CN111605269A - 一种高相对漏电起痕指数高耐热fr4覆铜板及其制备方法 - Google Patents

一种高相对漏电起痕指数高耐热fr4覆铜板及其制备方法 Download PDF

Info

Publication number
CN111605269A
CN111605269A CN202010431263.3A CN202010431263A CN111605269A CN 111605269 A CN111605269 A CN 111605269A CN 202010431263 A CN202010431263 A CN 202010431263A CN 111605269 A CN111605269 A CN 111605269A
Authority
CN
China
Prior art keywords
parts
copper
resin
prepreg
clad plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010431263.3A
Other languages
English (en)
Inventor
付军亮
陈长浩
郑宝林
杨永亮
秦伟峰
刘俊秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANDONG JINBAO ELECTRONICS CO Ltd
Original Assignee
SHANDONG JINBAO ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANDONG JINBAO ELECTRONICS CO Ltd filed Critical SHANDONG JINBAO ELECTRONICS CO Ltd
Priority to CN202010431263.3A priority Critical patent/CN111605269A/zh
Publication of CN111605269A publication Critical patent/CN111605269A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/08—Interconnection of layers by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2461/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08J2461/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)

Abstract

本发明公开了一种高相对漏电起痕指数高耐热FR4覆铜板，两侧均覆有铜箔，最外两个半固化片为表料半固化片，两个表料半固化片之间设有3‑6层里料半固化片，二者基材均为为电子级玻璃布，含胶量42‑54wt％，流动度18‑20％，里料半固化片的浸胶液包括以下重量份的组分：溴化环氧树脂30‑80份、高耐热树脂10‑30份、多官能团环氧树脂5‑20份、固化剂1‑5份、促进剂0.2‑5份、填料10‑40份和溶剂10‑35份，表料半固化片的浸胶液为在里料半固化片浸胶液的基础上增加20‑40重量份的高CTI树脂。本发明浸胶液采用固化剂与酚醛树脂共同固化环氧树脂，同时加入高CTI树脂，使覆铜板的CTI值达到了600V，降低了溴含量，较低的溴含量有利于CTI值的提高，通过调节多种树脂的含量，提高了覆铜板的耐热性。

