CN105189045B - 工件的研磨装置 - Google Patents
工件的研磨装置 Download PDFInfo
- Publication number
- CN105189045B CN105189045B CN201480026546.2A CN201480026546A CN105189045B CN 105189045 B CN105189045 B CN 105189045B CN 201480026546 A CN201480026546 A CN 201480026546A CN 105189045 B CN105189045 B CN 105189045B
- Authority
- CN
- China
- Prior art keywords
- workpiece
- grinding
- template
- abrasive cloth
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-103719 | 2013-05-16 | ||
JP2013103719A JP5870960B2 (ja) | 2013-05-16 | 2013-05-16 | ワークの研磨装置 |
PCT/JP2014/002066 WO2014185003A1 (ja) | 2013-05-16 | 2014-04-10 | ワークの研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105189045A CN105189045A (zh) | 2015-12-23 |
CN105189045B true CN105189045B (zh) | 2017-05-10 |
Family
ID=51897996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480026546.2A Active CN105189045B (zh) | 2013-05-16 | 2014-04-10 | 工件的研磨装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20160082567A1 (ja) |
JP (1) | JP5870960B2 (ja) |
KR (1) | KR102192288B1 (ja) |
CN (1) | CN105189045B (ja) |
DE (1) | DE112014002107T5 (ja) |
SG (1) | SG11201509094YA (ja) |
TW (1) | TWI597127B (ja) |
WO (1) | WO2014185003A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10333959B2 (en) * | 2016-08-31 | 2019-06-25 | Nicira, Inc. | Use of public cloud inventory tags to configure data compute node for logical network |
JP6312229B1 (ja) * | 2017-06-12 | 2018-04-18 | 信越半導体株式会社 | 研磨方法及び研磨装置 |
JP7139126B2 (ja) * | 2018-03-16 | 2022-09-20 | 富士紡ホールディングス株式会社 | 保持具及びその製造方法 |
CN110394706A (zh) * | 2019-07-25 | 2019-11-01 | 西安奕斯伟硅片技术有限公司 | 一种硅片处理装置及方法 |
CN111644977A (zh) * | 2020-07-17 | 2020-09-11 | 中国科学院微电子研究所 | 研磨用固定环以及研磨头 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5267418A (en) * | 1992-05-27 | 1993-12-07 | International Business Machines Corporation | Confined water fixture for holding wafers undergoing chemical-mechanical polishing |
TW353203B (en) * | 1995-04-10 | 1999-02-21 | Matsushita Electric Ind Co Ltd | Apparatus for holding substrate to be polished |
JP3615592B2 (ja) | 1995-07-11 | 2005-02-02 | 不二越機械工業株式会社 | 研磨装置 |
JPH1190820A (ja) | 1997-09-12 | 1999-04-06 | Shin Etsu Handotai Co Ltd | ウエーハ研磨用テンプレートと該テンプレートを利用したウエーハ剥がし方法 |
US6899610B2 (en) * | 2001-06-01 | 2005-05-31 | Raytech Innovative Solutions, Inc. | Retaining ring with wear pad for use in chemical mechanical planarization |
US6893327B2 (en) * | 2001-06-04 | 2005-05-17 | Multi Planar Technologies, Inc. | Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface |
JP2005169568A (ja) * | 2003-12-11 | 2005-06-30 | Mitsui Chemicals Inc | リテーナリング及びそれを用いた研磨装置 |
US7086939B2 (en) * | 2004-03-19 | 2006-08-08 | Saint-Gobain Performance Plastics Corporation | Chemical mechanical polishing retaining ring with integral polymer backing |
JPWO2006038259A1 (ja) * | 2004-09-30 | 2008-07-31 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
