JP2016526284A - 非対称ガラス貫通ビアを有する電子デバイス - Google Patents

非対称ガラス貫通ビアを有する電子デバイス Download PDF

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Publication number
JP2016526284A
JP2016526284A JP2016512916A JP2016512916A JP2016526284A JP 2016526284 A JP2016526284 A JP 2016526284A JP 2016512916 A JP2016512916 A JP 2016512916A JP 2016512916 A JP2016512916 A JP 2016512916A JP 2016526284 A JP2016526284 A JP 2016526284A
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Japan
Prior art keywords
tgv
glass
electronic device
section
circular cross
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JP2016512916A
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English (en)
Japanese (ja)
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JP2016526284A5 (enExample
Inventor
デイク・ディー・キム
デイヴィッド・エフ・ベルディ
チェンジェ・ズオ
マリオ・フランシスコ・ヴェレス
チャンハン・ユン
ロバート・ピー・ミクルカ
ジョンヘ・キム
ジェ−シュン・ラン
Original Assignee
クアルコム，インコーポレイテッド
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Application filed by クアルコム，インコーポレイテッド filed Critical クアルコム，インコーポレイテッド
Publication of JP2016526284A publication Critical patent/JP2016526284A/ja
Publication of JP2016526284A5 publication Critical patent/JP2016526284A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2016512916A 2013-05-06 2014-04-22 非対称ガラス貫通ビアを有する電子デバイス Pending JP2016526284A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/887,788 US20140327510A1 (en) 2013-05-06 2013-05-06 Electronic device having asymmetrical through glass vias
US13/887,788 2013-05-06
PCT/US2014/035041 WO2014182445A1 (en) 2013-05-06 2014-04-22 Electronic device having asymmetrical through glass vias

Publications (2)

Publication Number Publication Date
JP2016526284A true JP2016526284A (ja) 2016-09-01
JP2016526284A5 JP2016526284A5 (enExample) 2017-05-25

Family

ID=50841965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016512916A Pending JP2016526284A (ja) 2013-05-06 2014-04-22 非対称ガラス貫通ビアを有する電子デバイス

Country Status (6)

Country Link
US (1) US20140327510A1 (enExample)
EP (1) EP2994925A1 (enExample)
JP (1) JP2016526284A (enExample)
KR (1) KR20160005349A (enExample)
CN (1) CN105190799A (enExample)
WO (1) WO2014182445A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018046181A (ja) * 2016-09-15 2018-03-22 大日本印刷株式会社 インダクタおよびインダクタの製造方法
JP2020136649A (ja) * 2019-02-19 2020-08-31 ▲き▼邦科技股▲分▼有限公司 半導体及びその製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9431473B2 (en) 2012-11-21 2016-08-30 Qualcomm Incorporated Hybrid transformer structure on semiconductor devices
US10002700B2 (en) 2013-02-27 2018-06-19 Qualcomm Incorporated Vertical-coupling transformer with an air-gap structure
US9634645B2 (en) 2013-03-14 2017-04-25 Qualcomm Incorporated Integration of a replica circuit and a transformer above a dielectric substrate
US9449753B2 (en) 2013-08-30 2016-09-20 Qualcomm Incorporated Varying thickness inductor
US9906318B2 (en) 2014-04-18 2018-02-27 Qualcomm Incorporated Frequency multiplexer
US11024454B2 (en) * 2015-10-16 2021-06-01 Qualcomm Incorporated High performance inductors
US20180286556A1 (en) * 2017-04-01 2018-10-04 Intel Corporation Integrated circuit implemented inductors and methods of manufacture
JP6781145B2 (ja) * 2017-12-28 2020-11-04 日本発條株式会社 携帯型無線通信装置、および携帯型無線通信装置を用いた情報識別装置
WO2024118422A1 (en) * 2022-11-30 2024-06-06 Corning Incorporated Through glass vias having adjustable arc shape and orientation and methods for forming the same via partitioned vortex laser beam

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007150022A (ja) * 2005-11-29 2007-06-14 Seiko Epson Corp 電子基板、その製造方法および電子機器
JP2009038297A (ja) * 2007-08-03 2009-02-19 Asahi Kasei Electronics Co Ltd 半導体装置
JP2009246159A (ja) * 2008-03-31 2009-10-22 Fuji Electric Device Technology Co Ltd 多出力磁気誘導素子およびそれを備えた多出力超小型電力変換装置
US20110291786A1 (en) * 2010-06-01 2011-12-01 Qualcomm Incorporated Through Via Inductor Or Transformer In A High-Resistance Substrate With Programmability

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Publication number Priority date Publication date Assignee Title
JP3571247B2 (ja) * 1999-03-31 2004-09-29 太陽誘電株式会社 積層電子部品
US20030151485A1 (en) * 2002-02-08 2003-08-14 Charles Lewis Surface mounted inductance element
US6990729B2 (en) * 2003-09-05 2006-01-31 Harris Corporation Method for forming an inductor
JP4764668B2 (ja) * 2005-07-05 2011-09-07 セイコーエプソン株式会社 電子基板の製造方法および電子基板
US20110217657A1 (en) * 2010-02-10 2011-09-08 Life Bioscience, Inc. Methods to fabricate a photoactive substrate suitable for microfabrication
US20110229687A1 (en) * 2010-03-19 2011-09-22 Qualcomm Incorporated Through Glass Via Manufacturing Process
US8591262B2 (en) * 2010-09-03 2013-11-26 Pulse Electronics, Inc. Substrate inductive devices and methods
EP2650915B1 (en) * 2010-12-10 2017-07-26 Panasonic Intellectual Property Management Co., Ltd. Conducting path and semiconductor device
US20120235969A1 (en) * 2011-03-15 2012-09-20 Qualcomm Mems Technologies, Inc. Thin film through-glass via and methods for forming same
US20130050226A1 (en) * 2011-08-30 2013-02-28 Qualcomm Mems Technologies, Inc. Die-cut through-glass via and methods for forming same
US8716871B2 (en) * 2012-02-15 2014-05-06 Taiwan Semiconductor Manufacturing Company, Ltd. Big via structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007150022A (ja) * 2005-11-29 2007-06-14 Seiko Epson Corp 電子基板、その製造方法および電子機器
JP2009038297A (ja) * 2007-08-03 2009-02-19 Asahi Kasei Electronics Co Ltd 半導体装置
JP2009246159A (ja) * 2008-03-31 2009-10-22 Fuji Electric Device Technology Co Ltd 多出力磁気誘導素子およびそれを備えた多出力超小型電力変換装置
US20110291786A1 (en) * 2010-06-01 2011-12-01 Qualcomm Incorporated Through Via Inductor Or Transformer In A High-Resistance Substrate With Programmability

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018046181A (ja) * 2016-09-15 2018-03-22 大日本印刷株式会社 インダクタおよびインダクタの製造方法
JP2020136649A (ja) * 2019-02-19 2020-08-31 ▲き▼邦科技股▲分▼有限公司 半導体及びその製造方法
US11056555B2 (en) 2019-02-19 2021-07-06 Chipbond Technology Corporation Semiconductor device having 3D inductor and method of manufacturing the same

Also Published As

Publication number Publication date
US20140327510A1 (en) 2014-11-06
KR20160005349A (ko) 2016-01-14
CN105190799A (zh) 2015-12-23
EP2994925A1 (en) 2016-03-16
WO2014182445A1 (en) 2014-11-13

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