CN105062066A - 高频电子介质材料 - Google Patents
高频电子介质材料 Download PDFInfo
- Publication number
- CN105062066A CN105062066A CN201510551972.4A CN201510551972A CN105062066A CN 105062066 A CN105062066 A CN 105062066A CN 201510551972 A CN201510551972 A CN 201510551972A CN 105062066 A CN105062066 A CN 105062066A
- Authority
- CN
- China
- Prior art keywords
- filler
- temperature
- frequency electronic
- pressure
- stirring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title abstract description 19
- 239000000945 filler Substances 0.000 claims abstract description 49
- -1 amino compound Chemical class 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000003292 glue Substances 0.000 claims abstract description 18
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000178 monomer Substances 0.000 claims abstract description 14
- 239000004643 cyanate ester Substances 0.000 claims abstract description 12
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 9
- 239000004641 Diallyl-phthalate Substances 0.000 claims abstract description 8
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 8
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims abstract description 7
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 claims abstract description 7
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims abstract description 7
- MNKYQPOFRKPUAE-UHFFFAOYSA-N chloro(triphenyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(Cl)C1=CC=CC=C1 MNKYQPOFRKPUAE-UHFFFAOYSA-N 0.000 claims abstract description 6
- DLPASUVGCQPFFO-UHFFFAOYSA-N magnesium;ethane Chemical compound [Mg+2].[CH2-]C.[CH2-]C DLPASUVGCQPFFO-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000002360 preparation method Methods 0.000 claims abstract description 5
- 239000012779 reinforcing material Substances 0.000 claims abstract description 5
- OTVPWGHMBHYUAX-UHFFFAOYSA-N [Fe].[CH]1C=CC=C1 Chemical compound [Fe].[CH]1C=CC=C1 OTVPWGHMBHYUAX-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000008367 deionised water Substances 0.000 claims abstract description 4
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000003989 dielectric material Substances 0.000 claims description 22
- 238000003756 stirring Methods 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 10
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 8
