示，移除该第二承载板26，并进行切单制程以完成封装结构2。
于本实施例中，本发明的封装结构2还可接置另一封装件2’，以完成如图3所示的堆迭式封装结构(POP)3。
本发明还提供一种封装结构，包括：电子元件24，其具有相对的作用面240与非作用面241，且该作用面240具有多个电极垫2401；封装胶体25，其包覆该电子元件24，且具有外露该作用面240的第一表面25a及相对该第一表面25a的第二表面25b；多个第一导电元件23，其贯穿该封装胶体25的第一表面25a与第二表面25b，该些第一导电元件23为金属球；以及线路重布层4，其形成于该第一表面25a与作用面240上，且电性连接于该些电极垫2401与该些第一导电元件23。
于前述的封装结构中，该金属球为焊球，且该第一表面25a与该电子元件24的作用面240齐平。
于本实施例的封装结构中，该线路重布层4包括介电层22、第一线路21a与第二线路27，该介电层22形成于该第一表面25a与作用面240上，该些第一导电元件23还贯穿该介电层22，该第一线路21a与第二线路27形成于该介电层22上，该第一线路21a连接该些第一导电元件23，且该第二线路27电性连接该些电极垫2401与第一线路21a，该介电层22具有容设该些第一导电元件23的开孔221，该开孔221与该些第一导电元件23之间存在有孔隙220，且该第二线路27还延伸并迭置于该第一线路21a上。
于所述的封装结构中，该电子元件24的非作用面241齐平于该封装胶体25的第二表面25b，还包括封装件2’，其接置于该封装胶体25的第二表面25b上方，且电性连接该些第一导电元件23。
综上所述，本发明的封装结构及其制法主要为先接置多个导电元件、再形成封装胶体，并外露该导电元件于封装胶体的相对两表面，藉此，不需以激光制程逐一形成多个封装胶体开口及无需于该封装胶体开口中形成导电元件，且无需进行激光后的开口清洗制程，并无需具备激光设备，故本发明的制法能减少制程步骤，且缩短制程时间，并降低制造成本。此外，本发明还能避免因激光所形成的侧壁凹凸不平的该开口而产生导电元件剥离(peeling)的问题，进而提升封装结构的可靠度及良率。
上述实施例仅用于例示性说明本发明的原理及其功效，而非用于限制本发明。任何本领域技术人员均可在不违背本发明的精神及范畴下，对上述实施例进行修改。因此本发明的权利保护范围，应如权利要求书所列。

Claims (16)

1.一种封装结构，包括：
电子元件，其具有相对的作用面与非作用面，且该作用面具有多个电极垫；
封装胶体，其包覆该电子元件，且具有外露该作用面的第一表面及相对该第一表面的第二表面；
多个导电元件，其贯穿该封装胶体的第一表面与第二表面，该导电元件为金属球；以及
线路重布层，其形成于该第一表面与作用面上，且电性连接于该些电极垫及/或导电元件。
2.如权利要求1所述的封装结构，其特征为，该金属球为焊球。
3.如权利要求1所述的封装结构，其特征为，该第一表面与该电子元件的作用面齐平。
4.如权利要求1所述的封装结构，其特征为，该线路重布层包括介电层、第一线路与第二线路，该介电层形成于该第一表面与作用面上，该导电元件还贯穿该介电层，该第一线路与第二线路形成于该介电层上，该第一线路连接该导电元件，且该第二线路电性连接该些电极垫与第一线路。
5.如权利要求4所述的封装结构，其特征为，该介电层具有容设该导电元件的开孔，该开孔与导电元件之间存在有孔隙。
6.如权利要求4所述的封装结构，其特征为，该第二线路还延伸并迭置于该第一线路上。
7.如权利要求1所述的封装结构，其特征为，该电子元件的非作用面齐平于该封装胶体的第二表面。
8.如权利要求1所述的封装结构，其特征为，该封装结构还包括封装件，其接置于该封装胶体的第二表面上方，且电性连接该导电元件。
9.一种封装结构的制法，包括：
于该第一承载板的一表面上依序形成金属层与具有多个开孔的介电层，该开孔外露该金属层，并将具有相对的作用面与非作用面的电子元件以该作用面接置于该介电层上，且该作用面具有多个电极垫，并于该介电层的开孔中的金属层上接置多个导电元件，该导电元件为金属球；
于该介电层上形成封装胶体，以包覆该电子元件与导电元件，该封装胶体具有外露该作用面的第一表面及相对该第一表面的第二表面；
移除该第一承载板；以及
将该金属层图案化为第一线路，并于该介电层上形成第二线路，该第二线路电性连接于该些电极垫及/或第一线路。
10.如权利要求9所述的封装结构的制法，其特征为，该介电层具有容设该导电元件的开孔，该开孔与导电元件之间存在有孔隙。
11.如权利要求9所述的封装结构的制法，其特征为，该第二线路还延伸并迭置于该第一线路上。
12.如权利要求9所述的封装结构的制法，其特征为，该金属球为焊球。
13.如权利要求9所述的封装结构的制法，其特征为，于移除该第一承载板之前，还包括从该第二表面侧研磨移除部分厚度的该封装胶体，以令该导电元件外露于该封装胶体的第二表面。
14.如权利要求9所述的封装结构的制法，其特征为，于移除该第一承载板之前，还包括设置第二承载板于该封装胶体的第二表面上，并于形成该第一线路与第二线路之后，移除该第二承载板。
15.如权利要求9所述的封装结构的制法，其特征为，于形成该第一线路与第二线路之后，还包括进行切单制程。
16.如权利要求9所述的封装结构的制法，其特征为，于形成该第一线路与第二线路之后，还包括于该封装胶体的第二表面上方接置封装件，且该封装件电性连接该导电元件。
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