CN105280771B - 发光器件 - Google Patents
发光器件 Download PDFInfo
- Publication number
- CN105280771B CN105280771B CN201510292481.2A CN201510292481A CN105280771B CN 105280771 B CN105280771 B CN 105280771B CN 201510292481 A CN201510292481 A CN 201510292481A CN 105280771 B CN105280771 B CN 105280771B
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- China
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- layer
- semiconductor layer
- conductive
- window
- luminescent device
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8316—Multi-layer electrodes comprising at least one discontinuous layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/835—Reflective materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
Landscapes
- Led Devices (AREA)
Applications Claiming Priority (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0065763 | 2014-05-30 | ||
| KR1020140065759A KR102199992B1 (ko) | 2014-05-30 | 2014-05-30 | 발광소자 |
| KR1020140065763A KR102237105B1 (ko) | 2014-05-30 | 2014-05-30 | 발광소자 |
| KR10-2014-0065759 | 2014-05-30 | ||
| KR10-2014-0073252 | 2014-06-17 | ||
| KR1020140073253A KR102187511B1 (ko) | 2014-06-17 | 2014-06-17 | 발광소자 |
| KR1020140073250A KR102187504B1 (ko) | 2014-06-17 | 2014-06-17 | 발광소자 |
| KR1020140073252A KR102187508B1 (ko) | 2014-06-17 | 2014-06-17 | 발광소자 |
| KR10-2014-0073253 | 2014-06-17 | ||
| KR10-2014-0073282 | 2014-06-17 | ||
| KR10-2014-0073251 | 2014-06-17 | ||
| KR1020140073251A KR102200005B1 (ko) | 2014-06-17 | 2014-06-17 | 발광소자 |
| KR1020140073282A KR102187514B1 (ko) | 2014-06-17 | 2014-06-17 | 발광소자 |
| KR10-2014-0073250 | 2014-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105280771A CN105280771A (zh) | 2016-01-27 |
| CN105280771B true CN105280771B (zh) | 2019-01-22 |
Family
ID=53267273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510292481.2A Active CN105280771B (zh) | 2014-05-30 | 2015-06-01 | 发光器件 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9673354B2 (enExample) |
| EP (1) | EP2950355B1 (enExample) |
| JP (1) | JP6595801B2 (enExample) |
| CN (1) | CN105280771B (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9793436B2 (en) | 2015-01-16 | 2017-10-17 | Epistar Corporation | Semiconductor light-emitting device |
| US9472719B2 (en) * | 2015-02-18 | 2016-10-18 | Epistar Corporation | Light-emitting diode |
| JP6332301B2 (ja) * | 2016-02-25 | 2018-05-30 | 日亜化学工業株式会社 | 発光素子 |
| JP6668863B2 (ja) * | 2016-03-22 | 2020-03-18 | 日亜化学工業株式会社 | 発光素子 |
| JP6826395B2 (ja) * | 2016-08-26 | 2021-02-03 | ローム株式会社 | 半導体発光素子 |
| DE102017101637A1 (de) * | 2017-01-27 | 2018-08-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| DE102017104719A1 (de) | 2017-03-07 | 2018-09-13 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterkörper und Halbleiterchip |
| CN109103163A (zh) * | 2017-06-20 | 2018-12-28 | 稳懋半导体股份有限公司 | 用以减少化合物半导体晶圆变形的改良结构 |
| CN107403860B (zh) * | 2017-08-08 | 2019-06-21 | 天津三安光电有限公司 | 牺牲层结构及采用该结构剥离材料层的方法 |
| DE102017123542A1 (de) * | 2017-10-10 | 2019-04-11 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
| US11024767B2 (en) * | 2017-10-17 | 2021-06-01 | Lumileds Llc | Nano-photonics reflector for LED emitters |
| CN107958945B (zh) * | 2017-11-20 | 2020-07-03 | 扬州乾照光电有限公司 | 一种无介质膜的倒装发光二极管芯片及其制作方法 |