- 235000010482 polyoxyethylene sorbitan monooleate Nutrition 0.000 claims description 8
- 239000000244 polyoxyethylene sorbitan monooleate Substances 0.000 claims description 8
- 229920000053 polysorbate 80 Polymers 0.000 claims description 8
- 239000004744 fabric Substances 0.000 claims description 7
- 238000007731 hot pressing Methods 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000005416 organic matter Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 238000001027 hydrothermal synthesis Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 238000001354 calcination Methods 0.000 claims description 3
- 239000012295 chemical reaction liquid Substances 0.000 claims description 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 3
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 claims description 3
- 239000012065 filter cake Substances 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- GDKAXSGMPFSRJY-UHFFFAOYSA-J 2-ethylhexanoate;titanium(4+) Chemical compound [Ti+4].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O GDKAXSGMPFSRJY-UHFFFAOYSA-J 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 238000011161 development Methods 0.000 abstract description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 2
- ZORQXIQZAOLNGE-UHFFFAOYSA-N 1,1-difluorocyclohexane Chemical compound FC1(F)CCCCC1 ZORQXIQZAOLNGE-UHFFFAOYSA-N 0.000 abstract 1
- UJMZZAZBRIPOHZ-UHFFFAOYSA-N 2-ethylhexan-1-ol;titanium Chemical compound [Ti].CCCCC(CC)CO UJMZZAZBRIPOHZ-UHFFFAOYSA-N 0.000 abstract 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 abstract 1
- 229940035049 sorbitan monooleate Drugs 0.000 abstract 1
- 235000011069 sorbitan monooleate Nutrition 0.000 abstract 1
- 239000001593 sorbitan monooleate Substances 0.000 abstract 1
- 239000000047 product Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000002131 composite material Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- UMMBKZGNPHABPI-UHFFFAOYSA-N [Si].[Ti].[Mg] Chemical compound [Si].[Ti].[Mg] UMMBKZGNPHABPI-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YUWBVKYVJWNVLE-UHFFFAOYSA-N [N].[P] Chemical compound [N].[P] YUWBVKYVJWNVLE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- DWSWCPPGLRSPIT-UHFFFAOYSA-N benzo[c][2,1]benzoxaphosphinin-6-ium 6-oxide Chemical compound C1=CC=C2[P+](=O)OC3=CC=CC=C3C2=C1 DWSWCPPGLRSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229940125773 compound 10 Drugs 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/0644—Poly(1,3,5)triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