Description

一种高相对漏电起痕指数高耐热FR4覆铜板及其制备方法
技术领域
本发明涉及覆铜板，尤其涉及一种高相对漏电起痕指数高耐热FR4覆铜板及其制备方法。
背景技术
如今科技的发展，人民生活的安全性越来越受到社会的广泛关注，为提高电子产品的安全可靠性，特别是在潮湿环境下使用的电子产品，如空调、洗衣机等，目前电子行业正在大力开发生产具有高耐漏电起痕指数的电子产品。随着印制电路(PCB)向精细线路、高密度与高多层方向发展，对板材的耐热性、平整性及相关电性能有了更高的要求。目前相对漏电起痕指数(CTI)较高的覆铜板大都使用双氰胺固化环氧树脂体系，但其CTI值也仅为175V-220V，且耐热性偏低，无法满足高温使用需求。
发明内容
本发明针对现有双氰胺固化环氧树脂体系的覆铜板存在的上述问题，提供一种高相对漏电起痕指数高耐热FR4覆铜板，该FR4覆铜板两侧均覆有铜箔，覆有铜箔的最外两个半固化片为表料半固化片，所述表料半固化片之间设有3-6层里料半固化片，表料半固化片基材为电子级玻璃布，含胶量为42-54wt％，流动度为18-20％，所述里料半固化片基材为电子级玻璃布，含胶量为42-54wt％，流动度为18-20％；里料半固化片的浸胶液包括以下重量份的组分：溴化环氧树脂30-80份、高耐热树脂10-30份、多官能团环氧树脂5-20份、固化剂1-5份、促进剂0.2-5份、填料10-40份和溶剂10-35份；表料半固化片的浸胶液为在所述里料半固化片浸胶液的基础上增加20-40重量份的高CTI树脂。
其中，溴化环氧树脂为溴含量为18-21％的低溴环氧树脂或溴含量为50-60％的高溴环氧树脂之一；高耐热树脂为萘酚型双酚A树脂、MDI改性酚醛树脂、双马来酰亚胺树脂、聚苯醚树脂、聚酰亚胺树脂或氨基苯酚类环氧树脂中的一种或多种的组合；多官能团环氧树脂为四苯缩水甘油醚基乙烷或三苯基缩水甘油醚基甲烷之一；固化剂为双氰胺、苯酚型酚醛树脂、邻甲酚型酚醛树脂、BPA型酚醛树脂或线型双酚A酚醛树脂中的一种或多种的组合；促进剂为2-甲基咪唑、2-苯基咪唑、十一烷基咪唑或2-乙基-4-甲基咪唑中的一种或多种的组合；填料为D50＜3μm的超细氢氧化铝、羟基氧化铝、纳米二氧化硅、高纯氧化镁、滑石粉或硫酸钡中的一种或多种的组合；溶剂为丙酮、丁酮、环己酮或二甲基甲酰胺中的一种或多种的组合；高CTI树脂为氢化双酚A型环氧树脂或聚苯醚树脂中的一种或二者的组合。
本发明高相对漏电起痕指数高耐热FR4覆铜板的制备方法为：按重量份称取里料半固化片的浸胶液和表料半固化片的浸胶液的各组分，分别混合搅拌均匀后制得两种胶液，将两种胶液按含胶量分别涂覆在多张电子级玻璃布上，在150-200℃下烘2-15min，制得里料半固化片和表料半固化片；将所需层数的里料半固化片叠加后置于两张表料半固化片之间，再在最外侧铺覆铜箔，在60-220℃、1.6-8MPa条件下压合120-180min，即得。
本发明的有益效果是：本发明浸胶液采用固化剂与酚醛树脂共同固化环氧树脂，同时加入高CTI树脂，使覆铜板的CTI值达到了600V，在保证板材阻燃性为V0级别的前提下，相比于双氰胺固化环氧树脂体系中低溴树脂的用量，本发明覆铜板的溴含量降至11-13％，较低的溴含量有利于CTI值的提高；本发明所用浸胶液通过调节多种树脂的含量，提高了覆铜板的耐热性，高温下尺寸稳定性高。
具体实施方式
以下结合实例对本发明进行描述，所举实例只用于解释本发明，并非用于限定本发明的范围。
实施例1