| DE102018127201A1 (de) | 2018-10-31 | 2020-04-30 | Osram Opto Semiconductors Gmbh | Optoelektronischer halbleiterchip und verfahren zur herstellung eines optoelektronischen halbleiterchips |
| CN115312645B (zh) * | 2019-01-17 | 2025-10-17 | 泉州三安半导体科技有限公司 | 一种半导体发光元件 |
| DE102019103638A1 (de) | 2019-02-13 | 2020-08-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches halbleiterbauelement mit abschnitten einer leitfähigen schicht und verfahren zur herstellung eines optoelektronischen halbleiterbauelements |
| CN109920893A (zh) * | 2019-02-20 | 2019-06-21 | 南昌大学 | 一种具有良好电流扩展特性的反极性AlGaInP LED芯片及制备方法 |
| JP6858899B2 (ja) * | 2019-03-26 | 2021-04-14 | Dowaエレクトロニクス株式会社 | 点光源型発光ダイオード及びその製造方法 |
| WO2020196411A1 (ja) | 2019-03-26 | 2020-10-01 | Dowaエレクトロニクス株式会社 | 点光源型発光ダイオード及びその製造方法 |
| US20200365769A1 (en) * | 2019-05-16 | 2020-11-19 | Epistar Corporation | Semiconductor device |
| JP7360822B2 (ja) * | 2019-06-13 | 2023-10-13 | ローム株式会社 | 半導体発光装置 |
| TWI838392B (zh) * | 2019-08-08 | 2024-04-11 | 晶元光電股份有限公司 | 光電半導體裝置 |
| CN110571319A (zh) * | 2019-10-17 | 2019-12-13 | 扬州乾照光电有限公司 | 一种多堆栈odr的倒装led结构及制作方法 |
| WO2021095717A1 (ja) * | 2019-11-12 | 2021-05-20 | ソニー株式会社 | 半導体発光素子および電子機器 |
| CN111668355B (zh) * | 2020-05-29 | 2024-11-15 | 山西中科潞安紫外光电科技有限公司 | 一种垂直近紫外发光二极管及其制备方法 |
| CN112420891B (zh) * | 2020-09-21 | 2022-09-09 | 厦门士兰明镓化合物半导体有限公司 | 发光二极管芯片及其制作方法 |
| US12125956B2 (en) * | 2021-03-16 | 2024-10-22 | Epistar Corporation | Semiconductor device and semiconductor component including the same |
| TW202318687A (zh) * | 2021-10-26 | 2023-05-01 | 晶元光電股份有限公司 | 半導體元件及包含其之半導體組件 |
| WO2023235375A1 (en) * | 2022-06-01 | 2023-12-07 | Creeled, Inc. | Current spreading layer structures for light-emitting diode chips |
| KR20240168596A (ko) * | 2023-05-23 | 2024-12-02 | 엘지전자 주식회사 | 화소용 반도체 발광소자 및 이의 제조방법 |
| US20250275307A1 (en) * | 2024-02-28 | 2025-08-28 | Creeled, Inc. | Light-emitting diode chip structures with electrode extensions and gradient vias |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0886326A2 (en) * | 1997-06-06 | 1998-12-23 | Hewlett-Packard Company | Separate hole injection structure for improved reliability light emitting semiconductor devices |
| CN101312229A (zh) * | 2007-05-24 | 2008-11-26 | 日立电线株式会社 | 化合物半导体晶片、发光二极管及其制备方法 |
| CN101971370A (zh) * | 2008-04-30 | 2011-02-09 | 欧司朗光电半导体有限公司 | 发光二极管芯片 |
| CN102760815A (zh) * | 2011-04-26 | 2012-10-31 | 株式会社东芝 | 半导体发光元件 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6057562A (en) * | 1997-04-18 | 2000-05-02 | Epistar Corp. | High efficiency light emitting diode with distributed Bragg reflector |
| JP4032224B2 (ja) | 1999-10-29 | 2008-01-16 | 信越半導体株式会社 | 燐化ガリウム発光素子及びその製造方法 |
| DE10147887C2 (de) * | 2001-09-28 | 2003-10-23 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement mit einem Kontakt, der eine Mehrzahl von voneinander beabstandeten Kontaktstellen umfaßt |
| US6784462B2 (en) * | 2001-12-13 | 2004-08-31 | Rensselaer Polytechnic Institute | Light-emitting diode with planar omni-directional reflector |
| CN1324772C (zh) | 2002-06-19 | 2007-07-04 | 日本电信电话株式会社 | 半导体发光器件 |
| KR100601945B1 (ko) | 2004-03-10 | 2006-07-14 | 삼성전자주식회사 | 탑에미트형 질화물계 발광소자 및 그 제조방법 |