本发明涉及一种高频电子介质材料,由胶液涂覆增强材料后热压制成;所述胶液的制备方法为,将三苯基氯硅烷分散于去离子水中,然后加入二乙基镁与2-乙基-1-己醇钛,再加入聚氧乙烯山梨醇酐单油酸酯,得到填料;将填料加入邻苯二甲酸二缩水甘油酯中,得到活性填料;混合环戊二烯基三羰基铁与氰酸酯单体,再依次加入胺基化合物、脂肪族缩水甘油醚、邻苯二甲酸二丙烯酯,冷却后得到树脂预聚物;然后将树脂预聚物加入丁酮中,搅拌;加入活性填料与丙烯腈;再加入PMA与二烯丙基二苯醚,继续搅拌得到胶液。本发明制备的高频电子介质材料具有优异的力学性能、耐热性能,满足高频电子介质材料的发展应用。
Description
技术领域
本发明属于新型电子复合材料技术领域,具体涉及一种高频电子介质材料,具有优异的介电性。
背景技术
新材料的开发与研究是材料科学发展的先导。复合材料是新型材料,因其耐电压、重量轻、可设计、耐高温、耐折等多样化的功能和出色的性能,在近30年来广泛应用于航空、航天、能源、交通、机械、建筑、化工、生物医学和体育等领域。随着材料开发和应用,复合材料已形成网络渗透到各个行业领域当中。在电场作用下,由电能转变为其它形式的能,统称为介质损耗。它是导致电介质发生热击穿的根源。电介质在单位时间内消耗的能量称为电介质损耗功率,简称电介质损耗。印刷线路板是由覆铜板经过线路制作后形成,覆铜板由玻璃布以及附着于该玻璃布上的树脂层与导体层热压得到,因此PCB板的主要性能,特别是信号传输性能只要有CCL决定,同时CCL的性能与树脂基体关系很大。随着电子产品向轻、薄、小、高密度、多功能化发展,元件组装密度和集成度越来越高,传递信号频率越来越高,起传递信号作用的线路层间距越来越小,线宽越来越窄,这对基础电子材料提出了更高的要求,主要为高耐热性、优异的介电性能、高绝缘性、合适的机械性能以及加工性,特别是介电性能。材料的相对介电系数越小,信号的传输速度越快;介电损耗因子越小,信号在传输过程中的损耗功率保持一定时,允许传输的频率就越高,即在信号频率相同下,介电损耗值越小,信号传输过程中失真率就越低。
现在许多电子产品例如通讯类电子产品等,工作频率不断提高,要求封装互连用印制电路板基材的介质损耗应当尽可能地降低。在电场作用下,介质中会有泄漏电流流过,引起电导损耗。气体的电导损耗很小,而液体、固体中的电导损耗则与它们的结构有关。电导损耗,实质是相当于交流、直流电流流过电阻做功,故在这两种条件下都有电导损耗。绝缘好时,液、固电介质在工作电压下的电导损耗是很小的,与电导一样,是随温度的增加而急剧增加的。
信息技术日新月异的今天,电子产品不断地向轻薄化、高可靠性方向发展,高密度互连(HDI)技术的应用成了印刷电路板制作技术的主流,通孔微小化,导线精细化等核心技术的发展,要求制作印刷电路板的基材必须具有高的特性阻抗,即低的介电常数。因此,优异的介电性能、良好的加工性成为高频覆铜板发展的基本性能要求。
发明内容
本发明的目的是提供一种高频电子介质材料,其具有优异的介电性能、良好的耐热性能,可作为高频电子电路材料应用。
为达到上述发明目的,本发明采用的技术方案是:一种高频电子介质材料,由胶液涂覆增强材料后热压制成;所述胶液的制备方法为:
(1)将三苯基氯硅烷分散于去离子水中,然后加入二乙基镁与2-乙基-1-己醇钛;然后于120℃下水热反应3小时;然后过滤反应液,滤饼烘干后于600℃煅烧1小时,自然冷却后再于950℃烧结2小时,得到的粉末加入乙醇中,分散均匀后再加入聚氧乙烯山梨醇酐单油酸酯,于60℃搅拌2小时,最后烘干得到填料;将填料加入邻苯二甲酸二缩水甘油酯中,125℃搅拌1小时,得到活性填料;
(2)混合环戊二烯基三羰基铁与氰酸酯单体,95℃搅拌10分钟后依次加入胺基化合物、脂肪族缩水甘油醚,于120℃搅拌1小时,然后加入邻苯二甲酸二丙烯酯,于120℃搅拌0.5小时,冷却后得到树脂预聚物;然后将树脂预聚物加入丁酮中,搅拌1小时;加入活性填料与丙烯腈;再加入PMA与二烯丙基二苯醚,继续搅拌2.5小时,得到胶液;所述胶液的固含量为60~65%;
所述氰酸酯单体的分子结构式为:
所述胺基化合物的分子结构式为:
所述脂肪族缩水甘油醚的分子结构式为:
本发明中,所述填料的粒径为450nm~680nm;所述三苯基氯硅烷、二乙基镁与2-乙基-1-己醇钛、聚氧乙烯山梨醇酐单油酸酯的质量比为1∶0.5∶0.02∶0.01;所述填料与邻苯二甲酸二缩水甘油酯的质量比为1∶1.6。无机材料与有机物的介电性能相差较大,在有机无机两相间存在的两相混和相界层存在着比较复杂的物理化学变化;随着无机物的增加,无机相密集地分散在聚合物基体中,影响粒子与聚合物良好粘结,可能造成填料团聚,气孔增多,使复合材料介质损耗性能下降;并且由于无机物本身的脆性,材料的韧性也呈下降趋势。填料本身性质对复合材料介电性能有直接影响,如尺寸、形状等,就颗粒尺寸而言,在一定范围内颗粒尺寸越小,填料容易与有机物实现均匀混合,且与聚合物基体的界面就越多,在极化过程中界面极化效应越显著,从而极大地影响材料介质损耗;而在纳米尺寸范围,填料的晶格及饱和极化率变化也会造成复合材料介电性能改变。本发明先制备了硅-镁钛配合物填料,然后采用聚氧乙烯山梨醇酐单油酸酯对其处理,与现有偶联剂表面处理不同,水热反应得到的填料直接用于树脂复合体系不合适,会影响树脂的固化过程,通过聚氧乙烯山梨醇酐单油酸酯一方面调节填料的表面性质,防止其对树脂产生局部聚合过快的影响,另外还可以调节聚合物交联网络,使得固化产物交联合理,不至于脆性过大。