KR20070118277A (ko) * | 2005-04-12 | 2007-12-14 | 니혼 세이미츠 덴시 가부시키가이샤 | Cmp 장치용 리테이너링과 그 제조방법 및 cmp 장치 |
TW200716302A (en) * | 2005-05-24 | 2007-05-01 | Entegris Inc | CMP retaining ring |
JP4534165B2 (ja) * | 2006-12-18 | 2010-09-01 | エルピーダメモリ株式会社 | 半導体装置の製造装置及び、半導体装置の製造方法 |
JP5615589B2 (ja) * | 2010-05-07 | 2014-10-29 | 富士紡ホールディングス株式会社 | 枠材および枠材を有する保持具 |
JP5683398B2 (ja) * | 2011-07-06 | 2015-03-11 | 株式会社クレハ | 研磨装置用ワークピース保持リング |
-
2013
- 2013-05-16 JP JP2013103719A patent/JP5870960B2/ja active Active
-
2014
- 2014-04-10 KR KR1020157032613A patent/KR102192288B1/ko active IP Right Grant
- 2014-04-10 US US14/787,659 patent/US20160082567A1/en not_active Abandoned
- 2014-04-10 DE DE112014002107.5T patent/DE112014002107T5/de not_active Withdrawn
- 2014-04-10 SG SG11201509094YA patent/SG11201509094YA/en unknown
- 2014-04-10 CN CN201480026546.2A patent/CN105189045B/zh active Active
- 2014-04-10 WO PCT/JP2014/002066 patent/WO2014185003A1/ja active Application Filing
- 2014-04-22 TW TW103114539A patent/TWI597127B/zh active
Also Published As
Publication number | Publication date |
---|---|
SG11201509094YA (en) | 2015-12-30 |
DE112014002107T5 (de) | 2016-01-14 |
TWI597127B (zh) | 2017-09-01 |
JP2014223692A (ja) | 2014-12-04 |
US20160082567A1 (en) | 2016-03-24 |
KR20160008550A (ko) | 2016-01-22 |
CN105189045A (zh) | 2015-12-23 |
KR102192288B1 (ko) | 2020-12-17 |
TW201505762A (zh) | 2015-02-16 |
WO2014185003A1 (ja) | 2014-11-20 |
JP5870960B2 (ja) | 2016-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105189045B (zh) | 工件的研磨装置 | |
JP4093793B2 (ja) | 半導体ウエーハの製造方法及びウエーハ | |
CN104968473B (zh) | 双面研磨装置用载具的制造方法及晶圆的双面研磨方法 | |
US9293318B2 (en) | Semiconductor wafer manufacturing method | |
EP1261020A1 (en) | Wafer manufacturing method, polishing apparatus, and wafer | |
CN104097134B (zh) | 用于借助同时双面抛光来抛光半导体晶片的方法 | |
JPH09270401A (ja) | 半導体ウェーハの研磨方法 | |
JP4670566B2 (ja) | 半導体ウェーハの両頭研削装置、静圧パッドおよびこれを用いた両頭研削方法 | |
JP6252098B2 (ja) | 角形金型用基板 | |
JP2014144525A (ja) | 研磨方法 | |
US20050014455A1 (en) | Method and pad for polishing wafer | |
CN101733697B (zh) | 一种硅片抛光方法 | |
TW556359B (en) | Method for manufacturing semiconductor wafer and semiconductor wafer | |
JP2009136935A (ja) | 研磨パッド | |
CN110052955B (zh) | 载体的制造方法及晶圆的双面研磨方法 | |
JP6508003B2 (ja) | テンプレートアセンブリの製造方法及びこのテンプレートアセンブリを用いた研磨方法並びにテンプレートアセンブリ | |
JP2008055575A (ja) | 研磨盤及びこれを用いた金属塗装面の研磨方法 | |
JP6717706B2 (ja) | ウェハの表面処理装置 | |
WO2018193758A1 (ja) | ウェーハの両面研磨方法および両面研磨装置 | |
Kimura et al. | Dressing of coarse-grained diamond wheels for ductile machining of brittle materials | |
JP2015111487A (ja) | ガラス基板の製造方法 | |
JP7099614B1 (ja) | テンプレートアセンブリ、研磨ヘッド及びウェーハの研磨方法 | |
JP2006142439A (ja) | 研磨パッドおよびこれを用いた研磨方法 | |
US20180085891A1 (en) | Apparatus for shaping the surface of chemical mechanical polishing pads | |
CN114770286A (zh) | 一种光学产品加工方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |