CN105190799A - 具有非对称穿玻通孔的电子设备 - Google Patents

具有非对称穿玻通孔的电子设备 Download PDF

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Publication number
CN105190799A
CN105190799A CN201480025531.4A CN201480025531A CN105190799A CN 105190799 A CN105190799 A CN 105190799A CN 201480025531 A CN201480025531 A CN 201480025531A CN 105190799 A CN105190799 A CN 105190799A
Authority
CN
China
Prior art keywords
tgv
hole
group
section
circular cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480025531.4A
Other languages
English (en)
Chinese (zh)
Inventor
D·D·金
D·F·伯蒂
C·左
M·F·维纶茨
C·尹
R·P·米库尔卡
J·金
J-H·兰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN105190799A publication Critical patent/CN105190799A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
CN201480025531.4A 2013-05-06 2014-04-22 具有非对称穿玻通孔的电子设备 Pending CN105190799A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/887,788 US20140327510A1 (en) 2013-05-06 2013-05-06 Electronic device having asymmetrical through glass vias
US13/887,788 2013-05-06
PCT/US2014/035041 WO2014182445A1 (en) 2013-05-06 2014-04-22 Electronic device having asymmetrical through glass vias

Publications (1)

Publication Number Publication Date
CN105190799A true CN105190799A (zh) 2015-12-23

Family

ID=50841965

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480025531.4A Pending CN105190799A (zh) 2013-05-06 2014-04-22 具有非对称穿玻通孔的电子设备

Country Status (6)

Country Link
US (1) US20140327510A1 (enExample)
EP (1) EP2994925A1 (enExample)
JP (1) JP2016526284A (enExample)
KR (1) KR20160005349A (enExample)
CN (1) CN105190799A (enExample)
WO (1) WO2014182445A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9431473B2 (en) 2012-11-21 2016-08-30 Qualcomm Incorporated Hybrid transformer structure on semiconductor devices
US10002700B2 (en) 2013-02-27 2018-06-19 Qualcomm Incorporated Vertical-coupling transformer with an air-gap structure
US9634645B2 (en) 2013-03-14 2017-04-25 Qualcomm Incorporated Integration of a replica circuit and a transformer above a dielectric substrate
US9449753B2 (en) 2013-08-30 2016-09-20 Qualcomm Incorporated Varying thickness inductor
US9906318B2 (en) 2014-04-18 2018-02-27 Qualcomm Incorporated Frequency multiplexer
US11024454B2 (en) * 2015-10-16 2021-06-01 Qualcomm Incorporated High performance inductors
JP6838328B2 (ja) * 2016-09-15 2021-03-03 大日本印刷株式会社 インダクタおよびインダクタの製造方法
US20180286556A1 (en) * 2017-04-01 2018-10-04 Intel Corporation Integrated circuit implemented inductors and methods of manufacture
JP6781145B2 (ja) * 2017-12-28 2020-11-04 日本発條株式会社 携帯型無線通信装置、および携帯型無線通信装置を用いた情報識別装置
TWI723343B (zh) * 2019-02-19 2021-04-01 頎邦科技股份有限公司 具立體電感之半導體結構及其製造方法
KR20250116671A (ko) * 2022-11-30 2025-08-01 코닝 인코포레이티드 조정 가능한 호 형상과 배향을 갖는 관통 유리 비아 및 분할된 보텍스 레이저 빔을 통해 이를 형성하는 방법

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000286125A (ja) * 1999-03-31 2000-10-13 Taiyo Yuden Co Ltd 積層電子部品
US20030151485A1 (en) * 2002-02-08 2003-08-14 Charles Lewis Surface mounted inductance element
CN1893071A (zh) * 2005-07-05 2007-01-10 精工爱普生株式会社 电子基板的制造方法、电子基板、以及电子设备
US20090243389A1 (en) * 2008-03-31 2009-10-01 Fuji Electric Device Technology Co., Ltd. Multiple output magnetic induction unit and a multiple output micro power converter having the same
US20110217657A1 (en) * 2010-02-10 2011-09-08 Life Bioscience, Inc. Methods to fabricate a photoactive substrate suitable for microfabrication
US20110229687A1 (en) * 2010-03-19 2011-09-22 Qualcomm Incorporated Through Glass Via Manufacturing Process
US20120058676A1 (en) * 2010-09-03 2012-03-08 Schaffer Christopher P Substrate inductive devices and methods
US20120235969A1 (en) * 2011-03-15 2012-09-20 Qualcomm Mems Technologies, Inc. Thin film through-glass via and methods for forming same
CN102725844A (zh) * 2010-12-10 2012-10-10 松下电器产业株式会社 导电通路、使用该导电通路的半导体装置以及它们的制造方法
CN102918608A (zh) * 2010-06-01 2013-02-06 高通股份有限公司 高电阻衬底中的具有可编程性的穿通孔电感器或变压器
WO2013033124A1 (en) * 2011-08-30 2013-03-07 Qualcomm Mems Technologies, Inc. Die-cut through-glass via and methods for forming same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6990729B2 (en) * 2003-09-05 2006-01-31 Harris Corporation Method for forming an inductor
JP2007150022A (ja) * 2005-11-29 2007-06-14 Seiko Epson Corp 電子基板、その製造方法および電子機器
JP2009038297A (ja) * 2007-08-03 2009-02-19 Asahi Kasei Electronics Co Ltd 半導体装置
US8716871B2 (en) * 2012-02-15 2014-05-06 Taiwan Semiconductor Manufacturing Company, Ltd. Big via structure

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000286125A (ja) * 1999-03-31 2000-10-13 Taiyo Yuden Co Ltd 積層電子部品
US20030151485A1 (en) * 2002-02-08 2003-08-14 Charles Lewis Surface mounted inductance element
CN1893071A (zh) * 2005-07-05 2007-01-10 精工爱普生株式会社 电子基板的制造方法、电子基板、以及电子设备
US20090243389A1 (en) * 2008-03-31 2009-10-01 Fuji Electric Device Technology Co., Ltd. Multiple output magnetic induction unit and a multiple output micro power converter having the same
US20110217657A1 (en) * 2010-02-10 2011-09-08 Life Bioscience, Inc. Methods to fabricate a photoactive substrate suitable for microfabrication
US20110229687A1 (en) * 2010-03-19 2011-09-22 Qualcomm Incorporated Through Glass Via Manufacturing Process
CN102918608A (zh) * 2010-06-01 2013-02-06 高通股份有限公司 高电阻衬底中的具有可编程性的穿通孔电感器或变压器
US20120058676A1 (en) * 2010-09-03 2012-03-08 Schaffer Christopher P Substrate inductive devices and methods
CN102725844A (zh) * 2010-12-10 2012-10-10 松下电器产业株式会社 导电通路、使用该导电通路的半导体装置以及它们的制造方法
US20120235969A1 (en) * 2011-03-15 2012-09-20 Qualcomm Mems Technologies, Inc. Thin film through-glass via and methods for forming same
WO2013033124A1 (en) * 2011-08-30 2013-03-07 Qualcomm Mems Technologies, Inc. Die-cut through-glass via and methods for forming same

Also Published As

Publication number Publication date
KR20160005349A (ko) 2016-01-14
EP2994925A1 (en) 2016-03-16
WO2014182445A1 (en) 2014-11-13
JP2016526284A (ja) 2016-09-01
US20140327510A1 (en) 2014-11-06

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20151223

WD01 Invention patent application deemed withdrawn after publication