填料在有机物中的分散状态对复合材料的介电性能有重要影响。材料的介电性能是由电介质的极化引起的,由于物理分散在机械力作用停止后,颗粒又会相互聚集起来,所以通常采用化学法分散,即使用偶联剂、表面活性剂等对粉体颗粒表面进行处理,降低其表面能,改善填料与有机物之问的相容性,使填料分散均匀且与基体紧密;但是这些处理剂会大大影响材料的热性能,并且处理剂本身极性强,对复合材料的介电性能不利;为克服这一缺点,本发明不添加处理剂,将填料加入邻苯二甲酸二缩水甘油酯中得到活性填料,反应基团含量高,黏度小,所以参与有机物的聚合反应,固化后得到的是交联聚合物网络,同时由于填料以及小分子化合物的存在,分子间链段的可旋转性较好,产品机械性能好。
本发明中,所述环戊二烯基三羰基铁、氰酸酯单体、胺基化合物、脂肪族缩水甘油醚、邻苯二甲酸二丙烯酯的质量比为0.0001~0.0003∶1∶0.1~0.18∶0.81~0.95∶0.08~0.09;树脂预聚物、活性填料、丙烯腈、二烯丙基二苯醚的质量比为1∶0.61~0.73∶0.06~0.08∶0.11~0.15。本发明中,采用不同官能度的环氧树脂与氰酸酯共聚,同时添加反应性好的小分子有机物,形成的固化网络结构中,含有大量的三嗪环及芳香环,具有很高的玻璃化转变温度和高温下机械强度;不含易水解的酯键、酰胺键等,因此该体系具有较小的吸湿性和良好的耐湿热性能;固化物结构对称,因此其极性很低,介电性能极其优异。
本发明中,所述增强材料为电子级玻璃纤维布;热压的条件采用逐步升温和升压的方式,10min温度从50℃升到180℃,保持60min,然后10min升到200℃保持90min,然后5min升到230℃保持90min,最后180min冷却到50℃;1min压力从0Kg/cm2升到15Kg/cm2,然后保压45min,然后1min升到20Kg/cm2保压50min,最后1min升到35Kg/cm2,保压200min;丁酮、PMA为溶剂,不参与固化过程,本发明制备的高频电子介质材料的有机物含量为68~72%。在如此高的有机物含量下,依然得到了力学性能优异、耐热性好、介电性能优良的电子基材。氰酸酯单体聚合时易受其他官能团的影响,这是优点也有劣处,如果与其反应的化合物能够保留其聚合密度还能改善其脆性、反应过快的缺陷,则有利,反之如果与其反应的物质破坏其反应程度,则不利;本发明先用环氧单体对填料处理,减弱了填料反应性的同时改善了填料在有机物,特别是高聚物中的分散性,处理后的活性填料加入树脂预聚物时不会影响聚合物固化过程,反而改善交联网络的密度,增加柔性点。树脂固化包括凝胶-固化-后处理过程,在固化过程中放热,与固化程度和产品的物理、力学性能有着密切的关系。高的放热温度有利于树脂固化,但过高的放热温度则是有害的,可以引起树脂体积收缩的增加和微裂纹的出现,因而导致材料力学性能的下降,特别的对于有微裂纹的制品意味着介质的渗漏,导致耐腐蚀性下降;本发明胺基化合物、邻苯二甲酸二丙烯酯的加入可以有效地降低树脂固化最高放热峰,而同时对凝胶时间不影响。通过小分子有机物的加入以及对填料的环氧化处理,本发明中氰酸酯树脂、胺基化合物以及环氧树脂固化工艺趋于一致,从而得到了耐热性、机械性能、耐化学性优异的树脂组合物,产品结构含有均匀的纳米级空穴,避免了常规填料存在悬挂键对介电性能的不利影响,具有良好的低介电常数,可用作高频电子材料。
由于上述技术方案运用,本发明与现有技术相比具有下列优点:
本发明中,通过丙烯酯单体、胺基化合物将环氧、氰酸酯树脂组合使用,能够得到力学性能优异、耐热性能优异的聚合物主体;通过加入聚氧乙烯山梨醇酐单油酸酯,体系中填料的密度均匀,能得到良好的拌合性,有利于聚合体聚合。填料、小分子有机物的加入增加体系固化过程中的交联点,得到互穿聚合物结构,保证高频电子介质材料的强度。本发明利用的树脂基复合体系组成合理,各组成分之间相容性好,由此制备得到了高频电子介质材料,具有良好的力学性、耐热性能,特别具有优异的介电性能,满足高频电子介质材料的发展应用。原料组成合理,综合聚合物、无机粒子两组分的优点,改善两组分的缺点,从而提高得到材料的综合性能;制备的热压板材具有优异的耐热性能,固化效果好,交联结构均匀,小分子化合物可以作为高分子有机物的相容剂,一方面增加体系各组分的相容性,另一方面避免热压固化时形成交联不均的缺陷,保证树脂体系形成稳定的结构,力学性强,取得了意想不到的效果。
具体实施方式
下面结合实施例对本发明作进一步描述:
本实施例所用原料都为市购,属于工业品;其中,
氰酸酯单体的分子结构式为:
胺基化合物的分子结构式为:
脂肪族缩水甘油醚的分子结构式为:
实施例一填料的制备
将1Kg三苯基氯硅烷分散于去离子水中,然后加入500g二乙基镁与2092-乙基-1-己醇钛;然后于120℃下水热反应3小时;然后过滤反应液,滤饼烘干后于600℃煅烧1小时,自然冷却后再于950℃烧结2小时,得到的粉末加入乙醇中,分散均匀后再加入10g聚氧乙烯山梨醇酐单油酸酯,于60℃搅拌2小时,最后烘干得到填料(粒径为450nm~680nm);将1000g填料加入1.6Kg邻苯二甲酸二缩水甘油酯中,125℃搅拌1小时,得到活性填料。
