CN105074907B - 电子器件密封用树脂片以及电子器件封装体的制造方法 - Google Patents
电子器件密封用树脂片以及电子器件封装体的制造方法 Download PDFInfo
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JP2013-069860 | 2013-03-28 | ||
JP2013069860A JP5735029B2 (ja) | 2013-03-28 | 2013-03-28 | 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法 |
PCT/JP2014/057686 WO2014156925A1 (ja) | 2013-03-28 | 2014-03-20 | 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法 |
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CN105074907A CN105074907A (zh) | 2015-11-18 |
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TW (2) | TW201811973A (ja) |
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JP5976073B2 (ja) * | 2014-11-07 | 2016-08-23 | 日東電工株式会社 | 半導体装置の製造方法 |
JP6685080B2 (ja) * | 2014-11-07 | 2020-04-22 | 日東電工株式会社 | 電子デバイス封止用シート、及び、電子デバイスパッケージの製造方法 |
CN105778410A (zh) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | 包含三嵌段聚合物的环氧塑封料 |
JP6533399B2 (ja) * | 2015-03-19 | 2019-06-19 | 日東電工株式会社 | 封止用シートおよびパッケージの製造方法 |
TWI761317B (zh) * | 2015-11-04 | 2022-04-21 | 日商琳得科股份有限公司 | 熱固化性樹脂膜、第一保護膜形成用片以及第一保護膜的形成方法 |
KR102541134B1 (ko) * | 2015-11-04 | 2023-06-08 | 린텍 가부시키가이샤 | 열경화성 수지 필름과 제2 보호막 형성 필름의 키트, 열경화성 수지 필름, 제1 보호막 형성용 시트 및 반도체 웨이퍼용 제1 보호막의 형성 방법 |
JP6933463B2 (ja) * | 2016-12-28 | 2021-09-08 | 日東電工株式会社 | 樹脂シート |
WO2019117258A1 (ja) * | 2017-12-14 | 2019-06-20 | ナガセケムテックス株式会社 | 実装構造体の製造方法およびこれに用いられるシート |
CN117120551A (zh) * | 2021-03-24 | 2023-11-24 | 太阳控股株式会社 | 热固化性树脂组合物、干膜、固化物、印刷布线板以及电气电子部件 |
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TW200847354A (en) * | 2007-05-17 | 2008-12-01 | Nitto Denko Corp | Epoxy resin composition for semiconductor sealing and semiconductor device sealed with the same |
CN102786773A (zh) * | 2011-05-20 | 2012-11-21 | 日东电工株式会社 | 密封用薄片以及电子部件装置 |
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JP3317784B2 (ja) * | 1994-08-10 | 2002-08-26 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物 |
JPH10168164A (ja) * | 1996-12-13 | 1998-06-23 | Nitto Denko Corp | エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2009275107A (ja) * | 2008-05-14 | 2009-11-26 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2012219134A (ja) * | 2011-04-06 | 2012-11-12 | Hitachi Chemical Co Ltd | 電子部品用樹脂組成物及びそれを用いた液状封止材、電子部品装置 |
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TW200847354A (en) * | 2007-05-17 | 2008-12-01 | Nitto Denko Corp | Epoxy resin composition for semiconductor sealing and semiconductor device sealed with the same |
CN102786773A (zh) * | 2011-05-20 | 2012-11-21 | 日东电工株式会社 | 密封用薄片以及电子部件装置 |
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SG11201507886UA (en) | 2015-10-29 |
CN105074907A (zh) | 2015-11-18 |
JP2014189790A (ja) | 2014-10-06 |
WO2014156925A1 (ja) | 2014-10-02 |
TW201811973A (zh) | 2018-04-01 |
TW201446950A (zh) | 2014-12-16 |
JP5735029B2 (ja) | 2015-06-17 |
KR20150136471A (ko) | 2015-12-07 |
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