CN104869755A - 印制电路板 - Google Patents

印制电路板 Download PDF

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Publication number
CN104869755A
CN104869755A CN201510085137.6A CN201510085137A CN104869755A CN 104869755 A CN104869755 A CN 104869755A CN 201510085137 A CN201510085137 A CN 201510085137A CN 104869755 A CN104869755 A CN 104869755A
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Prior art keywords
pad
mentioned
circuit board
printed circuit
electrode terminal
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CN201510085137.6A
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CN104869755B (zh
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杉本展久
泽田毅
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Fanuc Corp
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Fanuc Corp
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09381Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明提供安装元件的印制电路板,该元件在外周的四边或相对的两边具有电极端子列,其中,与电极端子列对应的焊盘列两端的焊盘相比于之外的焊盘向焊盘排列的方向的外侧延长,且具有将距元件中央最远的角倾斜地切除的形状。

Description

印制电路板
技术领域
本发明涉及安装电子元件的印制电路板。
背景技术
以往,在印制电路板1的焊盘7上安装元件3的情况下,以如下的方式实施。如图6所示,在印制电路板1上,与元件3的电极端子5的形状、寸法、配置等对应地配置有矩形的焊盘7。在该焊盘7上涂敷焊膏,并在其上搭载元件3。然后利用回流焊装置对整体进行加热,焊膏熔化而将元件3的电极端子5与印制电路板1的焊盘7焊接,由此将元件3安装在焊盘7上。在此附图标记2表示安装区域、4表示主体、6表示电路图案。作为相关的文献,有日本特开平7-183650号公报。
在图6所示的现有技术中,存在如下问题,在温度循环时位于各焊盘列两端的焊盘7的焊接部受到较大的应力,在其周围容易产生焊接部断裂所引起的故障。
发明内容
因此本发明的目的在于提供如下印制电路板,能够延长设置于印制电路板的焊盘的焊接部的断裂寿命。
本发明使温度循环时最受应力的焊盘列两端的焊盘具有在焊盘排列的方向上从元件中央向外侧延长的延长部分,上述延长部分具有将距元件中央最远的角倾斜地切除的形状。
而且,本发明的印制电路板是安装元件的印制电路板,该元件在外周的四边或相对的两边具有电极端子列,其中,与上述电极端子列对应的焊盘列的两端的焊盘具有相比于之外的焊盘在焊盘排列的方向上从元件中央向外侧延长的延长部分,上述延长部分具有将距元件中央最远的角倾斜地切除的形状。
上述两端的焊盘也可以做成如下形状,利用使夹着距上述元件中央最远的角的上述两端的焊盘的两边与从元件的角向上述两边延伸的各垂线的交点彼此连结的线,将上述两端的焊盘倾斜地切除。
上述两端的焊盘除在上述焊盘排列的方向上从元件中央向外侧延长之外,还可以具有向与上述焊盘排列的方向成直角的方向的外侧延长的延长部分。
本发明通过具备以上的结构,能够提供如下印制电路板,能够延长设置于印制电路板的焊盘的焊接部的断裂寿命。
附图说明
参照附图对以下实施例的说明将会使本发明的上述以及其它的目的及特征变得明确。其中:
图1是表示在印制电路板的焊盘上载置元件的状态的图。
图2是表示延长图1中最外焊盘的状态的图。
图3是说明延长图2中最外焊盘并且切除角部的状态的图。
图4是表示利用焊料将图2的最外焊盘与电极端子焊接的状态的图。
图5是表示利用焊料将图3的最外焊盘与电极端子焊接的状态的图。
图6是说明现有技术的图。
具体实施方式
图1是表示在印制电路板的焊盘上载置元件的状态的图。在本实施方式中,各焊盘呈矩形。在印制电路板1上设置有用于安装元件3的焊盘7。元件3例如为电子元件,具备多个电极端子5。在元件3的相对的两边上排列有四个电极端子5。此外,在本实施方式中,在元件3的外周的四边或相对的两边上配列有电极端子5。元件3的电极端子5与设置于印制电路板1的焊盘7通过焊接而被电连接并且被固定。
图2是表示延长图1中最外焊盘的状态的图。焊盘7a、7b、7c、7d、7e、7f、7g、7h中,最外焊盘是7a、7d、7e、7h这四个。作为最外焊盘的焊盘7a、焊盘7d、焊盘7e、焊盘7h是与元件3的电极端子5的配列对应的焊盘列的两端的焊盘。
这些焊盘7a、7d、7e、7h相比于之外的焊盘向焊盘排列的方向的外侧方向延长。即,具有在焊盘排列的方向上从该焊盘上的元件中央向外侧延长的延长部分。图2中附图标记8所示的部位为延长部分。
图3是说明延长图2中最外焊盘并且切除角部的状态的图。此外,此处所谓的切除是指将焊盘部分地除去。作为最外焊盘的焊盘7a、焊盘7d、焊盘7e、焊盘7h具有将距元件3的中央9最远的角(顶点)部(参照图2)倾斜地切除的形状。附图标记10为切除部分。两端的焊盘7a、7d、7e、7h的切除线11是使夹着元件的角的两边与从上述角向上述两边延伸的各垂线的交点彼此连结的线。另外,作为最外焊盘的焊盘7a、焊盘7d、焊盘7e、焊盘7h除向焊盘排列的方向12的外侧延长之外,还可以向与焊盘排列的方向成直角的方向13的外侧延长。
图4是表示将图2的最外焊盘与电极端子焊接的状态的图,附图标记14表示焊接圆角。图5是表示将图3的最外焊盘与电极端子焊接的状态的图。使焊盘7向外侧延长,通过增加焊料供给量,能够形成更大的焊接圆角,提高耐温度循环性。另外如图5所示,通过切除角部而防止焊接圆角的多余的基端部,能够增加焊接圆角的厚度,由此提高耐温度循环性。

Claims (3)

1.一种安装元件的印制电路板,该元件在外周的四边或相对的两边具有电极端子列,该印制电路板的特征在于,
与上述电极端子列对应的焊盘列的两端的焊盘具有相比于之外的焊盘在焊盘排列的方向上从元件中央向外侧延长的延长部分,上述延长部分具有将距元件中央最远的角倾斜地切除的形状。
2.根据权利要求1所述的印制电路板,其特征在于,
上述两端的焊盘做成如下形状,利用使夹着元件的角的上述两端的焊盘的两边与从上述角向上述两边延伸的各垂线的交点彼此连结的线,将上述两端的焊盘倾斜地切除。
3.根据权利要求1或2中任一项所述的印制电路板,其特征在于,
上述两端的焊盘除在上述焊盘排列的方向上从元件中央向外侧延长之外,还具有在与上述焊盘排列的方向成直角的方向上向外侧延长的延长部分。
CN201510085137.6A 2014-02-25 2015-02-16 印制电路板 Active CN104869755B (zh)

Applications Claiming Priority (2)

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JP2014-034505 2014-02-25
JP2014034505A JP5908508B2 (ja) 2014-02-25 2014-02-25 プリント基板

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DE (1) DE102015102505B4 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106693162A (zh) * 2017-03-06 2017-05-24 桂林市威诺敦医疗器械有限公司 快速安装电极片装置
CN112616244A (zh) * 2020-12-22 2021-04-06 浙江清华柔性电子技术研究院 柔性电路板及柔性电路板制备方法

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JPH04250305A (ja) * 1991-01-28 1992-09-07 Oki Electric Ind Co Ltd プリント回路板の半田付外観検査制御データ作成装置
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CN101378630A (zh) * 2007-08-28 2009-03-04 富士通株式会社 印刷电路板和电子设备的生产方法
US20100032193A1 (en) * 2008-08-08 2010-02-11 Samsung Electro-Mechanics Co., Ltd. Electrode pad for mounting electronic component and structure for mounting electronic component
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JPH04250305A (ja) * 1991-01-28 1992-09-07 Oki Electric Ind Co Ltd プリント回路板の半田付外観検査制御データ作成装置
US5457878A (en) * 1993-10-12 1995-10-17 Lsi Logic Corporation Method for mounting integrated circuit chips on a mini-board
JP2005223091A (ja) * 2004-02-04 2005-08-18 Sanyo Electric Co Ltd エッチング方法およびそれを用いた回路装置の製造方法
CN1816249A (zh) * 2005-01-31 2006-08-09 株式会社东芝 电路板
CN101102662A (zh) * 2006-07-04 2008-01-09 三星电子株式会社 用于电子元件的表面贴装结构
CN101378630A (zh) * 2007-08-28 2009-03-04 富士通株式会社 印刷电路板和电子设备的生产方法
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CN103137592A (zh) * 2011-12-01 2013-06-05 瑞萨电子株式会社 半导体器件
CN202352659U (zh) * 2011-12-05 2012-07-25 正文电子(苏州)有限公司 一种适合三芯片封装产品的接线框架
CN103545281A (zh) * 2012-07-11 2014-01-29 三菱电机株式会社 半导体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106693162A (zh) * 2017-03-06 2017-05-24 桂林市威诺敦医疗器械有限公司 快速安装电极片装置
CN112616244A (zh) * 2020-12-22 2021-04-06 浙江清华柔性电子技术研究院 柔性电路板及柔性电路板制备方法

Also Published As

Publication number Publication date
JP2015159253A (ja) 2015-09-03
JP5908508B2 (ja) 2016-04-26
US9872388B2 (en) 2018-01-16
DE102015102505A1 (de) 2015-08-27
DE102015102505B4 (de) 2020-01-30
CN104869755B (zh) 2018-08-28
US20150245482A1 (en) 2015-08-27

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