实施例二
根据表1、表2的组成,按照以下步骤进行,混合环戊二烯基三羰基铁与氰酸酯单体,95℃搅拌10分钟后依次加入胺基化合物、脂肪族缩水甘油醚,于120℃搅拌1小时,然后加入邻苯二甲酸二丙烯酯,于120℃搅拌0.5小时,冷却后得到树脂预聚物;然后将树脂预聚物加入丁酮中,搅拌1小时;加入活性填料与丙烯腈;再加入PMA与二烯丙基二苯醚,继续搅拌2.5小时,得到胶液。
表1原料组成(g)
1# | 2# | 3# | 4# | 5# | |
环戊二烯基三羰基铁 | 0.01 | 0.024 | 0.018 | 0.02 | 0.03 |
氰酸酯单体 | 100 | 100 | 100 | 100 | 100 |
胺基化合物 | 10 | 12 | 16 | 14 | 18 |
脂肪族缩水甘油醚 | 81 | 85 | 88 | 90 | 95 |
邻苯二甲酸二丙烯酯 | 8 | 8.2 | 8.5 | 8.7 | 9 |
表2原料组成(g)
1# | 2# | 3# | 4# | 5# | |
树脂预聚物 | 100 | 100 | 100 | 100 | 100 |
活性填料 | 61 | 65 | 68 | 71 | 73 |
丙烯腈 | 6 | 6.5 | 7.2 | 7.5 | 8 |
二烯丙基二苯醚 | 11 | 12 | 13 | 14 | 15 |
胶液的固含量 | 60% | 62% | 62% | 64% | 65% |
实施例三高频电子介质材料的制备
将上述胶液涂覆与电子级玻璃布上,在烘箱中170℃条件下烘烤2min,制备预浸料;将预浸料裁去毛边;取5片层叠后双面覆上离型膜,热压成形,即可得到所述高频电子介质材料。
热压的条件采用逐步升温和升压的方式,10min温度从50℃升到180℃,保持60min,然后10min升到200℃保持90min,然后5min升到230℃保持90min,最后180min冷却到50℃;1min压力从0Kg/cm2升到15Kg/cm2,然后保压45min,然后1min升到20Kg/cm2保压50min,最后1min升到35Kg/cm2,保压200min。
对比例
树脂基体的制备,将300g双酚A型氰酸酯单体加入到烧杯中,油浴90℃反应8分钟,升温至150℃,加入0.06g一乙醇胺,反应20分钟,将液体倒入托盘中,自然冷却得到白色固体;向烧杯中加入100g白色固体、11g磷氮阻燃剂、80g丁酮溶剂,开启搅拌,0.5h即得胶液;将上述胶液涂覆与电子级玻璃布上,在烘箱中170℃条件下烘烤2min,制备预浸料;将预浸料裁去毛边;取5片层叠后双面覆上离型膜,热压成形,即可得到6#高频电子介质材料。
压合条件采用逐步升温和升压的方式,20min温度从50℃升到150℃,保持120min,然后10min升到200℃保持90min,然后5min升到240℃保持100min,最后180min冷却到50℃。1min压力从0Kg/cm2升到5Kg/cm2,然后保压25min,然后1min升到15Kg/cm2保压50min,最后1min升到25Kg/cm2,保压100min。
向烧杯中加入100g双酚A环氧树脂、8gDOPO、80g丁酮溶剂,开启搅拌,0.5h即得胶液;将上述胶液涂覆与电子级玻璃布上,在烘箱中170℃条件下烘烤2min,制备预浸料;将预浸料裁去毛边;取5片层叠后双面覆上离型膜,热压成形,即可得到7#高频电子介质材料。
压合条件采用逐步升温和升压的方式,20min温度从50℃升到150℃,保持120min,然后10min升到200℃保持60min,然后5min升到220℃保持110min,最后180min冷却到50℃。1min压力从0Kg/cm2升到5Kg/cm2,然后保压25min,然后1min升到15Kg/cm2保压50min,最后1min升到25Kg/cm2,保压100min。
根据IPC标准方法对上述制备的实施例以及对比例中的板材的机械性能、介电性能以及热性能等进行了测定,结果参见表3。
表3性能测试结果
弯曲强度 | 弯曲弹性模量 | tanδ | ε | Tg | 电气强度 | 有机物含量 | |
1# | 591 | 24554 | 0.005 | 3.48 | 234 | 28.3 | 68 |
2# | 587 | 24501 | 0.005 | 3.45 | 236 | 28.1 | 69 |
3# | 594 | 24610 | 0.004 | 3.44 | 239 | 28.6 | 70 |
4# | 586 | 24489 | 0.006 | 3.45 | 235 | 28.2 | 71 |
5# | 590 | 24516 | 0.005 | 3.51 | 233 | 28.0 | 72 |
6# | 541 | 23687 | 0.012 | 3.86 | 221 | 24.1 | 54 |
7# | 525 | 23421 | 0.017 | 4.10 | 210 | 22.3 | 50 |
单位 | N/mm2 | N/mm2 | ℃ | MV/m | % |
综上,本发明公开的高频电子介质材料组成合理,各组成分之间相容性好,由此制备得到了高频电子介质材料,具有良好的力学性能,特别具有优异的介电性能,满足高频电子介质材料的发展应用。
Claims (6)