| JP5232970B2 (ja) | 2006-04-13 | 2013-07-10 | 豊田合成株式会社 | 半導体発光素子の製造方法及び半導体発光素子とそれを備えたランプ |
| KR100843426B1 (ko) * | 2007-07-23 | 2008-07-03 | 삼성전기주식회사 | 반도체 발광소자 |
| JP2009200178A (ja) * | 2008-02-20 | 2009-09-03 | Hitachi Cable Ltd | 半導体発光素子 |
| JP2009260316A (ja) * | 2008-03-26 | 2009-11-05 | Panasonic Electric Works Co Ltd | 半導体発光素子およびそれを用いる照明装置 |
| JP2010192701A (ja) | 2009-02-18 | 2010-09-02 | Showa Denko Kk | 発光ダイオード、発光ダイオードランプ及び発光ダイオードの製造方法 |
| US7906795B2 (en) * | 2009-05-08 | 2011-03-15 | Epistar Corporation | Light-emitting device |
| US8450767B2 (en) * | 2009-05-08 | 2013-05-28 | Epistar Corporation | Light-emitting device |
| JP2011035017A (ja) * | 2009-07-30 | 2011-02-17 | Hitachi Cable Ltd | 発光素子 |
| KR101020945B1 (ko) * | 2009-12-21 | 2011-03-09 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 패키지 및 발광 소자 제조방법 |
| TWI513040B (zh) * | 2010-02-09 | 2015-12-11 | Epistar Corp | 光電元件及其製造方法 |
| KR20110092728A (ko) | 2010-02-10 | 2011-08-18 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
| KR101091504B1 (ko) | 2010-02-12 | 2011-12-08 | 엘지이노텍 주식회사 | 발광소자, 발광소자 패키지 및 발광소자 제조방법 |
| JP5725927B2 (ja) * | 2010-05-18 | 2015-05-27 | ソウル バイオシス カンパニー リミテッドSeoul Viosys Co.,Ltd. | 高効率発光ダイオード及びその製造方法 |
| JP2012231000A (ja) * | 2011-04-26 | 2012-11-22 | Toshiba Corp | 半導体発光装置 |
| JP5095848B1 (ja) * | 2011-05-18 | 2012-12-12 | 株式会社東芝 | 半導体発光素子 |
| KR20130027275A (ko) | 2011-09-07 | 2013-03-15 | 엘지이노텍 주식회사 | 발광소자, 발광소자 패키지 및 라이트 유닛 |
| JP2013161927A (ja) * | 2012-02-03 | 2013-08-19 | Stanley Electric Co Ltd | 半導体発光素子 |
| DE102012110836A1 (de) * | 2012-11-12 | 2014-02-27 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung von optoelektronischen Halbleiterchips |
-
2015
- 2015-05-21 JP JP2015103630A patent/JP6595801B2/ja active Active
- 2015-05-28 EP EP15169633.3A patent/EP2950355B1/en active Active
- 2015-05-29 US US14/725,469 patent/US9673354B2/en active Active
- 2015-06-01 CN CN201510292481.2A patent/CN105280771B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0886326A2 (en) * | 1997-06-06 | 1998-12-23 | Hewlett-Packard Company | Separate hole injection structure for improved reliability light emitting semiconductor devices |
| CN101312229A (zh) * | 2007-05-24 | 2008-11-26 | 日立电线株式会社 | 化合物半导体晶片、发光二极管及其制备方法 |
| CN101971370A (zh) * | 2008-04-30 | 2011-02-09 | 欧司朗光电半导体有限公司 | 发光二极管芯片 |
| CN102760815A (zh) * | 2011-04-26 | 2012-10-31 | 株式会社东芝 | 半导体发光元件 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2950355A1 (en) | 2015-12-02 |
| US20150349220A1 (en) | 2015-12-03 |
| EP2950355B1 (en) | 2016-12-28 |
| CN105280771A (zh) | 2016-01-27 |
| JP6595801B2 (ja) | 2019-10-23 |
| JP2015228497A (ja) | 2015-12-17 |
| US9673354B2 (en) | 2017-06-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210831 Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee after: Suzhou Leyu Semiconductor Co.,Ltd. Address before: Seoul, South Kerean Patentee before: LG INNOTEK Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee after: Suzhou Liyu Semiconductor Co.,Ltd. Country or region after: China Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee before: Suzhou Leyu Semiconductor Co.,Ltd. Country or region before: China |