一种高相对漏电起痕指数高耐热FR4覆铜板，其两侧均覆有铜箔，最外两个半固化片为表料半固化片，表料半固化片之间设有3层里料半固化片，表料半固化片基材为电子级玻璃布，含胶量为42wt％，流动度为20％，里料半固化片基材为电子级玻璃布，含胶量为54wt％，流动度为18％；里料半固化片的浸胶液包括以下重量份的组分：溴含量为18％的低溴环氧树脂80份、萘酚型双酚A树脂10份、三苯基缩水甘油醚基甲烷20份、双氰胺5份、2-甲基咪唑0.2份、D50＜3μm的超细氢氧化铝10份和丙酮35份；表料半固化片的浸胶液为在里料半固化片浸胶液的基础上增加40重量份的氢化双酚A型环氧树脂。
本实施例覆铜板的制备方法为：按重量份称取里料半固化片的浸胶液和表料半固化片的浸胶液的各组分，分别混合搅拌均匀后制得两种胶液，将两种胶液按含胶量分别涂覆在多张电子级玻璃布上，在150℃下烘15min，制得里料半固化片和表料半固化片；将所需层数的里料半固化片叠加后置于两张表料半固化片之间，再在最外侧铺覆铜箔，在220℃、8MPa条件下压合180min，即得。
实施例2
一种高相对漏电起痕指数高耐热FR4覆铜板，其两侧均覆有铜箔，最外两个半固化片为表料半固化片，表料半固化片之间设有5层里料半固化片，表料半固化片基材为电子级玻璃布，含胶量为45wt％，流动度为19％，里料半固化片基材为电子级玻璃布，含胶量为45wt％，流动度为19％；里料半固化片的浸胶液包括以下重量份的组分：溴含量为55％的高溴环氧树脂55份、双马来酰亚胺树脂20份、四苯缩水甘油醚基乙烷15份、BPA型酚醛树脂3份、2-苯基咪唑2.5份、纳米二氧化硅25份和环己酮25份；表料半固化片的浸胶液为在里料半固化片浸胶液的基础上增加30重量份的聚苯醚树脂。
本实施例覆铜板的制备方法为：按重量份称取里料半固化片的浸胶液和表料半固化片的浸胶液的各组分，分别混合搅拌均匀后制得两种胶液，将两种胶液按含胶量分别涂覆在多张电子级玻璃布上，在180℃下烘10min，制得里料半固化片和表料半固化片；将所需层数的里料半固化片叠加后置于两张表料半固化片之间，再在最外侧铺覆铜箔，在150℃、5MPa条件下压合180min，即得。
实施例3
一种高相对漏电起痕指数高耐热FR4覆铜板，其两侧均覆有铜箔，最外两个半固化片为表料半固化片，表料半固化片之间设有6层里料半固化片，表料半固化片基材为电子级玻璃布，含胶量为54wt％，流动度为18％，里料半固化片基材为电子级玻璃布，含胶量为42wt％，流动度为20％；里料半固化片的浸胶液包括以下重量份的组分：溴含量为60％的高溴环氧树脂30份、氨基苯酚类环氧树脂30份、四苯缩水甘油醚基乙烷5份、双线型双酚A酚醛树脂1份、2-乙基-4-甲基咪唑5份、硫酸钡40份和二甲基甲酰胺35份；表料半固化片的浸胶液为在里料半固化片浸胶液的基础上增加20重量份的聚苯醚树脂。
本实施例覆铜板的制备方法为：按重量份称取里料半固化片的浸胶液和表料半固化片的浸胶液的各组分，分别混合搅拌均匀后制得两种胶液，将两种胶液按含胶量分别涂覆在多张电子级玻璃布上，在200℃下烘2min，制得里料半固化片和表料半固化片；将所需层数的里料半固化片叠加后置于两张表料半固化片之间，再在最外侧铺覆铜箔，在220℃、1.6MPa条件下压合120min，即得。
将实施例1-3所得FR4覆铜板和对比例1现有双氰胺固化体系FR4覆铜板进行检测，结果如表1所示。
表1实施例1-3和对比例1所得FR4覆铜板性能检测
Figure BDA0002500609260000051
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (10)