1.一种高频电子介质材料,由胶液涂覆增强材料后热压制成;所述胶液的制备方法为:
(1)将三苯基氯硅烷分散于去离子水中,然后加入二乙基镁与2-乙基-1-己醇钛;然后于120℃下水热反应3小时;然后过滤反应液,滤饼烘干后于600℃煅烧1小时,自然冷却后再于950℃烧结2小时,得到的粉末加入乙醇中,分散均匀后再加入聚氧乙烯山梨醇酐单油酸酯,于60℃搅拌2小时,最后烘干得到填料;将填料加入邻苯二甲酸二缩水甘油酯中,125℃搅拌1小时,得到活性填料;
(2)混合环戊二烯基三羰基铁与氰酸酯单体,95℃搅拌10分钟后依次加入胺基化合物、脂肪族缩水甘油醚,于120℃搅拌1小时,然后加入邻苯二甲酸二丙烯酯,于120℃搅拌0.5小时,冷却后得到树脂预聚物;然后将树脂预聚物加入丁酮中,搅拌1小时;加入活性填料与丙烯腈;再加入PMA与二烯丙基二苯醚,继续搅拌2.5小时,得到胶液;所述胶液的固含量为60~65%;
所述氰酸酯单体的分子结构式为:
所述胺基化合物的分子结构式为:
所述脂肪族缩水甘油醚的分子结构式为:
2.根据权利要求1所述高频电子介质材料,其特征在于:所述填料的粒径为450nm~680nm;所述三苯基氯硅烷、二乙基镁与2-乙基-1-己醇钛、聚氧乙烯山梨醇酐单油酸酯的质量比为1∶0.5∶0.02∶0.01;所述填料与邻苯二甲酸二缩水甘油酯的质量比为1∶1.6。
3.根据权利要求1所述高频电子介质材料,其特征在于:所述环戊二烯基三羰基铁、氰酸酯单体、胺基化合物、脂肪族缩水甘油醚、邻苯二甲酸二丙烯酯的质量比为0.0001~0.0003∶1∶0.1~0.18∶0.81~0.95∶0.08~0.09;树脂预聚物、活性填料、丙烯腈、二烯丙基二苯醚的质量比为1∶0.61~0.73∶0.06~0.08∶0.11~0.15。
4.根据权利要求1所述高频电子介质材料,其特征在于:所述增强材料为电子级玻璃纤维布。
5.根据权利要求1所述高频电子介质材料,其特征在于:热压的条件采用逐步升温和升压的方式,10min温度从50℃升到180℃,保持60min,然后10min升到200℃保持90min,然后5min升到230℃保持90min,最后180min冷却到50℃;1min压力从0Kg/cm2升到15Kg/cm2,然后保压45min,然后1min升到20Kg/cm2保压50min,最后1min升到35Kg/cm2,保压200min。
6.根据权利要求1所述高频电子介质材料,其特征在于:所述高频电子介质材料的有机物含量为68~72%。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711164018.5A CN108047715A (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料的制备方法 |
CN201711164017.0A CN108102139A (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料用活性填料及其制备方法 |
CN201510551972.4A CN105062066B (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料 |
CN201711164019.XA CN108129835A (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料用胶液及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510551972.4A CN105062066B (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711164017.0A Division CN108102139A (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料用活性填料及其制备方法 |
CN201711164019.XA Division CN108129835A (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料用胶液及其制备方法 |
CN201711164018.5A Division CN108047715A (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105062066A true CN105062066A (zh) | 2015-11-18 |
CN105062066B CN105062066B (zh) | 2018-07-06 |
Family
ID=54491602
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711164017.0A Pending CN108102139A (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料用活性填料及其制备方法 |
CN201711164019.XA Pending CN108129835A (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料用胶液及其制备方法 |
CN201711164018.5A Pending CN108047715A (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料的制备方法 |
CN201510551972.4A Active CN105062066B (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料 |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711164017.0A Pending CN108102139A (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料用活性填料及其制备方法 |
CN201711164019.XA Pending CN108129835A (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料用胶液及其制备方法 |
CN201711164018.5A Pending CN108047715A (zh) | 2015-09-02 | 2015-09-02 | 高频电子介质材料的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (4) | CN108102139A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110643321B (zh) * | 2019-09-24 | 2022-03-29 | 苏州益可泰电子材料有限公司 | 电子材料胶液及其应用 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102115600A (zh) * | 2010-11-26 | 2011-07-06 | 苏州生益科技有限公司 | 一种热固性树脂组合物、半固化片及层压板 |
CN102181143A (zh) * | 2011-04-08 | 2011-09-14 | 苏州生益科技有限公司 | 一种高频用热固性树脂组合物、半固化片及层压板 |
CN102199351A (zh) * | 2011-04-08 | 2011-09-28 | 苏州生益科技有限公司 | 热固性树脂组合物、半固化片及层压板 |
CN102276961A (zh) * | 2011-07-22 | 2011-12-14 | 苏州生益科技有限公司 | 无卤无磷环氧树脂组合物及使用其制作的半固化片及层压板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6423780B1 (en) * | 2001-02-07 | 2002-07-23 | Loctite | Heterobifunctional monomers and uses therefor |
CN101544841B (zh) * | 2009-04-10 | 2010-07-21 | 广东生益科技股份有限公司 | 复合材料及用其制作的高频电路基板 |
EP2542618B1 (en) * | 2010-03-05 | 2020-01-01 | Huntsman Advanced Materials Americas LLC | Low dielectric loss thermoset resin system at high frequency for use in electrical components |
CN102977551B (zh) * | 2011-09-02 | 2014-12-10 | 广东生益科技股份有限公司 | 无卤树脂组合物以及使用其制作覆铜板的方法 |
CN102504532B (zh) * | 2011-10-18 | 2013-09-18 | 广东生益科技股份有限公司 | 无卤低介电树脂组合物及使用其制作的预浸料与覆铜箔层压板 |
CN102558858B (zh) * | 2011-12-22 | 2014-03-26 | 云南云天化股份有限公司 | 覆铜层压板用树脂组合物及半固化片 |
CN103265810B (zh) * | 2013-05-29 | 2015-09-23 | 苏州生益科技有限公司 | 一种用于高频高速基板的树脂组合物及使用其制作的半固化片及层压板 |
CN103833873B (zh) * | 2014-02-10 | 2016-06-08 | 上纬(江苏)新材料有限公司 | 环氧基改性马来酸酐共聚物预聚物及其树脂组合物、制备方法和应用 |
-
2015
- 2015-09-02 CN CN201711164017.0A patent/CN108102139A/zh active Pending
- 2015-09-02 CN CN201711164019.XA patent/CN108129835A/zh active Pending
- 2015-09-02 CN CN201711164018.5A patent/CN108047715A/zh active Pending
- 2015-09-02 CN CN201510551972.4A patent/CN105062066B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102115600A (zh) * | 2010-11-26 | 2011-07-06 | 苏州生益科技有限公司 | 一种热固性树脂组合物、半固化片及层压板 |