1.一种高相对漏电起痕指数高耐热FR4覆铜板，所述FR4覆铜板两侧均覆有铜箔，覆有铜箔的最外两个半固化片为表料半固化片，所述表料半固化片之间设有3-6层里料半固化片，其特征在于，
所述表料半固化片基材为电子级玻璃布，含胶量为42-54wt％，流动度为18-20％，所述里料半固化片基材为电子级玻璃布，含胶量为42-54wt％，流动度为18-20％；
所述里料半固化片的浸胶液包括以下重量份的组分：溴化环氧树脂30-80份、高耐热树脂10-30份、多官能团环氧树脂5-20份、固化剂1-5份、促进剂0.2-5份、填料10-40份和溶剂10-35份；
所述表料半固化片的浸胶液为在所述里料半固化片浸胶液的基础上增加20-40重量份的高CTI树脂。
2.根据权利要求1所述的高相对漏电起痕指数高耐热FR4覆铜板，其特征在于，所述溴化环氧树脂为溴含量为18-21％的低溴环氧树脂或溴含量为50-60％的高溴环氧树脂之一。
3.根据权利要求1所述的高相对漏电起痕指数高耐热FR4覆铜板，其特征在于，所述高耐热树脂为萘酚型双酚A树脂、MDI改性酚醛树脂、双马来酰亚胺树脂、聚苯醚树脂、聚酰亚胺树脂或氨基苯酚类环氧树脂中的一种或多种的组合。
4.根据权利要求1所述的高相对漏电起痕指数高耐热FR4覆铜板，其特征在于，所述多官能团环氧树脂为四苯缩水甘油醚基乙烷或三苯基缩水甘油醚基甲烷之一。
5.根据权利要求1所述的高相对漏电起痕指数高耐热FR4覆铜板，其特征在于，所述固化剂为双氰胺、苯酚型酚醛树脂、邻甲酚型酚醛树脂、BPA型酚醛树脂或线型双酚A酚醛树脂中的一种或多种的组合。
6.根据权利要求1所述的高相对漏电起痕指数高耐热FR4覆铜板，其特征在于，所述促进剂为2-甲基咪唑、2-苯基咪唑、十一烷基咪唑或2-乙基-4-甲基咪唑中的一种或多种的组合。
7.根据权利要求1所述的高相对漏电起痕指数高耐热FR4覆铜板，其特征在于，所述填料为D50＜3μm的超细氢氧化铝、羟基氧化铝、纳米二氧化硅、高纯氧化镁、滑石粉或硫酸钡中的一种或多种的组合。
8.根据权利要求1所述的高相对漏电起痕指数高耐热FR4覆铜板，其特征在于，所述溶剂为丙酮、丁酮、环己酮或二甲基甲酰胺中的一种或多种的组合。
9.根据权利要求1所述的高相对漏电起痕指数高耐热FR4覆铜板，其特征在于，所述高CTI树脂为氢化双酚A型环氧树脂或聚苯醚树脂中的一种或二者的组合。
10.一种如权利要求1-9任一项所述的高相对漏电起痕指数高耐热FR4覆铜板的制备方法，其特征在于，步骤为：按重量份称取里料半固化片的浸胶液和表料半固化片的浸胶液的各组分，分别混合搅拌均匀后制得两种胶液，将两种胶液按含胶量分别涂覆在多张电子级玻璃布上，在150-200℃下烘2-15min，制得里料半固化片和表料半固化片；将所需层数的里料半固化片叠加后置于两张表料半固化片之间，再在最外侧铺覆铜箔，在60-220℃、1.6-8MPa条件下压合120-180min，即得。
CN202010431263.3A 2020-05-20 2020-05-20 一种高相对漏电起痕指数高耐热fr4覆铜板及其制备方法 Pending CN111605269A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010431263.3A CN111605269A (zh) 2020-05-20 2020-05-20 一种高相对漏电起痕指数高耐热fr4覆铜板及其制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010431263.3A CN111605269A (zh) 2020-05-20 2020-05-20 一种高相对漏电起痕指数高耐热fr4覆铜板及其制备方法

Publications (1)

Publication Number Publication Date
CN111605269A true CN111605269A (zh) 2020-09-01

Family

ID=72194703

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010431263.3A Pending CN111605269A (zh) 2020-05-20 2020-05-20 一种高相对漏电起痕指数高耐热fr4覆铜板及其制备方法

Country Status (1)

Country Link
CN (1) CN111605269A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112980023A (zh) * 2021-02-19 2021-06-18 建滔覆铜板（深圳）有限公司 覆铜板用低溶剂光固化半固化片制备工艺
CN113844039A (zh) * 2021-09-27 2021-12-28 山东金宝电子股份有限公司 一种新型低介电常数覆铜板胶液的制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103978766A (zh) * 2014-05-27 2014-08-13 铜陵浩荣华科复合基板有限公司 一种高cti值覆铜板制作方式
CN104002524A (zh) * 2014-04-18 2014-08-27 南通诺德电子有限公司 高导热、高耐热、高cti fr-4覆铜板的制作方法
US20170292018A1 (en) * 2014-09-29 2017-10-12 Zhuhai Epoxy Base Electronic Material Co., Ltd. High-cti and halogen-free epoxy resin composition for copper-clad plates and use thereof
CN110317433A (zh) * 2019-07-15 2019-10-11 山东金宝电子股份有限公司 一种半固化片及其制备方法
CN111050469A (zh) * 2019-12-30 2020-04-21 江苏联鑫电子工业有限公司 一种高耐热性高cti无铅覆铜板及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104002524A (zh) * 2014-04-18 2014-08-27 南通诺德电子有限公司 高导热、高耐热、高cti fr-4覆铜板的制作方法
CN103978766A (zh) * 2014-05-27 2014-08-13 铜陵浩荣华科复合基板有限公司 一种高cti值覆铜板制作方式
US20170292018A1 (en) * 2014-09-29 2017-10-12 Zhuhai Epoxy Base Electronic Material Co., Ltd. High-cti and halogen-free epoxy resin composition for copper-clad plates and use thereof
CN110317433A (zh) * 2019-07-15 2019-10-11 山东金宝电子股份有限公司 一种半固化片及其制备方法
CN111050469A (zh) * 2019-12-30 2020-04-21 江苏联鑫电子工业有限公司 一种高耐热性高cti无铅覆铜板及其制备方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
茹敬宏: ""高耐漏电起痕性环氧玻纤基覆铜板的开发"", 《第八届全国绝缘材料与绝缘技术学术交流会论文集》, 31 December 2002 (2002-12-31), pages 119 - 123 *
谢大荣等: "《电工高分子物理》", 30 June 1990, 西安交通大学出版, pages: 188 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112980023A (zh) * 2021-02-19 2021-06-18 建滔覆铜板（深圳）有限公司 覆铜板用低溶剂光固化半固化片制备工艺
CN112980023B (zh) * 2021-02-19 2021-09-14 建滔覆铜板（深圳）有限公司 覆铜板用低溶剂光固化半固化片制备工艺
CN113844039A (zh) * 2021-09-27 2021-12-28 山东金宝电子股份有限公司 一种新型低介电常数覆铜板胶液的制备方法

Similar Documents

Publication Publication Date Title
CN109135193B (zh) 热固性树脂组合物、预浸料、层压板和印制电路板
CN103897346B (zh) 一种热固性树脂组合物
TWI706997B (zh) 無鹵阻燃熱固性樹脂組合物、印刷電路用預浸料及覆金屬層壓板
EP3037475A1 (en) Phenoxy cyclotriphosphazene active ester, halogen-free resin composition and use thereof
CN102850726A (zh) 复合材料、用其制作的高频电路基板及其制作方法
AU2011376206A1 (en) Halogen-free resin composition and method for preparation of copper clad laminate with same
CN109575523B (zh) 一种用于覆铜板的高导热树脂组合物
JP2010254819A (ja) エポキシ樹脂組成物、プリプレグ、積層板、および多層板
CN114605767B (zh) 一种热固性树脂组合物及其应用
CN111793327A (zh) 一种高速高频覆铜板用环氧树脂组合物及其制备方法
CN111605269A (zh) 一种高相对漏电起痕指数高耐热fr4覆铜板及其制备方法
US10081728B2 (en) Resin composition and uses of the same
EP3392286A1 (en) Epoxy resin composition and prepreg, laminated board and printed-circuit board comprising same
CN109265654B (zh) 树脂组合物及其制成的预浸料、层压板
CN108410128B (zh) 一种高速高频印制电路板用树脂组合物、半固化片及层压板
CN110872430A (zh) 一种高cti的树脂组合物、预浸料、层压板和覆金属箔层压板
CN112175354A (zh) 一种耐热性环氧树脂组合物、无铅高Tg覆铜板及其制备方法
CN115181395B (zh) 一种热固性树脂组合物及其应用
CN116604917A (zh) 一种耐caf型fr-4覆铜板的制备方法
CN115028963B (zh) 一种树脂组合物及高Tg、低Dk/Df高频覆铜板的制作方法
EP3156451B1 (en) Halogen-free resin composition, and prepreg and laminated board for printed circuit using same
CN114292492B (zh) 树脂组合物及应用
CN114605779B (zh) 一种热固性树脂组合物及包含其的预浸料、电路基板和印刷电路板
CN111531983B (zh) 一种高耐热低介电覆铜板及其制备方法
CN110452545B (zh) 树脂组合物、印刷电路用预浸片及覆金属层压板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20200901

RJ01 Rejection of invention patent application after publication