CN102181143A (zh) * | 2011-04-08 | 2011-09-14 | 苏州生益科技有限公司 | 一种高频用热固性树脂组合物、半固化片及层压板 |
CN102199351A (zh) * | 2011-04-08 | 2011-09-28 | 苏州生益科技有限公司 | 热固性树脂组合物、半固化片及层压板 |
CN102276961A (zh) * | 2011-07-22 | 2011-12-14 | 苏州生益科技有限公司 | 无卤无磷环氧树脂组合物及使用其制作的半固化片及层压板 |
Also Published As
Publication number | Publication date |
---|---|
CN105062066B (zh) | 2018-07-06 |
CN108129835A (zh) | 2018-06-08 |
CN108047715A (zh) | 2018-05-18 |
CN108102139A (zh) | 2018-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108146035A (zh) | 阻燃耐热覆铜板 | |
CN101684191A (zh) | 无卤高频树脂组合物及用其制成的预浸料与层压板 | |
CN106280247B (zh) | 电磁波吸波材料用树脂组合物 | |
KR101819949B1 (ko) | 초저 유전 손실 열경화성 수지 조성물 및 이로부터 제조된 고성능 라미네이트 | |
CN102850726A (zh) | 复合材料、用其制作的高频电路基板及其制作方法 | |
KR20110108782A (ko) | 열경화성 조성물 및 그를 이용하는 인쇄회로기판 | |
CN106916282B (zh) | 一种环氧树脂组合物以及使用其的预浸料和层压板 | |
TWI532776B (zh) | Aromatic tetrafunctional vinyl benzyl resin composition and its application | |
CN114932727A (zh) | 一种耐热碳氢树脂基覆铜板及其制备方法 | |
CN103360764A (zh) | 热固性树脂组合物及使用其制作的半固化片及层压板 | |
CN110606698B (zh) | 高均匀性、低热膨胀系数的微波复合介质基板及制备工艺 | |
CN110724261B (zh) | 高耐热低介电聚苯醚型双马来酰亚胺树脂、层压板及其制备方法 | |
CN115305031A (zh) | 一种低介电、高Tg的碳氢粘结片及其制备的高频覆铜板 | |
Xu et al. | Fabrication of phthalonitrile-based copper-clad laminates and their application properties: Thermo-stability and dielectric properties | |
CN105062066B (zh) | 高频电子介质材料 | |
CN109370497B (zh) | 一种生产高速覆铜板的胶水的制备方法及其产品 | |
CN105130274A (zh) | 一种高热稳定性的微波复合介质基板及其制备方法 | |
CN111605269A (zh) | 一种高相对漏电起痕指数高耐热fr4覆铜板及其制备方法 | |
CN109971152B (zh) | 聚苯醚树脂组合物、预浸料、层压板及印刷线路板 | |
CN114573426B (zh) | 一种苯并环丁烯衍生物及其应用 | |
CN113462143A (zh) | 聚苯醚树脂组合物及使用其制备的半固化片和层压板 | |
CN114644846A (zh) | 含氟聚合物乳液覆铜板及其制备方法 | |
CN104559177A (zh) | 树脂组合物及半固化片、复合基材和pcb基材的制备方法 | |
CN108485195A (zh) | 一种高介电性能热压材料的制备方法 | |
CN114106516A (zh) | 环氧树脂组合物及半固化片、层压板和印制线路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180613 Address after: 211161 No. 12, run Shou Road, Jiangning Binjiang economic and Technological Development Zone, Nanjing, Jiangsu Applicant after: Nanjing Anertai Communication Science and Technology Co., Ltd. Address before: 215011 room 315, Xingxian Road, Hu Guan, New District, Suzhou, Jiangsu, 315 Applicant before: Suzhou Yiketai Electronic Material Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant |